According to examples, a memory module with module rows of conductive contacts can enable multiple memory channels to be connected to the same memory module. In one example, a memory module includes a printed circuit board (PCB) having a first face, a second face, and an edge to be received by a connector. The memory module includes a plurality of memory chips on at least one of the first and second faces of the PCB. The memory module includes two or more rows of conductive contacts on each of the first and second faces of the PCB, the two rows including a first row of conductive contacts proximate to the edge of the PCB to be received by the connector, and a second row of conductive contacts between the first row and a second edge of the PCB opposite to the first edge.

According to one embodiment, a semiconductor device includes receiving terminals on a surface of a substrate to receive first signals and transmitting terminals on the surface of the substrate to transmit second signals. The transmitting terminals are symmetrically positioned on the surface of the substrate with respect to the receiving terminals at a substantially 90 degree rotation about a rotation center position. The ordering of the transmitting terminals along the surface of the substrate from the rotation center position matches the ordering of the receiving terminals along the surface of the substrate from the rotation center position.

A high-resolution substrate having an area of at least 100 square centimeters and selected traces having a line/space dimension of 2 micrometers or less is employed to integrate multiple independently operable clusters of flip chip mounted components, thereby creating a circuit assembly. Each independently operable cluster of components preferably includes a power distribution chip, a test/monitor chip, and at least one redundant chip for each type of logic device and for each type of memory device. The components in at least one of the independently operable clusters of components may include the components provided in a commercially available chiplet assembly. An electronic system may comprise multiple substrates comprising independently operable clusters of components, plus a motherboard, a system controller, and a system input/output connector.

A mouth guard senses impact forces and determines if the forces exceed an impact threshold. If so, the mouth guard notifies the user of the risk for injury by haptic feedback, vibratory feedback, and/or audible feedback. The mouth guard system may also remotely communicate the status of risk and the potential injury. The mouth guard uses a local memory device to store impact thresholds based on personal biometric information obtained from the user and compares the sensed forces relative to those threshold values. The mouth guard and its electrical components on the printed circuit board are custom manufactured for the user such that the mouth guard provides a comfortable and reliable fit, while ensuring exceptional performance.

An integrated circuit package may be formed having a heat transfer fluid chamber, wherein the heat transfer fluid chamber may be positioned to allow a heat transfer fluid to directly contact an integrated circuit device within the integrated circuit package. In one embodiment, a first surface of the integrated circuit device may be electrically attached to a first substrate. The first substrate may then may be electrically attached to a second substrate, such that the integrated circuit device is between the first substrate and the second substrate. The second substrate may include a cavity, wherein the heat transfer fluid chamber may be formed between a second surface of the integrated circuit device and the cavity of the second substrate. Thus, at least a portion of a second surface of the integrated circuit device is exposed to the heat transfer fluid which flows into the heat transfer fluid chamber.

A tower system including a column and an electrical power outlet board positioned within the column, the electrical power outlet board having electrical power receptacles positioned on opposite sides of the board, the receptacles being accessible on opposite sides of the column.

A switched capacitor converter package includes a semiconductor package on a first side of an electrical routing apparatus, a first capacitor and a second capacitor on a second side of the electrical routing apparatus, wherein the first capacitor and the second capacitor are adjacent to each other and connected in parallel, and a third capacitor and a fourth capacitor connected on the second side of the electrical routing apparatus, wherein the third capacitor and the fourth capacitor are adjacent to each other and connected in parallel.

An electronic module is provided including power switches mounted on a circuit board and configured as an inverter circuit for an electric motor. A sliding member is coupled to an actuator. A power contact switch is provided including a first conductive body, a second conductive body, and a contact switch. The first and second conductive bodies are mounted on a first surface of the circuit board and include pins received through through-holes of the circuit board to make electrical contact with two conductive tracks on a second surface of the circuit board. The contact switch pivotably is secured to the first conductive body and pivotably moveable by the sliding member to make contact with the second conductive body with movement of the actuator. A flyback diode is electrically connected between the first and second conductive track on the second surface of the circuit board parallel to the power contact switch.

A circuit board device includes a fixing member and a circuit board having a first hole. The fixing member includes abase having a second positioning portion and an opening, a first fixing component and a pillar structure having a first pillar body and a positioning pillar extending downward from the first pillar body and having a first positioning portion and a clamping portion. The clamping portion clamps the circuit board with the first pillar body when the first positioning portion is engaged with the first hole. The base is disposed in the first hole and abuts against the positioning pillar when the second positioning portion hooks the first hole and the opening is engaged with the positioning pillar. The first fixing component is detachably inserted into the pillar structure for clamping a first interface card with the first pillar body.

A battery module includes a lower housing and a plurality of battery cells. The plurality of battery cells are electrically coupled together to produce a voltage. The module also includes an assembly disposed over the battery cells and coupled to the lower housing. The assembly may include a lid and a plurality of bus bar interconnects mounted on the lid. The module also includes a printed circuit board (PCB) assembly disposed on and coupled to the assembly. The PCB assembly may include a PCB. The module also includes a cover disposed over and coupled to the lower housing to hermetically seal the battery module. Also disclosed is a method of manufacturing the battery module.