In an embodiment a filter component includes a printed circuit board with an electrical circuit arranged thereon, a bus bar and a clamping plug-in connector, wherein the clamping plug-in connector, arranged on the printed circuit board, is electrically connected to the electrical circuit and is configured for electrically contacting the electrical circuit with the bus bar.

An assembly provides a dual function for mounting a port connector on a circuit board and also secures a capacitor to the circuit board. The assembly includes the circuit board and a monolithic plastic frame having a flange, a snap structure, a capacitor cradle, and a socket section. The flange has a fastening structure for fastening the frame to the circuit board. The snap structure for a snap-in attachment of the port connector to the frame is arranged near an end edge of the circuit board. The capacitor cradle for holding a cylindrical capacitor is formed adjacent to the snap structure and is elevated from the circuit board by an air gap. The socket section bears socket contacts for receiving capacitor contact leads.

A circuit board includes: a first insulating layer having first and second surfaces opposing each other, and having a cavity recessed from the first surface; a first heat dissipation pattern disposed on the second surface of the first insulating layer; and a heat dissipation part connected to the first heat dissipation pattern, and protruding into the cavity by penetrating through the first insulating layer.

A mounting assembly and a circuit board assembly. The mounting assembly configured to mount a short or long expansion card on the circuit board. The mounting assembly includes a fixed plate and a rotatable plate. The rotatable plate includes a body part, a pivot part and a fastening part. The pivot part is rotatably disposed on the fixed plate. The fastening part has a fastening hole. A pivot axis of the pivot part is spaced apart from a central axis of the fastening hole. When the fastening hole is at the first mounting position, the fastening hole is located closer to the connector than the pivot part to fix the short expansion card. When the fastening hole is at the second mounting position, the fastening hole is located farther away from the connector than the pivot part to fix the long expansion card.

A printed circuit board includes a plurality of dielectric layers, a plurality of conductive pattern layers, a first through hole, a second through hole, and an inner layer via. The inner layer via penetrates through each dielectric layer from an Mth dielectric layer to the (N-1)th dielectric layer, where M is an integer that is greater than equal to two and less than or equal to (N-1) and has an inner circumferential surface on which an inner layer via conductor is disposed. At least a portion of the inner layer via is disposed in an inner via arrangement region. At least one of the first through hole and the second through hole is connected to the inner layer via with at least one conductive pattern layer that is selected from a second conductive pattern layer to an Nth conductive pattern layer in the plurality of conductive pattern layers.

A circuit board may include an insulating layer having a first insulating layer part, a second insulating layer part stacked on the first insulating layer part, and a cavity penetrating a portion of the second insulating layer part and the first insulating layer part, a circuit layer at least partially buried in the second insulating layer part; and a metal pattern layer disposed along the edge of the cavity in the second insulating layer part. The insulating layer has a first surface configuring a bottom surface of the cavity and a second surface configuring a side surface of the cavity, and the metal pattern layer comprises a plurality of metal layers exposed from the insulating layer on the second surface and including different metal.

A heat dissipation module is adapted to be installed on a motherboard having a connector. The connector is adapted to connect an interface card. The heat dissipation module includes a base assembly adapted to be fixed on the motherboard, a heat dissipation member, and a fastening member. The base assembly is an integrated base body having opposite first and second ends. The first end is adjacent to the connector and has a fixing portion. The second end has a fastening portion. The interface card is adapted to be installed between the first end and the second end. The heat dissipation member has opposite third and fourth ends. The third end is adapted to be detachably connected to the fixing portion. The fastening member is pivoted on the fourth end and adapted to be detachably connected to the fastening portion.

A wiring board includes a first insulation layer comprising first and second surfaces; a second insulation layer located at an outermost layer on the first surface; a third insulation layer located at an outermost layer on the second surface; a first mounting region located on an outermost surface on the first surface; a second mounting region located on the outermost surface on the first surface and surrounding the first mounting region; a plane conductor located on the third insulation layer; and a solder resist covering the third insulation layer and the plane conductor and having an opening that exposes part of the plane conductor. In plane perspective, in a frame-shaped region between outer peripheral edges of the first and second mounting regions, the plane conductor comprises clearances at point-symmetric positions taking a center of the opening as a point of symmetry.