According to one embodiment, an electronic device comprises a circuit board, an electrical component, and a measurement unit. The circuit board has a first face. The electrical component includes a second face electrically connected to the first face via a bonding material, a first end in a first direction along the second face, and a second end. The second end is opposite to the first end in the first direction. The measurement unit is configured to measure a characteristic changing depending on a conductivity of the bonding material. A first distance between the first face and the first end is shorter than a second distance between the first face and the second end. The measurement unit includes a first measurement unit configured to measure the characteristic of a part of the bonding material. The part is adjacent to the first end.

Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

A system and method for placing an inductor on a circuit board. This method includes providing a circuit board, a pedestal, and an inductor, the pedestal has a top surface and a bottom surface and the circuit board has one or more electrical conductors, the inductor having a first inductor terminal and a second inductor terminal. Adhesive is placed on the circuit board and the bottom surface of the pedestal is placed on the adhesive located on the circuit board to secure the pedestal to the circuit board. Next, adhesive is placed on the top surface of the pedestal and the inductor is placed on the adhesive located on the top surface of the pedestal to secure the inductor to the pedestal. The inductor is electrically connected to the circuit board.

Embodiments of the present invention are directed to an integrated circuit (IC) package assembly. The IC package assembly includes a base printed circuit board (PCB), and a set of IC packages. Each of the IC packages includes at least one IC chip, mounted on or partly in a support component, which mechanically supports and electrically connects to the IC chip. In addition, each of the IC packages is laterally soldered to the base PCB (e.g., a motherboard PCB) and arranged transversally to the base PCB and forms an angle therewith. As a result, a slanted stack of IC packages is obtained, wherein the IC packages are essentially parallel to each other. Further embodiments are directed to related devices, including the above assembly, and to related fabrication methods.

A system and method for placing an inductor on a circuit board. This method includes providing a circuit board, a pedestal, and an inductor, the pedestal has a top surface and a bottom surface and the circuit board has one or more electrical conductors, the inductor having a first inductor terminal and a second inductor terminal. Adhesive is placed on the circuit board and the bottom surface of the pedestal is placed on the adhesive located on the circuit board to secure the pedestal to the circuit board. Next, adhesive is placed on the top surface of the pedestal and the inductor is placed on the adhesive located on the top surface of the pedestal to secure the inductor to the pedestal. The inductor is electrically connected to the circuit board.

An underlying recess is provided for component placement beneath Ball Grid Arrays allowing closer proximity for decoupling capacitors and other components. The underlying recess placement of components assists in minimizing reliability issues concerning surface mount components and provides closer proximity placement of components. The underlying recess placement of components is particularly useful for overcoming the problem of parasitic inductance of more distant component placements known in the art.

A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.

A mounting substrate includes a through-hole 13 formed in a substrate 10, a first land part 21, a second land part 31, a first component attaching part 22, a second component attaching part 32, a conductive layer 14, and a filling member 15 filled into a part of the through-hole 13. A shortest distance allowable value L.sub.0 from the center of the first land part 21 to a component 51 is determined on the basis of the volume V.sub.h of a part of the through-hole 15 positioned above a top surface of the filling member 15 on the side of the first land part 21, the length L.sub.1 of the component 51 to be mounted to the first component attaching part 22, and the maximum allowable value of the inclination of the component 51 to be mounted to the first component attaching part 22 relative to the first surface 11 of the substrate 10.

The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.

The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.