A shunt resistor module, which includes a shunt resistor having a resistor unit having a predetermined resistance, plate-shaped terminal units respectively configured to extend at both sides of the resistor unit, and a voltage measurement lead pin configured to protrude perpendicular to the terminal unit and having an end portion bent to be parallel to the terminal unit, and a PCB substrate having an assembly guide portion formed to be cut inward by a predetermined depth from an outermost side thereof. The voltage measurement lead pin is fit into the assembly guide portion so that the resistor unit and the terminal unit are placed on a front surface of the PCB substrate and the end portion of the voltage measurement lead pin is caught at a rear surface of the PCB substrate.

A connector to connect an electronic module to an edge of a first electronic circuit board is described. The module has a second electronic circuit board. The connector has a top part that houses a first row of I/Os. The top part is to be placed on a surface of the first electronic circuit board. The connector has a bottom part that houses a second row of I/Os. The bottom part is to be placed on an opposite surface of the first electronic circuit board, wherein, the top and bottom parts form inner and outer stand-offs when mater together. The inner stand-off is to reside within a through hole of the first electronic circuit board. The outer stand-off is to reside within free space off the edge of the first electronic circuit board. The second electronic circuit board is to be pressed in between the first row of I/Os and the second row of I/Os when the module is connected to the connector.

A thermoelectric module assembly for thermally conditioning a component is includes first and second heat spreaders spaced apart from one another and at least one thermoelectric sub-assembly between and in thermal communication with the first and second heat spreaders. The at least one thermoelectric sub-assembly includes a plurality of thermoelectric devices and a printed circuit board having a plurality of electrical conduits. Each of the thermoelectric devices has a first end portion and a second end portion, the second end portion opposite from the first end portion, the first end portion mechanically coupled to the printed circuit board and in electrical communication with the plurality of electrical conduits, and the second end portion spaced from the printed circuit board.

Disclosed herein is an apparatus that comprises a printed circuit board having a first major surface, a second major surface opposite the first major surface, and a minor surface perpendicular to the first major surface and the second major surface. The apparatus also comprises an electronic component that comprises a ball grid array, having spaced apart solder balls, on a mounting surface of the electronic component. The electronic component is mounted to the minor surface of the printed circuit board such that the mounting surface is parallel to the minor surface and perpendicular to the first major surface and the second major surface. The solder balls of the ball grid array are electrically connected to both the first major surface and the second major surface of the printed circuit board.

A circuit board includes a substantially planar component carrier and a microstrip which is applied to a surface of the component carrier. The microstrip extends towards a connection transition which is arranged on a lateral edge of the component carrier. A waveguide portion of an antenna element which is produced by a 3D printing process is coupled to this connection transition.

A power distribution bus bar is provided for distributing power to surface mount connectors. In use, the power distribution bus bar includes a circuit board and at least two add-in card connectors each mounted to a first surface of the circuit board. Additionally, at least one power supply connector distributing a power supply to the add-in card connectors is provided. The at least one power supply connector may be mounted to a second surface of the circuit board and connected to the at least two add-in card connectors.

A lighting memory device and a memory module are provided. A lighting control circuit receives at least one lighting mode selection signal through lighting mode control pins and controls luminous characteristics of a plurality of light sources according to a lighting control mode corresponding to the lighting mode selection signal.

A line card of a set of line cards is configured to be coupled to a set of switch-fabric cards to collectively define at least a portion of an orthogonal cross fabric without a midplane board. The line card has an edge portion, a first side and a second side, opposite the first side. The line card includes a set of first set of connectors and a second set of connectors. The first set of connectors is disposed along the edge portion on the first side of the line card and the second set of connectors is disposed along the edge portion on the second side of the line card.

The present invention provides a display device and a manufacturing method thereof. The display device includes a display panel, a driving chip and a flexible circuit board. The driving chip is electrically connected to the flexible circuit board and the display panel. The display panel includes a display area and a connecting area disposed on one side of the display area. The driving chip and the flexible circuit board are disposed in the connecting area, and the driving chip and the flexible circuit board at least partially overlap. By setting the driving chip and the flexible circuit boards are at least partially overlapped, which can reduce width of frame of the display device, increase screen ratio of the display device, and realize narrow frame display.

A printed circuit board (PCB) device including one or more insulating layers and one or more conducting layers arranged to form a layer stack; and one or more blind holes disposed along a side edge of the layer stack and parallel to a plane of the layer stack. Each of the one or more blind holes along the side edge of the layer stack is configured to receive a pin. Each pin can make an electrical connection with a corresponding blind hole.