Patent classifications
H05K2201/10446
LIGHT-EMITTING DEVICE FOR LAMP
The disclosure is related to a light-emitting device for lamp, including a circuit board and a patch LED lamp. The circuit board is provided with an LED driving chip and a plurality of resistor elements. The circuit board is provided with a pad corresponding to the patch LED lamp. The patch LED lamp includes a light-emitting substrate and two connecting legs connecting the light-emitting substrate. The connecting legs are formed in L shape and are respectively connected to two opposite sides of the light-emitting substrate. The connecting legs of the patch LED lamp are soldered on the pad, and an angle between the light-emitting surface of the patch LED lamp and the pad is 90.
CONNECTOR END ASSEMBLIES
Embodiments disclosed herein include modular electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first connector module having a notch on a first end and a plurality of surface mount technology (SMT) pads on a second end. In an embodiment, the electronics package further comprises a second connector module having a keyed connector on a first end and a plurality of SMT pads on a second end. In an embodiment, the electronics package further comprises a system in package (SIP) module between the first connector and the second connector, the component module electrically and mechanically coupled to the SMT pads of the first connector and the SMT pads of the second connector.
SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.
Display apparatus
Disclosed is a display apparatus having a liquid crystal panel to display images; a light source to supply light to the liquid crystal panel; and a printed circuit board having a light source embedding unit in which the light source is embedded, and a connector mounting unit at which a connector configured to connect to an outside circuit is mounted. The printed circuit board is bent such that the connector mounting unit may be positioned lower than or offset from the light source embedding unit. The printed circuit board may be bent such that the connector may not be protruded further upward than the height of an upper surface of the light source embedding unit, and thus the thickness of the display apparatus may be improved.
Connecting structure for circuit board and output terminal of power supply
The utility model discloses a the connecting structure for the circuit board and the output terminal of the power supply, comprises a casing, a tail cover, and the circuit board with a control circuit, wherein one end of the casing has an opening, at least part of the circuit board is installed in a cavity of the casing, the output terminal is arranged on the tail cover, and the output terminal at least comprises a conductive pin. The connecting structure further comprises a conductive insertion component, wherein the insertion component is fixed to an output end of the circuit board, and when the tail cover and the open end of the casing are closed, the end of the conductive pin is inserted into the insertion component to allow the circuit board and the output terminal to be electrically connected, which has the advantage of rapid assembly.
Grounding structure for power socket
A grounding structure for power socket includes a grounding main body, which consists of a basic section, a first connecting section, a second connecting section, a grounding section and a contact section. The first and the second connecting section are separately downward extended from two opposite ends of the basic section, such that the basic section and the first and second connecting sections together define a receiving space in between them. The contact section is downward extended from a side edge of the basic section into the receiving space; and the first connecting section is outward bent at its lower end to form the grounding section. And, the grounding section is provided at an outer end with a grounding opening.
PRINTED CIRCUIT BOARD ASSEMBLY FOR EDGE-COUPLING TO AN INTEGRATED CIRCUIT
Systems, methods, and devices for electrically coupling an integrated circuit to a set of coaxial lines via a printed circuit board assembly are described. A device sample holder includes a printed circuit board that is operable to edge-couple to an integrated circuit. A surface of the printed circuit board that carries a set of coaxial connectors is orthogonal to another surface of the printed circuit board that exposes a set of conductive traces. The set of conductive traces are operable to electrically couple to a set of conductive paths of an integrated circuit to provide a communicative path between the integrated circuit and components of an input/output system in a refrigerated environment.
Image pickup unit, wiring board with cable, and manufacturing method of wiring board with cable
An image pickup unit includes: an image pickup device on which an image pickup section is formed; a circuit board having a main surface on which a connection terminal electrically connected with the image pickup section is disposed; an intermediate wiring board including a substrate, an adhesive layer and a wiring pattern, in which a first electrode of the wiring pattern is electrically connected with the connection terminal; a cable having a core wire; and a holding substrate configured to hold the core wire with a second electrode and fixed to the intermediate wiring board by the adhesive layer in a state that the core wire and the second electrode are electrically connected by being in close contact.
Electronic device and manufacturing method thereof
An electronic device and manufacturing method thereof are disclosed. The manufacturing method includes steps of: providing a component board, wherein the component board comprises a substrate and a first conductive wire; providing a connecting board, wherein the connecting board comprises a second conductive wire; disposing an attaching member on the connecting board or a lateral face of the substrate; aligning the second conductive wire of the connecting board toward the lateral face, and attaching the connecting board to the lateral face by the attaching member, wherein the lateral face, the attaching member and the connecting board form a recess; and disposing a conductive member in the recess, wherein the conductive member contacts the first conductive wire and the second conductive wire, and the first conductive wire is electrically connected with the second conductive wire through the conductive member.
CIRCUIT BOARD AND OPTICAL MODULE HAVING SUCH CIRCUIT BOARD
A circuit board includes an upper surface, a lower surface, a first end surface connecting the upper surface and lower surface, and a heat dissipation block. The first end surface of the circuit board has an open slot, the open slot extending through the upper surface and lower surface, and the heat dissipation block being arranged inside the open slot. The heat dissipation block has a first surface, the first surface facing away from the lower surface of the circuit board and extending to the first end surface of the circuit board. The inside of the open slot has a stop structure, the stop structure preventing the heat dissipation block from moving toward the first end surface of the circuit board.