Encapsulated PCB assembly (1) for electrical connection to a high- or medium-voltage power conductor in a power distribution network of a national grid, comprising a) a PCB (10), delimited by a peripheral edge (20) and comprising a high-tension pad (60, 62) on a voltage of at least one kilovolt, b) an electrically insulating encapsulation body (70) in surface contact with, and enveloping, the high-tension pad and at least a portion of the PCB edge adjacent to the high-tension pad, c) a shielding layer (80) on an external surface (90) of the encapsulation body and for being held on electrical ground or on a low voltage to shield at least a low-voltage portion of the PCB. The high-tension pad extends to the peripheral edge of the PCB.

A printed circuit board includes a first chip component, a second chip component, and a printed wiring board. The first chip component and the second chip component each has a length L2 in the longitudinal direction. A relationship of 0.894≤L2/L1≤1.120 is satisfied, where L1 represents a length of the first opening in the longitudinal direction. A relationship of 0.894≤L2/L4≤1.120 is satisfied, where length L4 represents a length of the second opening in the longitudinal direction. A relationship of 0.183≤L.sub.OA/L.sub.iA≤50.309 is satisfied, where L.sub.iA represents a length of the first land in the longitudinal direction, and L.sub.OA represents a thickness of solder on an end surface of the first electrode. A relationship of 0.183≤L.sub.OB/L.sub.iB≤0.309 is satisfied, where L.sub.iB represents a length of the second land in the longitudinal direction, and L.sub.OB represents a thickness of solder on an end surface of the second electrode.

A semiconductor storage device includes: a printed circuit board; a nonvolatile memory disposed on the printed circuit board; a memory controller disposed on the printed circuit board and configured to operatively control the nonvolatile memory; a capacitor disposed on the printed circuit board and configured to supply power to the nonvolatile memory and the memory controller; and at least one holder that holds the capacitor at an end portion of the printed circuit board. The holder includes a connecting portion connected to the end portion of the printed circuit board, and a pair of arm portions extending from the connecting portion toward an outside of the printed circuit board and configured to sandwich a body portion of the capacitor from both sides in a thickness direction of the printed circuit board.

A printed circuit board includes a first chip component, a second chip component, and a printed wiring board. The first chip component and the second chip component each has a length L2 in the longitudinal direction. A relationship of 0.894≤L2/L1≤1.120 is satisfied, where L1 represents a length of the first opening in the longitudinal direction. A relationship of 0.894≤L2/L4≤1.120 is satisfied, where length L4 represents a length of the second opening in the longitudinal direction. A relationship of 0.183≤L.sub.OA/L.sub.iA≤0.309 is satisfied, where L.sub.iA represents a length of the first land in the longitudinal direction, and L.sub.OA represents a thickness of solder on an end surface of the first electrode. A relationship of 0.183≤L.sub.OB/L.sub.iB≤0.309 is satisfied, where L.sub.iB represents a length of the second land in the longitudinal direction, and L.sub.OB represents a thickness of solder on an end surface of the second electrode.

Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

An electronic component comprising a body and at least one terminal for soldering the body to a carrier is provided, with the terminal comprising: an electrode arranged on a surface of the body; an outgassing layer formed on and/or surrounded by the electrode, wherein the outgassing layer is configured to outgas when being heated; and an electrically conductive cover layer formed on the outgassing layer, wherein the cover layer is electrically connected to the electrode and seals the outgassing layer in a gastight manner between the cover layer and the electrode.

A mounting structure for mounting an electrolytic capacitor on a printed circuit board (PCB) of an airbag electronic control unit (ECU) includes a cap for receiving a lead end of the capacitor. The cap includes openings for receiving electrical leads of the capacitor. The cap supports electrical connectors, which electrically contact the electrical leads when a lead end of the capacitor is installed in the cap. The electrical connectors include portions for interfacing with the PCB to electrically connect the electrical connectors to the PCB. The cap also includes a vent that provides fluid communication from inside the cap to outside the cap. The vent is configured to vent dielectric liquids and gases discharged from the lead end of the capacitor during thermal cycles and/or charging cycles of the capacitor.

A method for manufacturing a circuit board with nickel resistor embedded therein provides a copper substrate, the copper substrate includes a copper foil. A nickel resistance layer is formed on the copper foil. A first dielectric layer and a first copper layer are formed on the nickel resistance layer. The copper foil and the first copper layer are etched to form a first conductive wiring layer and a second conductive wiring layer respectively, the nickel layer not being subjected to an etching process, to obtain the finished circuit board.

A power distributor of an electrical system of a motor vehicle, including a circuit board, which has a main connection to a main circuit and multiple secondary connections. Each secondary connection is assigned to one secondary circuit and electrically contacted with the main connection via a circuit breaker having two connections. The connections of each circuit breaker are electrically contacted directly with the circuit board. The invention also relates to a circuit breaker.

A printed circuit board includes a first chip component, a second chip component, and a printed wiring board. The first chip component and the second chip component each has a length L2 in the longitudinal direction. A relationship of 0.894≤L2/L1≤1.120 is satisfied, where L1 represents a length of the first opening in the longitudinal direction. A relationship of 0.894≤L2/L4≤1.120 is satisfied, where length L4 represents a length of the second opening in the longitudinal direction. A relationship of 0.183≤L.sub.OA/L.sub.iA≤0.309 is satisfied, where L.sub.iA represents a length of the first land in the longitudinal direction, and L.sub.OA represents a thickness of solder on an end surface of the first electrode. A relationship of 0.183≤L.sub.OB/L.sub.iB≤0.309 is satisfied, where L.sub.iB represents a length of the second land in the longitudinal direction, and L.sub.OB represents a thickness of solder on an end surface of the second electrode.