An electrical assembly includes an electrical connector mounted upon a PCB and receiving a CPU therein, and a liquid Nitrogen heat dissipation device is mounted upon the PCB and intimately seated upon the CPU to remove the heat therefrom. The liquid Nitrogen heat dissipation device includes a case forming a chamber to receive the liquid Nitrogen therein. A plurality of fixing arms extend outwardly and radially to fix the liquid Nitrogent heat dissipation device in position. A fixing seat is attached upon the PCB to precisely located the CPU in position with regard to the electrical connector

A voltage regulator module includes a first circuit board assembly, a second circuit board assembly and a magnetic core assembly. The first circuit board assembly includes a first printed circuit board. The second circuit board assembly includes a second printed circuit board, at least one output capacitor, a plurality of ball grid arrays and at least one bonding pad. The second printed circuit board includes a first surface and a second surface. The plurality of ball grid arrays are disposed on the second surface of the second printed circuit board. The at least one bonding pad is arranged beside the first surface of the second printed circuit board. The magnetic core assembly is arranged between the first circuit board assembly and the second circuit board assembly and electrically connected with the at least one bonding pad. The at least one output capacitor is embedded within the second circuit board assembly.

An electronic component (E), including at least one circuit carrier (1), which is populated with a number of mechanical and/or electronic component parts (2 to 4) and has at least one contact opening (1.3) for forming a mechanical and/or electrical contact-connection point (KS) to at least one of the component parts (2 to 4), wherein at least one of the component parts (4) is at a distance from the circuit carrier (1), includes at least one electrically conductive housing (4.1) and at least one electrical contact element (4.2) projecting out of the housing (4.1), the contact element being insulated from the housing (4.1) and being connected at least in a materially bonded manner to the contact opening (1.3) of the circuit carrier (1), wherein at least one seal element (5) is arranged in the region of the contact-connection point (KS), in particular between the circuit carrier (1) and the housing (4) of the component part (4).

Stacked circuit board structures are described. In an embodiment, a plurality of vertical devices serves as electrical interconnections between the first circuit board and the second circuit board. In an embodiment, a plurality of vertical interconnects or pins serve as electrical interconnections between the first circuit board and the second circuit board. The vertical interconnects or pins may be arranged side-by-side with a plurality of vertical or horizontal devices.

The present invention has advantages in that as a USB port unit and a hard disk port unit are formed on the edge of the substrate unit thereby allowing external USB and external disks to be directly connected to the main board, so that it prevents electrical malfunction caused by cable connection, and as the transmission speed of high-speed communication increases through direct connection, it is to provide a main board for POS terminal which may maintain stable system by reducing communication errors.

The present invention provides a device with rear-mounted vacuum tubes, comprising a protective cover with a plurality of heat dissipating holes, a rear panel with a panel opening, and at least one vacuum tube, wherein the vacuum tubes are arranged in a containing space of the protective cover through the panel opening and inserted to a connection circuit board for coupling to a printed circuit board. In addition, the protective cover, the rear panel, and the vacuum tubes are placed in parallel with the printed circuit board, so that heat dissipation for the device is improved and replacement and maintenance of the vacuum tubes are easier. In particular, a vacuum tube audio amplifier apparatus having the device with rear-mounted vacuum tubes as disclosed herein can be stacked.

A light source includes a side-emitting, light emitting diode (LED) that is mounted on a printed circuit board (PCB) or other substrate. The LED is used to illuminate a target such as a sensor or the like. In order to increase the amount of illumination emitted by the LED that reaches the target, a reflector is located on the PCB. The reflector receives light that is emitted by the LED and directed toward the PCB and not the target. This light, which would otherwise be lost, is reflected by the reflector and re-directed toward the target. By reducing the amount of light is lost, the amount of light reaching the target can be increased without a commensurate increase in the current supplied to the LED.

A multi-chip package may include a plurality of semiconductor chips and a printed circuit board (PCB). Each of the semiconductor chips may have an upper surface, a bottom surface, and a plurality of side surfaces. Circuit terminals may be arranged on the upper surface. A plurality of side bonding pads may be arranged on one or more selected side surface among the side surfaces. The semiconductor chips may be mounted on the PCB. The PCB may be configured to surround the selected side surface on which the side bonding pads may be arranged.

An apparatus for containing battery cells includes a containment structure disposed on a printed circuit board for encasing a first battery cell, the first battery cell being electrically coupled to the printed circuit board, the containment structure being a first blast plate structure coupled a first blast tube structure. The apparatus further includes the first blast tube structure partially surrounding the first battery cell, where a bottom surface of a first end of the first blast tube structure is coupled to a top portion of the printed circuit board. The apparatus further includes the first blast plate structure coupled to a top surface of a second end of the first blast tube structure. The apparatus further includes a first thermal interface material at least partially surrounding the first battery cell, where the first thermal interface material is located between the first battery cell and the first blast tube structure.

First, second, and third integrated devices each include one or more interconnecting structure. Each interconnecting structure includes (i) one or more interconnecting nodules extending from an edge surface of the device, (ii) one or more interconnect voids formed in an edge surface of the device, or (iii) both (i) and (ii). The one or more interconnecting structures on each of the first and second device is mated with the one or more interconnecting structures on the second device. The first integrated device includes a signal output, the third integrated device includes a signal input; and the second integrated device includes a conductor for conducting a signal from the signal output to the signal input.