A microphone assembly comprising a microphone unit secured to a mounting element. The microphone unit has a first side comprising an audio port, and the mounting element comprises a rigid body having a mounting side. The first side of the microphone unit is arranged at a right angle to the mounting side of the mounting element. The microphone unit may comprise a micro electromechanical systems (MEMS) microphone package holding a MEMS microphone die, and the mounting side of the mounting element may be configured for being mounted or soldered to a printed circuit board. The microphone assembly may be mounted to a device printed circuit board.

A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

A cable connector assembly includes: an electrical connector; a circuit board electrically connected to the electrical connector and including a first row of pads and a second row of pads located behind the first row of pads and separated from the first row of pads; and a cable electrically connected to the circuit board and including plural coaxial wires each including a center conductor and a shielding layer and plural single core wires each comprising a conductor; wherein the center conductors of the coaxial wires are soldered to the first row of pads of the circuit board, and the conductors of the single core wires and the shielding layers of the coaxial wires are soldered to the second row of pads of the circuit board.

Provided is an electrical connection box according to which it is possible to suppress the occurrence of mistakes in a manufacturing process, and it is possible to reliably prevent the occurrence of faulty products. The electrical connection box to be used in a vehicle includes a terminal having an inner-fitting plate portion that is fit into and held in a slit of a holding member; and multiple substrate connection portions that protrude along a surface of the inner-fitting plate portion from one side edge of the inner-fitting plate portion. The terminal has a shape that is asymmetrical in a direction in which the multiple substrate connection portions are arranged side by side.

A printed circuit board (PCB) device including one or more insulating layers and one or more conducting layers arranged to form a layer stack; and one or more blind holes disposed along a side edge of the layer stack and parallel to a plane of the layer stack. Each of the one or more blind holes along the side edge of the layer stack is configured to receive a pin. Each pin can make an electrical connection with a corresponding blind hole.

Power amplifier assemblies and components are disclosed. According to some embodiments, a power amplifier assembly (10) is provided that includes a power amplifier (12) having a gate lead (14), a drain lead (13) and a source contact surface (15). An extended heat slug (11) is mounted against the source contact surface to conduct heat away (18) from the surface and to extend the electrical path of the source. The extended heat slug has at least a length that is greater than the length of the source contact surface.

This application discloses a circuit board and a manufacturing method of the circuit board. The circuit board includes a signal transmission pin pad configured to connect with signal transmission pins of an external same kind connectors to transmit a signal, and fixing pads configured to fix fixing pins of the connectors. A number, location, and size of the fixing pads are matched with a same kind connector. The same kind connector is a connector with a same number of signal transmission pins and a same distance of pins. The number of the fixing pads is greater than or equal to a maximum number of fixing pins of the same kind connector.

An interface apparatus for installing an add-in module to an information handling system includes the add-in module and an add-in module socket. The add-in module includes a card-edge connector on a first edge of the add-in module, and an electrical contact finger on a second edge of the add-in module. The add-in module socket is affixed to the information handling system and receives the add-in module. The add-in module socket includes a card-edge connector interface for receiving the card edge connector, and a slot channel for receiving the second edge of the add-in module. The slot channel includes an electrical contact pad configured such that, when the add-in module is installed into the add-in module socket, a current is provided between the add-in module socket and the add-in module through the electrical contact pad and the electrical contact finger.

A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

A circuit board includes an upper surface, a lower surface, a first end surface connecting the upper surface and lower surface, and a heat dissipation block. The first end surface of the circuit board has an open slot, the open slot extending through the upper surface and lower surface, and the heat dissipation block being arranged inside the open slot. The heat dissipation block has a first surface, the first surface facing away from the lower surface of the circuit board and extending to the first end surface of the circuit board. The inside of the open slot has a stop structure, the stop structure preventing the heat dissipation block from moving toward the first end surface of the circuit board.