Disclosed herein is a surface-mount electronic component that includes a main body part having a mounting surface, a first terminal electrode provided on one end side of the mounting surface in a long side direction thereof, and a second terminal electrode provided on other end side of the mounting surface in the long side direction thereof. Each of the first and second terminal electrode includes a main area extending in a short side direction of the mounting surface and a protruding part provided at a center portion in the short side direction so as to protrude from the main area to an end portion of the mounting surface in the long side direction.

A connection structure including: a first circuit member having a plurality of first electrodes; a second circuit member having a plurality of second electrodes; and an intermediate layer having a plurality of bonding portions electrically connecting the first electrodes and the second electrodes, in which at least one of the first electrode and the second electrode that are connected by the bonding portion is a gold electrode, and 90% or more of the plurality of bonding portions include a first region containing a tin-gold alloy and connecting the first electrode and the second electrode and a second region containing bismuth and being in contact with the first region.

A board design assistance device includes a design data acquirer to acquire design data for a printed circuit board, a first determiner to determine, based on the design data for the printed circuit board, whether a lengthwise direction of board fiber in the printed circuit board is perpendicular to a longitudinal direction of an electronic component mounted on the printed circuit board, a second determiner to determine, based on the design data for the printed circuit board, whether a wire is routed crosswise from a pad receiving the electronic component mounted on the printed circuit board, and a notifier to provide a notification including error information specifying an electronic component determined to have a longitudinal direction not perpendicular to the lengthwise direction of the board fiber and determined to be connected to a pad from which a wire is not routed crosswise.

A multi-layer ceramic electronic component includes: a ceramic body that includes internal electrodes laminated in a first direction, and a pair of main surfaces including a center region facing in the first direction; and a pair of external electrodes connected to the internal electrodes and facing each other in a second direction orthogonal to the first direction, a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first direction and the second direction, the center region being formed at a center portion of at least one of the pair of main surfaces in the second direction.

An object of the present invention is to provide a technique capable of suppressing displacement of an electronic component and a solder ball without using a jig. A semiconductor device includes an insulating substrate, an electronic component, and solder. A metal pattern and a semiconductor element are disposed on the insulating substrate. The metal pattern has a first recess and a second recess that are provided side by side. A part of the electronic component is disposed in the first recess. The solder connects the metal pattern disposed on the insulating substrate and the electronic component.

A method for printed circuit board design rework utilizing two components in series, the method includes selecting a first chip component and a second chip component for placement on an original land location previously occupied by an original chip component. The method further includes placing the first chip component and the second chip component on a chip component support structure. The method further includes soldering a first end of the first chip component to a first end of the second chip component. Responsive to transferring the first chip component and the second chip component to the original land location, the method further includes soldering a second end of the first chip component to a first land of the original land location. The method further includes soldering a second end of the second chip component to a second land of the original land location.

A method of connecting an electronic component on a mounting substrate where the electronic component is arranged with a first surface of the electronic component facing the mounting substrate and an opposite surface of the electronic component is facing away from the mounting substrate. A first component-side conductor on the second surface of the electronic component is electrically connected to a first substrate-side conductor on the mounting substrate by an electrically-conductive adhesive.

A semiconductor package includes a redistribution substrate having a first surface and a second surface which are opposite to each other, a semiconductor chip mounted on the first surface of the redistribution substrate, an under bump interconnection layer on the second surface of the redistribution substrate, an electronic device mounted on the under bump interconnection layer, and a solder bump disposed on the under bump interconnection layer and horizontally spaced apart from the electronic device. The under bump interconnection layer includes conductive patterns respectively connected to the electronic device and the solder bump, and a passivation layer covering the conductive patterns. The passivation layer includes a plurality of trenches disposed between the electronic device and the solder bump.

A power module comprises a first circuit board assembly and a magnetic core assembly. The first circuit board assembly comprises a first printed circuit board and at least two switch circuits disposed on the first printed circuit board. The magnetic core assembly is disposed near the first printed circuit board and comprises a magnetic core portion and at least one pair of first electrical conductors. The magnetic core portion comprises at least one core unit, the core unit comprises a pair of holes and a second magnetic overlapping region, and the pair of holes are separated by the second magnetic overlapping region. Each pair of the first electrical conductors is penetrated through the corresponding pair of holes of the magnetic core portion to define two output inductors. Each of the switch circuits is electrically connected with the corresponding output inductor to define a phase circuit of the power module.

In an exemplary embodiment, a passive component, which is a surface mounting component, includes: a substrate body having insulating property; an internal conductor built into the substrate body; and at least one external electrode provided on a planar mounting face of the substrate body and electrically connected to the internal conductor; wherein the external electrode has a face parallel with the planar mounting face of the substrate body, and a concaved part which is inwardly concaved relative to the parallel face toward the substrate body and is located, as viewed in a direction perpendicular to the parallel face, inside the parallel surface so as to be surrounded by the parallel surface.