The present application discloses a semiconductor device with an interface structure and a method for fabricating the interface structure. The interface structure includes an interface board configured to be fixed onto and electrically coupled to a chuck of a testing equipment, and a first object positioned on a first surface of the interface board and electrically coupled to the interface board. The first object is configured to be analyzed by the testing equipment.

A vaporizer device may include a controller and a heater control circuitry. The controller may generate, based at least on a temperature of a heating coil in a cartridge coupled with the vaporizer device, an output signal for controlling a discharge of a battery of the vaporizer device. The battery may be discharged to the heating coil to increase the temperature of the heating coil and cause a vaporization of a vaporizable material contained in the cartridge. The heater control circuitry may determine the temperature of the heating coil. The heater control circuitry may further control, based on the output signal from the controller, the discharge of the battery to the heating coil. The heater control circuitry may be powered by a voltage rail coupled to a voltage regulator configured to regulate an output voltage of the battery.

A wiring substrate includes a resin insulating layer, a conductor pad formed on the resin insulating layer, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post connected to the conductor pad and protruding from the coating insulating layer such that a gap is formed between the metal post and the conductor pad at a peripheral edge of the metal post. The coating insulating layer is formed such that the coating insulating layer has an interposed portion formed in the gap between the metal post and the conductor pad at the peripheral edge of the metal post.

An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

An electronic module includes a module substrate has an upper surface and a lower surface. The module substrate has a package pad array having package contact pads at the upper surface. The module substrate has a socket pad array having socket contact pads at the upper surface. The module substrate has guide pin locating pads associated with the socket pad array. The electronic module has an electronic package coupled to the package contact pads at the package pad array. The electronic module has guide pins surface mounted to the guide pin locating pads. The electronic module has a socket assembly coupled to the module substrate. The socket assembly has a socket housing holding socket contacts. The socket contacts are coupled to the socket contact pads at the socket pad array. The socket frame including pockets receiving the guide pins to locate the socket assembly relative to the module substrate.

An apparatus including an electrical source and a circuit board. The electrical source includes an outer shell including a receptacle, a battery arranged within the outer shell, and at least one electrical connector electrically connected to the battery and extending through the outer shell. The circuit board includes at least one circuit element and a mounting post. When the mounting post of the circuit board is received within the receptacle of the outer shell, the at least one electrical connector of the electrical source is electrically coupled to the at least one circuit element of the circuit board.

Circuit board assembly, Display apparatus, Terminal, and Signal processing system. The circuit board assembly comprises a first circuit board, a second circuit board, a third circuit board, and multiple differential signal lines; the first circuit board comprises a first connector which comprises a first lead group comprising N first leads and a second lead group comprising N second lead; the second circuit board comprises a second connector which comprises a third lead group comprising N third leads and a fourth lead group comprising N fourth leads; multiple i-th leads and multiple (i+2)-th leads are in one-to-one correspondence, and the i-th leads and the corresponding (i+2)-th leads are arranged along a first direction; a first differential line of a j-th differential signal line is connected to the (2j−1)-th i-th lead and the (2j−1)-th (i+2)-th lead, its second differential line is connected to the 2j-th i-th lead and the 2j-th (i+2)-th lead.

Disclosed is a video camera head comprised of at least two rigid printed circuit boards (PCBs) arranged in parallel planes. The at least two PCBs are mechanically supported one above the other by at least two external pins attached to the perimeters of the PCBs. The external pins fit into grooves cut into the edges of the PCBs. Several embodiments of the video camera head are described.

A power semiconductor module has a substrate, load and auxiliary connector elements, and a plastic body, which preferably is a housing or a housing frame and which has a channel. The channel being for the arrangement of a compensating portion of a press-fit contact element. The press-fit contact element has a press-fit portion, a compensating portion and a foot portion, the compensating portion being elastic in a longitudinal direction of the press-fit contact element and having at least two O-shaped sub-portions arranged in succession in the longitudinal direction and having a constriction arranged between two sub-portions.

An interconnect is provided that can comprise a recess formed in a body where the recess comprises an axial end wall and a side wall extending from the axial end wall. The interconnect can also comprise a distributed metallized layer disposed on the axial end wall and the side wall and a conductive compliant (CC) plug disposed within the recess to interface with the metallized layer. The CC plug can be configured to establish an electrical connection between a conductive pad disposed on the recess and a male conductive element inserted into the recess via the metallized layer.