A memory module has pads on the top and bottom surfaces of a module printed circuit board (PCB). The pads match the pin layout of one or more memory devices to be mounted on the memory module. The pads on one surface of the PCB electrically interconnect to the memory device(s), and the pads on the other surface electrically interconnect to pads on a system board, such as a motherboard. With the pad layout on the memory module, the pad layout of the system board can be the same for a memory-down implementation and for a removable memory module. The pad layout provides good signal-to-noise performance and can enable a memory module for low power double data rate (LPDDR) memory, double data rate (DDR) memory, and graphics double data rate (GDDR) memory.

A method can include coupling a semiconductor chip and an electrode with a substrate. Bottom and top mold die can be use, where the top mold die define a first space and a second space that is separated from the first space. The method can include injecting encapsulation material to form an encapsulation member coupled to and covering at least a portion of the substrate. The encapsulation member can include a housing unit housing the electrode. The electrode can have a conductive sidewall exposed to, and not in contact with the encapsulation member, such that there is open space between the conductive sidewall of the electrode and the encapsulation member from an uppermost surface to a bottommost surface of the encapsulation member, the substrate can having a portion exposed within the open space, and the encapsulation member can have an open cross-section perpendicular to an upper surface of the substrate.

A power supplying-side terminal (38) has a power supplying-side hanging portion (38H) extending toward a surface of the circuit board (31), a power supplying-side extending portion (38E) bent from the power supplying-side hanging portion (38H) and extending outwards along the surface of the circuit board (31) and a power supplying-side standing portion (38S) bent from the power supplying-side extending portion (38E) and extending in a direction away from circuit board (31). A power receiving-side terminal (39) has a power receiving-side extending portion (39E) extending outwards along the surface of the circuit board (31) and a power receiving-side standing portion (39S) bent from the power receiving-side extending portion (39E) and extending in the direction away from circuit board (31). The power supplying-side standing portion (38S) and the power receiving-side standing portion (39S) overlap each other, and connected to each other so as to have electrical continuity.

Proposed is an anodic oxide film structure that includes an anodic oxide film sheet and has high strength, chemical resistance and corrosion resistance.

A lead pin includes a shaft portion, a head portion formed on one end of the shaft portion, and having a diameter greater than a diameter of the shaft portion, a tin-based first plated layer exposed at a surface of the head portion visible from the other end of the shaft portion, and a second plated layer exposed at an end surface of the shaft portion visible from the other end of the shaft portion. The second plated layer has a reflectivity with respect to visible light and a conductivity higher than a reflectivity with respect to the visible light and a conductivity of the first plated layer, respectively.

The present invention relates to the field of electronic device accessory technology and in particular to a data cable. The data cable includes a data cable plug and an adapter element which are in rotational connection. The data cable plug includes at least two metal sheets. A space for rotational connection of the adapter element is formed between two of the metal sheets. When the adapter element is rotationally connected in the space, not only can the electrical connection between the adapter element and the data cable plug be guaranteed, but also an angle of the adapter element relative to the data cable plug can be well adjusted. Therefore, use requirements of a user are satisfied. Meanwhile, the situation that a cable body connected to a power supply is bent repeatedly to adversely affect the service life of the data cable will be avoided.

A printed circuit board enclosure employs a box having an open base and opposing side plates. Securing tabs extend laterally from the side plates. The securing tabs have bottom surfaces that are coplanar extensions of a bottom surface of the box and are configured to be attached to the main circuit board. A cover is received on the box. The cover is configured to close the open top of the box. The cover has side flanges extending downwardly from a top plate with mating tabs extending laterally from the side flanges aligned with the securing tabs.

The present invention provides a conversion board for printing circuit board and the packaging structure thereof, which is disposed on a plurality of first joint parts of a board member. A plurality of first package pin members are disposed below a first circuit board. The plurality of first package pin members are connected electrically to the corresponding plurality of first joint parts, respectively. The conversion board is disposed on the first circuit board. The conversion board uses a plurality of second joint parts to connect electrically to the plurality of first package pin members. A plurality of second package pin members are disposed below a second circuit board. The plurality of second package pin members are connected electrically to the corresponding plurality of second joint parts, respectively.

An electronic assembly includes an electronic module and an electric part. The electronic module includes an electrically conductive press-fit terminal. The electrically conductive press-fit terminal has a press-fit section. The electric part has a contact hole. The press-fit section is inserted in the contact hole and plastically deformed therein, such that the press-fit section both mechanically and electrically contacts the electric part in the plastically deformed state. A corresponding method of assembly is also described.

A separation device for a deployable structure is configured to use the pogo-pin to supply power for severing a restraining wire. The separation device may enable the deployable structure to be elastically separated by means of an elastic force exerted thereon by a spring and may enable a deployed state of the structure to be ascertained immediately after deployment.