Provided is display panel including a substrate including a pixel area and a pad area; and a first conductive line and a second conductive line stacked on the substrate, wherein the first conductive line includes a first part disposed on the pixel area and a second part disposed on the pad area and the second conductive line includes a first part disposed on the pixel area and a second part disposed on the pad area. The first part of the first conductive line and the first part of the second conductive line are parallel to each other and the second part of the first conductive line and the second part of the second conductive line are overlapped vertically.

A semiconductor package comprising a substrate, at least one semiconductor die disposed on the substrate, at least one electrical connector connected with the semiconductor die, an encapsulant covering the substrate, the at least one semiconductor die, and at least partially the electrical connector, the encapsulant comprising a recess formed into a main surface of the encapsulant, wherein the at least one electrical connector is exposed within the recess.

A storage device includes a printed circuit board including a controller site, a first memory site, a second memory site, first conductive lines connected with the controller site, second conductive lines connected with the first memory site, and third conductive lines connected with the second memory site, a controller package provided on the controller site, a first nonvolatile memory package provided on the first memory site, a second nonvolatile memory package provided on the second memory site, and at least one resistor connecting at least one conductive line of the first conductive lines with at least one conductive line of the second conductive lines.