A display device including a display panel having panel pad units including a first panel pad unit having first pads arranged in a first column and a second panel pad unit having second pads arranged in a second column; a first member coupled to at least one of the first and second panel pad units; and a second member coupled to the first member and including a plurality of test pads, and wherein the first member includes lines electrically connecting a respective one of the plurality of test pads with a respective one of the first and second pads.

A display device including a film substrate including first and second surfaces, the first surface being opposite to the second surface; a semiconductor chip disposed on the first surface and including an input terminal and a test terminal, which are arranged in a first direction; a first wire extending from the input terminal on the first surface along a second direction, which intersects the first direction; and a second wire including a first extended portion, which extends along the first surface, a second extended portion, which extends along the second surface, and a first via, which penetrates the film substrate and connects the first extended portion and the second extended portion, wherein the first extended portion extends from the test terminal in the second direction and is connected to the first via, and the second extended portion extends from the first via to an edge of the second surface.

A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

A display device is provided. The display device includes a display panel including a plurality of pixels, at least one flexible circuit board connected to one side of the display panel and including a first portion and a second portion around the first portion, a source driving chip on the first portion, and a plurality of adhesion patterns on the second portion and extending in a set or predetermined direction.

An electronic device comprising: a substrate having a curved surface, a printed circuit board, and plural flexible wiring substrates, each of two of the plural flexible substrates has a terminal portion that is connected to the curved surface, the printed circuit board has a cutout between the two flexible wiring substrates.

A circuit board includes a substrate, a first measurement mark and a second measurement mark, the first and second measurement marks are located on a predetermined punch area of the substrate. After punching, the predetermined punch area is removed such that the circuit board has a through hole and a sheet is separated from the circuit board. By the first and second measurement marks on the sheet, a first distance between a first edge of the sheet and the first measurement mark and a second distance between a second edge of the sheet and the second measurement mark can be measured to determine whether the through hole is shifted or has an incorrect size.

The present invention provides a display panel and a manufacturing method thereof. The display panel comprises an array substrate provided with a first inclined plane at an edge of one side of the array substrate; a color filter substrate disposed on one side surface of the array substrate; the color filter substrate provided with a second inclined plane at an edge of one side of the color filter substrate, and the second inclined plane on a same plane with the first inclined plane; and a chip on film bonded to the first inclined plane and the second inclined plane. A manufacturing method of the display panel comprises an array substrate providing step, a color filter substrate disposing step, a cutting step and a bonding step. The technical effect of the present invention is reducing the thickness of the bottom frame of the display panel and increasing the screen ratio.

Disclosed are film packages, chip-on-film packages, and package modules. The film package including a film substrate having a first surface and a second surface facing each other, a plurality of output patterns on the film substrate and each including a first chip pad and an output pads electrically connected to the first chip pad and spaced apart in a first direction from the first chip pad, and a plurality of input patterns on the film substrate and each including a second chip pad adjacent to the first chip pad corresponding thereto and an input pad electrically connected to the second chip pad and spaced apart in the first direction from the second chip pad may be provided. At least portions of the output patterns overlap the input patterns across the film substrate.

The present disclosure provides a display panel, a method for manufacturing the display panel, and a display device. The display panel includes a substrate; a printed circuit board; a chip on film; an anisotropic conductive adhesive layer, connected between the chip on film and the substrate, and between the chip on film and the printed circuit board.

An ink jet head includes a head substrate, a printed board, and a plurality of flexible substrates connected in parallel to each other between the head substrate and the printed board. The head substrate includes a plurality of ink jet elements, and a common wire extending from an edge of the head substrate and electrically connected to the ink jet elements in common. The printed board includes a reference potential wire through which a reference potential is set to the ink jet head. A first one of the flexible substrates at a first end of an arrangement of the flexible substrates and a second one of the flexible substrates at a second end of the arrangement of the flexible substrates opposite to the first end each has a common connection wire electrically connected between the common wire and the reference potential wire.