A flexible printed circuit (FPC) board includes a base film, a pair of traces and a chip. The pair of traces are disposed on the base film, and each trace has opposite first and second terminals. The chip is disposed on the base film and has pins that are respectively coupled to the first terminals of the traces. When the FPC board is bonded to a panel through the second terminals of the traces that are shorted to each other, the chip is configured to transmit a detection signal through one of the pins and receive a reception signal through the other of the pins, and to determine whether the FPC board works normally with the panel depending on the reception signal.

The present disclosure provides a display device and a method for manufacturing the same. The display device includes a first substrate, a second substrate and at least one flexible printed circuit. The first substrate is opposite to the second substrate. A first end of the flexible printed circuit is attached onto at least one side of the first substrate, and a second end of the flexible printed circuit is attached onto the second substrate. A slope structure is arranged at an edge of the first substrate at a side thereof where the first end of the flexible printed circuit is attached.

A flexible circuit board including: a body area including a plurality of wirings; a bonding area combined with a first side of the body area; and an extension area combined with a second side of the body area opposite to the first side. The body area includes a first sub-body area and a second sub-body area located on a side of the first sub-body area close to the extension area; the plurality of wirings at least include a first wiring, a second wiring and a third wiring all extend in the first sub-body area, and the first wiring and the second wiring extend in the second sub-body area. The first sub-body area includes a multi-layer board structure, the second sub-body area includes a single-layer board structure or a double-layer board structure, and a thickness of the second sub-body area is smaller than a thickness of the first sub-body area.

The present disclosure provides a display panel and a liquid crystal display device. The display panel includes an array substrate and a flexible thin film. The array substrate has a first surface, a second surface disposed opposite to and in parallel with the first surface, and a first side surface connected to the first surface and the second surface. The first surface of the array substrate is on a same side as a light-emitting surface of the array substrate, and the flexible thin film is disposed on a side of the second surface of the array substrate. The display panel and the liquid crystal display device have narrow frames.

An electronic device includes a first base substrate, a flexible member, and a bending auxiliary structure. The first base substrate includes a first side. The flexible member includes a first end, a second end opposite to the first end, and a main body portion located between the first end and the second end. The first end is connected to the first base substrate at the first side. The bending auxiliary structure is provided at the first side and including at least one curved surface. The main body portion of the flexible member is bent around the at least one curved surface of the bending auxiliary structure, so that the first end and the main body portion or the first end and the second end are at least partially overlapped in a direction perpendicular to the first base substrate.

A display panel and a display device are provided. The display panel includes an array substrate and a color filter substrate. A plurality of drive chips are arranged at intervals and sequentially connected in series in a stepped region of the array substrate. The drive chip includes an input pin and an output pin. The lower frame of the display screen may be reduced, and the screen occupancy ratio of the display screen may be increased by disposing the input pins of the drive chip on one edge of the drive chip, and disposing the flexible circuit board on at least one edge of two edges of the drive chip.

A connection structure configured to connect a display panel and a circuit board, includes a flexible printed circuit, a first chip-on-film, and a second chip-on-film. The first chip-on-film and the second chip-on-film are coupled to one end of the flexible printed circuit. The first chip-on-film and the second chip-on-film are coupled to two surfaces of the flexible printed circuit that are opposite in a thickness direction of the flexible printed circuit.

A display device includes a display panel including a pixel layer displaying an image, and a pad part electrically connected to the pixel layer. The display device includes a flexible circuit film combined with the pad part of the display panel. The flexible circuit film includes a base film, a first conductive line disposed on a first surface of the base film, a first conductive pad extending from the first conductive line and electrically connected to the pad part of the display panel, a cover layer covering the first conductive line and exposing the first conductive pad, and a protrusion pattern disposed on the cover layer, adjacent to the first conductive pad, and facing a side surface of the display panel.

A display panel and a bezel substrate thereof are disclosed. The bezel substrate includes a bending section and a plurality of wirings. Each of the wirings includes a first line section and a second line section, the first line section and the second line section are disposed on the bending section, a width of the first line section to each of the wirings is greater than a width of the second line section of the wirings, and the first line sections of the adjacent wirings are staggered with respect to each other.

An embodiment of the present invention relates to a flexible printed circuit board (FPCB), which is applied to various electronic display devices, and may provide the FPCB, including a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.