In an embodiment, with a capacitor mounting structure 200, series-connected first multilayer capacitor 211 and second multilayer capacitor 212 are placed in such a way that signals flow through them in the opposite directions, respectively. In addition, the series-connected first multilayer capacitor 211 and second multilayer capacitor 212 are placed in such a way that their respective internal electrode layers 211c, 212c face each other. The capacitor mounting structure can prevent the overall ESL value from increasing even when multilayer capacitors are connected in series.

Disclosed is a waterproof LED light string that provides outdoor lighting in a simple and reliable manner. Waterproof bulb assemblies are used with replaceable LED light sources. The bulb assemblies are easily suspended from a rope or wire, screwed to a support, or magnetically supported from a ferrous metal support. Duplicate circuitry in the LED light source allows the LED light source to be connected in either direction.

A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

An electronic control unit includes a substrate, an electronic component, a heat sink, a cover, a heat accumulator, and a screw. A wiring pattern is formed on the substrate. The electronic component is mounted on the substrate and generates heat upon energization thereof. The heat sink is provided on one side of the substrate in its thickness direction. The cover is made of resin and is provided on the other side of the substrate in its thickness direction. The heat accumulator is fixed to a part of the cover on the substrate-side and is in contact with a surface of the substrate on the cover-side. One end of the screw is connected to the heat sink. A central portion of the screw is inserted through a hole passing through the substrate in its thickness direction. The other end of the screw is connected to the heat accumulator.

A semiconductor chip module includes a PCB including first and second faces; a buffer on the first face; a first chip on the first face, and including a first connection terminal and a second connection terminal, a first signal being provided to the first connection terminal, and a second signal being provided to the second connection terminal; a second chip on the second face, and including a third connection terminal to which the first signal is provided, and a fourth connection terminal to which the second signal is provided. The first connection terminal and the third connection terminal may receive the first signal from the buffer at the same time. The first connection terminal may be closer to the buffer as compared with the second connection terminal. The third connection terminal may be closer to the buffer as compared with the fourth connection terminal.

The present subject matter relates to a battery module for use in a vehicle. The battery module may include a housing, a plurality of battery cells disposed within the housing, and solid state pre-charge control circuitry that pre-charges a direct current (DC) bus that may be coupled between the battery module and an electronic component of the vehicle. Furthermore, the solid state pre-charge control circuitry may include solid state electronic components as well as passive electronic components.

An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.

The present disclosure describes proximity sensor modules that include a time-of-flight (TOF) sensor. The module can include a plurality of chambers corresponding, respectively, to a light emission channel and a light detection channel. The channels can be optically separated from one another such that light from a light emitter element in the light emission chamber does not impinge directly on light sensitive elements of the TOF sensor in the light detection chamber. To achieve a module with a relatively small footprint, some parts of the TOF sensor can be located within the light emission chamber.

An electronic component is described which includes a first transistor encased in a first package, the first transistor being mounted over a first conductive portion of the first package, and a second transistor encased in a second package, the second transistor being mounted over a second conductive portion of the second package. The component further includes a substrate comprising an insulating layer between a first metal layer and a second metal layer. The first package is on one side of the substrate with the first conductive portion being electrically connected to the first metal layer, and the second package is on another side of the substrate with the second conductive portion being electrically connected to the second metal layer. The first package is opposite the second package, with at least 50% of a first area of the first conductive portion being opposite a second area of the second conductive portion.

Provided is a driver board capable of miniaturizing itself while ensuring insulation voltage resistance performance. In the driver board: a transformer 114 is configured, so as to cross a first insulating region 120a, such that a primary side terminal 114a is connected to a primary side circuit 112a and a secondary side terminal 114b is connected to a secondary side circuit 113a; a power supply control IC 115 is configured, so as to cross a insulating region 120b, such that a primary side terminal 115a is connected to a primary side circuit 112b and a secondary side terminal 115b is connected to a secondary side circuit 113b; and the insulating region 120a and the insulating region 120b are formed so as to at least partially face each other via an insulating board 111 such that the primary side circuit 112a and the secondary side circuit 113b do not face each other via the insulating board and the primary side circuit 112b and the secondary side circuit 113a do not face each other via the insulating board.