A thermoelectric module assembly for thermally conditioning a component is includes first and second heat spreaders spaced apart from one another and at least one thermoelectric sub-assembly between and in thermal communication with the first and second heat spreaders. The at least one thermoelectric sub-assembly includes a plurality of thermoelectric devices and a printed circuit board having a plurality of electrical conduits. Each of the thermoelectric devices has a first end portion and a second end portion, the second end portion opposite from the first end portion, the first end portion mechanically coupled to the printed circuit board and in electrical communication with the plurality of electrical conduits, and the second end portion spaced from the printed circuit board.

The disclosure is related to a light-emitting device for lamp, including a circuit board and a patch LED lamp. The circuit board is provided with an LED driving chip and a plurality of resistor elements. The circuit board is provided with a pad corresponding to the patch LED lamp. The patch LED lamp includes a light-emitting substrate and two connecting legs connecting the light-emitting substrate. The connecting legs are formed in L shape and are respectively connected to two opposite sides of the light-emitting substrate. The connecting legs of the patch LED lamp are soldered on the pad, and an angle between the light-emitting surface of the patch LED lamp and the pad is 90.

An Ethernet transmission line includes two RJ45 connectors and a thin connection line. Each RJ45 connector has a connection terminal group, and the connection terminal group includes a first terminal, a second terminal, a third terminal, a fourth terminal, a fifth terminal, a sixth terminal, a seventh terminal, and an eighth terminal that are sequentially arranged. The thin connection line is connected between the two RJ45 connectors and the thin connection line includes a first flexible printed circuit board layer, a second flexible printed circuit board layer, and a spacing layer. The first flexible printed circuit board layer is provided with two first transmission lines respectively electrically connected to the third terminal and the sixth terminal. The second flexible printed circuit board layer is provided with two second transmission lines respectively electrically connected to the fourth terminal and the fifth terminal.

The present disclosure is generally directed to an optical transceiver module that includes a mounting section for aligning and coupling to associated TOSA modules. In particular, an embodiment of the present disclosure includes TOSA and ROSA components disposed on a printed circuit board assembly (PCBA). The PCBA includes a plurality of grooves at a optical coupling end to provide a TOSA mounting section. Each of the grooves provides at least one mating surface to receive and couple to an associated TOSA module. Opposite the optical coupling end, the PCBA includes an electric coupling section for coupling to, for example, a transmit (RX) circuit that provides one or more electrical signals to drive TOSA modules coupled to the TOSA mounting section.

The present disclosure is generally directed to an optical transceiver module that includes a mounting section for aligning and coupling to associated TOSA modules. In particular, an embodiment of the present disclosure includes TOSA and ROSA components disposed on a printed circuit board assembly (PCBA). The PCBA includes a plurality of grooves at a optical coupling end to provide a TOSA mounting section. Each of the grooves provides at least one mating surface to receive and couple to an associated TOSA module. Opposite the optical coupling end, the PCBA includes an electric coupling section for coupling to, for example, a transmit (RX) circuit that provides one or more electrical signals to drive TOSA modules coupled to the TOSA mounting section.

The present invention provides a display device and a manufacturing method thereof. The display device includes a display panel, a driving chip and a flexible circuit board. The driving chip is electrically connected to the flexible circuit board and the display panel. The display panel includes a display area and a connecting area disposed on one side of the display area. The driving chip and the flexible circuit board are disposed in the connecting area, and the driving chip and the flexible circuit board at least partially overlap. By setting the driving chip and the flexible circuit boards are at least partially overlapped, which can reduce width of frame of the display device, increase screen ratio of the display device, and realize narrow frame display.

A receptacle connector includes: a housing including a base and a mating tongue in front of the base, the mating tongue defining a thickened portion at a root to the base, the mating tongue defining a pair of lateral locking sides; two rows of contacts with contacting section exposing to opposite surfaces of the mating tongue in front of the thickened portion and tail sections extending out of the base; and a metallic shield retained on the base and surrounding the mating tongue to define a mating cavity among the shield and the mating tongue. The shield is formed via a deep drawing process.

Provided is an electrical connection box according to which it is possible to suppress the occurrence of mistakes in a manufacturing process, and it is possible to reliably prevent the occurrence of faulty products. The electrical connection box to be used in a vehicle includes a terminal having an inner-fitting plate portion that is fit into and held in a slit of a holding member; and multiple substrate connection portions that protrude along a surface of the inner-fitting plate portion from one side edge of the inner-fitting plate portion. The terminal has a shape that is asymmetrical in a direction in which the multiple substrate connection portions are arranged side by side.

A circuit board assembly including a circuit board and a connector is provided. The circuit board has a plate body, at least one electrical connecting hole, and at least one pad, wherein the pad and the electrical connecting hole are disposed on the plate body, the electrical connecting hole is located in a range of the pad, and the electrical connecting hole penetrates through the pad. The connector has at least one pin, wherein the connector is assembled to the circuit board, the pin is soldered onto the pad, and the pin covers the electrical connecting hole located in the range of the pad. A storage device is also disclosed.

A semiconductor package module is provided. The semiconductor package module may prevent dropout of a large-scale device from a module substrate by improving bonding strength between the module substrate and a part, and perform assembling parts on a top surface and a bottom surface of the module substrate, simultaneously. The semiconductor package module includes: a module substrate; at least one first electric/electronic device mounted on the module substrate by using surface mount technology (SMT); a plurality of passive devices mounted on the module substrate; and at least one second electric/electronic device mounted on the module substrate by using SMT and a resin film adhesive, the at least one second electric/electronic device having a size or a weight greater than a size or a weight of the at least one first electric/electronic device.