Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wettable surface of a planar substrate; aligning the pin with the solder disposed on the non-wettable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

An electrical connector includes a terminal module having a circuit board having first through eighth conductive traces sequentially arranged in a transverse direction and corresponding first through eighth terminals, the third terminal and the sixth terminal being configured for transmitting a pair of differential signals, the fourth terminal and the fifth terminal being configured for transmitting another pair of differential signals, the first through eighth conductive traces being respectively electrically connected to corresponding first through eighth terminals, each of the third conductive trace and the fifth conductive trace including a coupling portion, a size of the coupling portion in the transverse direction is larger than a size of the other part of the corresponding conductive trace in the transverse direction, wherein the coupling portion of the third conductive trace and the coupling portion of the fifth conductive trace overlap in an up and down direction to increase mutual coupling.

Systems and methods are provided to produce electromechanical interconnections within integrated circuits (ICs), printed circuit boards (PCBs) and between PCBs and other electronic components such as resistors, capacitors and integrated circuits. Elements include so-called “smart pins” or “neuro-pins” that facilitate electrical pathways in the dimension normal to the plane of a PCB. Smart pins or neuro-pins may be inserted using automated processes that do not require the high temperatures normally associated with soldering. Resultant circuits generally contain a large number of layers that are more compact and more readily constructed compared with conventional PCB-based circuitry.

A conductive terminal comprises a pair of abutting plate-shaped body parts having a front side and a rear side opposite to each other in a thickness direction thereof, and a left side and a right side opposite to each other in a width direction thereof. An insertion part extends from one of the two body parts. The terminal further includes a pair of first supporting wings arranged on the front side and the rear side of the body parts and aligned with each other at edges of the left side of the two body parts, respectively, and a pair of second supporting wings arranged on the front side and the rear side of the two body parts and aligned with each other at edges of the right side of the two body parts, respectively.

A two part connector for the temporary connection of an external periphery device to a printed circuit board (PCB). When coding or diagnostics need to be performed on much of todays electronic or electronic controlled equipment, an external unit needs to be physically connected to the microprocessor on the PCB of the equipment. Until now equipment manufacturers either install a socket onto the PCB, or form a mating part of connector directly on the surface of PCB, that is electronically connected to the microprocessor through electrical trace paths. This device eliminates the need for a socket and forms an intermediary element between the external unit and the PCB, that connects to the PCB with a set of vertical pins that matingly connect to a series of cutouts on the PCB. This device connects to a plethora of external devices and takes zero space on the surface of the PCB.

A semiconductor device, including a first board, a second board having a plurality of through holes passing therethrough, and a plurality of external terminals that are respectively press-fitted into the plurality of through holes of the second board, one end portion of each external terminal passing through the corresponding through hole and being fixed to a front surface of the first board. The second board is a printed circuit board that further includes, in a top view thereof, a plurality of support regions, each having one of the plurality of through holes formed therein, and a plurality of buffer regions respectively surrounding the plurality of support regions, each buffer region having at least one buffer hole and at least one torsion portion formed therein, the at least one torsion portion being connected to the support region surrounded by each buffer region.

An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.

A touch display device includes a printed circuit board and a cover. The printed circuit board has a top surface, a bottom surface and soldering points. The printed circuit board includes a first printed circuit, a light element and a second printed circuit. A part of the first printed circuit is on the top surface or the bottom surface and connected with the corresponding soldering point. The light emitting element is on the top surface and electrically connected to the first printed circuit. On the top surface, the second printed circuit does not overlap with the first printed circuit. The cover covers the printed circuit board. The cover has light transmission areas which are aligned with the light elements. The second printed circuit is configured to provide a capacitance value coupled to a capacitive sensing element coupled between the second printed circuit and the cover.

An electrical assembly that includes a substrate having an aperture. A flat conductor is mounted to the substrate and extends over at least a portion of the aperture, with a ring terminal in contact with the flat conductor adjacent to the aperture. A lead wire connects to the ring terminal and is spaced from the substrate, and a fastener extends through the ring terminal and flat conductor, secured in the aperture, and securing the ring terminal against the flat conductor.

A surgical stapling device includes a handle assembly, an adapter assembly, and a reload assembly that is releasably secured to the adapter assembly to facilitate replacement of the reload assembly after each use of the stapling device. The reload assembly includes an authentication chip and printed circuit board assembly that is constructed to provide electrical contacts that are self-supporting to allow for automated assembly of the electrical contacts and provide a more reliable, robust electrical connection between the electrical contacts and the chip.