A display device includes a display panel and a circuit board. The display panel includes a display region and a bonding region. A plurality of pixels is disposed in the display region. The bonding region is spaced apart from the display region in a first direction. A plurality of pad electrodes is disposed in the bonding region. The circuit board is disposed on the display panel. The circuit board includes a first portion overlapping the display panel between the display region and the bonding region in a plan view. Accordingly, a dead space of the display device may be reduced, and a region in which a battery or the like is disposed in the display device may be secured by reducing an area in which the circuit board is disposed after the display panel is bent.

An electronic component includes a first electronic component and a second electronic component that is stacked on the first electronic component. A second electrode layer of the first electronic component includes a plurality of divided electrode layers, and a pair of electrodes of the second electronic component are electrically connected to different electrode layers included in the plurality of electrode layers of the second electrode layer, and a first electrode layer of the first electronic component is divided into a plurality of electrode layers to correspond to the electrode layers which are included in the second electrode layer and which are electrically connected to the pair of electrodes of the second electronic component.

A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes disposed to face each other with at least one among the plurality of dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part. The inductor and the capacitor are coupled to each other by an adhesive containing a first epoxy resin including a urethane modified epoxy (UME) resin, a second epoxy resin including a bisphenol A type resin, and a latent curing agent.

A pet chest strap with a mount includes a chest strap body and a hardware holder fixed and locked to the chest strap body. The hardware holder has a locking assembly and a connecting terminal child-and-mother seat; the chest strap body includes a flexible printed circuit component with plural LED luminous bodies attached onto the flexible printed circuit component and packaged with a resin; the LED luminous bodies are connected to the connecting terminal child-and-mother seat of the hardware holder through the flexible printed circuit component. The invention has the features of powerful function, simple structure, and reasonable design and uses a hardware holder to achieve the effect of combining different hardware components to improve the environmental adaptability of the product, so as to meet the using requirements for different occasions and environments.

A high-current connector and a high-current connection device, the high-current connection device comprises a circuit board and at least one group of (two) high-current connectors. Each high-current connector comprises a conductive mating member and a conductive combined shunt. The conductive mating member has a main body and an alignment soldering leg, the main body is formed as a columnar body and has a bottom surface and a top surface, the alignment soldering leg integrally extends from the bottom surface and protrudes from the bottom surface. The conductive combined shunt has a base portion combined with the main body and a plurality of shunt pins extending from at least two opposite sides of the base portion, and the plurality of shunt pins are positioned on both sides of the alignment soldering leg. The alignment soldering leg of the high-current connector is inserted into and electrically connected to the middle conductive holes of the circuit board, and the shunt pins of the high-current connector are respectively inserted into and electrically connected to the first conductive holes of the circuit board.

A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.

An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.

A key module includes a circuit assembly, a support assembly and a display assembly. The support assembly is movably disposed on the circuit assembly. The display assembly includes a digital display unit. The digital display unit is supported on the circuit assembly by the support assembly, and the digital display unit is electrically connected to the circuit assembly.

A method for manufacturing a capacitor built-in substrate includes: preparing a capacitor built-in core insulating film and laminating a respective buildup layer to each of opposed main surfaces of the capacitor built-in core insulating film. The capacitor built-in core insulating film includes a first and second metal layers, an insulating layer and a capacitor. The first and second metal layers are disposed so as to face each other with the insulating layer interposed therebetween. The capacitor is disposed so as to extend through the insulating layer with one capacitor electrode being electrically connected to the first metal layer and the other capacitor electrode being electrically connected to the second metal layer.

This disclosure generally relates to processor systems comprising printed circuit boards, I/O chips and processor chips with mated contacts. Contacts are formed on an upper surface of a printed circuit board having a through-hole and on a processor chip inside the through-hole. The processor chip may be a superconducting quantum processor chip comprising qubits, couplers, Digital to Analog converters, QFP shift registers and analog lines. Contacts are formed on an upper surface on an I/O chip and mated with the contacts on the printed circuit board and the processor chip. Contacts may be Indium bump bonds or superconducting solder bonds. The processor chip and the I/O chip may include a shield layer, a substrate layer and a thermally conductive layer.