A tower system including a column and an electrical power outlet board positioned within the column, the electrical power outlet board having electrical power receptacles positioned on opposite sides of the board, the receptacles being accessible on opposite sides of the column.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

A printed circuit board corner connector designed to connect a first printed circuit board to a second printed circuit board, having a substantially flat contact body, from which a first connection end for connecting to the first printed circuit board extends, wherein two soldering pins for producing a soldered connection to the second printed circuit board protrude from a lateral surface of the contact body, wherein depressions are provided on lateral surface lying opposite lateral surface in positions corresponding to the soldering pins.

A power converter, for a vehicle that is at least partially electrically powered, has a first printed circuit board with DC link capacitors, a circuit breaker group for each alternating current phase, and terminals for alternating current busbars and direct current busbars. A second printed circuit board has a control apparatus for actuating the circuit breaker groups. Also, it has a respective signal pin carrier for the respective circuit breaker group. The signal pin carrier connects the first and the second printed circuit board. Thus, signals between the first and the second printed circuit board can be transmitted via the respective signal pin carrier. The signal pin carrier has six signal pins that are arranged on a plastic carrier.

A semiconductor device, including a substrate having an insulating plate and a conductive plate formed on the insulating plate, a semiconductor chip formed on the conductive plate, a contact part arranged on the conductive plate with a bonding member therebetween, a rod-shaped external connection terminal having a lower end portion thereof fitted into the contact part, and a lid plate having a front surface and a back surface facing the substrate. An insertion hole pierces the lid plate, forming an entrance and exit respectively on the back and front surfaces of the lid plate. The external connection terminal is inserted in the insertion hole. The semiconductor device has at least one of a guide portion with an inclined surface, fixed to a portion of the external connection terminal located in the insertion hole, or an inclined inner wall of the insertion hole.

A semiconductor module includes a housing, a pin arranged in the housing and including a first contact region which has a press-fit connection, a semiconductor component arranged in the housing and electrically conductively connected to the pin, and a first substrate arranged in the housing and clamped in the housing via the pin by a non-positive locking connection, which, when formed, causes the press-fit connection to be deformed elastically and/or plastically with the first substrate. The first substrate has a first recess which is open and at least in part encompasses the pin in the first contact region. A metallic coating is applied to the first substrate at least in a region of the first recess so as to electrically conductively connect the first substrate to the semiconductor component, and a second substrate is in contact with the pin and connected within the housing in a non-releasable manner.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

Current leakage interrupter, having a shell consisting of an upper shell and a lower shell, a PCB inside the shell, a detection device and a trip device mounted to the PCB, power lines electrically connected to the trip device through the detection device, and pins electrically connected to the trip device. The lower shell has pin holes; front ends of the pins extend out of the pin holes. A reverse hook is provided at an inner side of the lower shell at an edge of each pin hole to fix onto a first side of a rear end of a corresponding pin; a second side of the rear end of each pin is extended and bended into a bended portion; a supporting seat is also provided at the inner side of the lower shell at the edge of each pin hole to support the bended portion of the corresponding pin.

3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.

A sensor assembly for a vehicle including a sensor module having a main printed circuit board (PCB). A plurality of auxiliary printed circuit boards (PCBs) are coupled to the main PCB and electrically connected to the main PCB. Each of the plurality of auxiliary PCBs has at least one sensor that is configured to generate a signal. Each of the plurality of auxiliary PCBs are coupled to each other in a defined position relative to each other. A plurality of attachment elements couple the plurality of auxiliary PCBs and the main PCB to at least partially maintain the defined positions of the auxiliary PCBs relative to each other and to electrically connect the plurality of auxiliary PCBs to the main PCB. A retainer abuts the plurality of auxiliary PCBs.