H05K2201/10681

Actuator assembly of disk device and disk device comprising the same

According to one embodiment, an actuator assembly includes a head actuator including an actuator block having a first surface, a second surface intersecting the first surface, and a first groove provided on the second surface, and a suspension assembly supporting a magnetic head and a wiring board including a plate arranged on the first surface, a flexible printed circuit board provided on the plate, and an IC chip provided on the flexible printed circuit board, wherein the plate comprises a first engaging portion engaging with the first groove.

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
20200335429 · 2020-10-22 ·

According to one aspect of the present disclosure, a flexible printed circuit board includes: an insulating base film; a first conductive pattern that is layered on the base film and that is coated with gold, nickel, or an anti-rust material; and a second conductive pattern that is layered on the base film and that is coated with tin or solder.

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
20200312761 · 2020-10-01 ·

A circuit board includes a board, first connection pads disposed on the board and arranged in a first direction, second connection pads disposed on the board and arranged in the first direction, a driving chip disposed on the board and between the first connection pads and the second connection pads, and a first adhesive layer disposed on the board and overlapping with an entirety of the first connection pads in a plan view. The second connection pads are spaced apart from the first connection pads in a second direction perpendicular to the first direction.

FILM FOR A PACKAGE SUBSTRATE
20200303270 · 2020-09-24 ·

A display device including a film substrate including first and second surfaces, the first surface being opposite to the second surface; a semiconductor chip disposed on the first surface and including an input terminal and a test terminal, which are arranged in a first direction; a first wire extending from the input terminal on the first surface along a second direction, which intersects the first direction; and a second wire including a first extended portion, which extends along the first surface, a second extended portion, which extends along the second surface, and a first via, which penetrates the film substrate and connects the first extended portion and the second extended portion, wherein the first extended portion extends from the test terminal in the second direction and is connected to the first via, and the second extended portion extends from the first via to an edge of the second surface.

DISPLAY DEVICE
20200301193 · 2020-09-24 · ·

A display device includes a display panel, and a top cover disposed around a side surface of the display panel, wherein the top cover includes an accommodation portion corresponding to the side surface of the display panel, a first extension portion extending from an upper end of the accommodation portion, and a second extension portion extending from a lower end of the accommodation portion, such that the first extension portion is offset from the second extension portion.

Display device

A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

Flexible semiconductor package and method for fabricating the same

A semiconductor package attached to a curved display panel includes a semiconductor chip, having a top surface and a bottom surface, disposed on a curved flexible film, wherein the curved flexible film is disposed on the curved display panel, a flexible cover layer attached to the top surface of the semiconductor chip, and an underfill material formed between the semiconductor chip and the curved flexible film, and wherein the top surface of the semiconductor chip is planar.

Taping electronic component array
10755858 · 2020-08-25 · ·

A taping electronic component array includes a tape including a long carrier tape, in which recesses are provided along a longitudinal direction, and a cover tape that is provided on the carrier tape to cover the recesses; and a first coil component and a second coil component, which are disposed in each of the recesses. The first coil component includes a first core and a first coil in which a first wire and a second wire are wound around the first core in a predetermined winding direction while twisted in a predetermined twist direction, and the second coil component includes a second core and a second coil in which the first wire and the second wire are wound around the second core in the predetermined winding direction while twisted in an opposite direction to the predetermined twist direction. Thus, degradation of manufacturing capacity is prevented.

Film for package substrate, semiconductor package, display device, and methods of fabricating the film, the semiconductor package, the display device

A display device including a film substrate including first and second surfaces, the first surface being opposite to the second surface; a semiconductor chip disposed on the first surface and including an input terminal and a test terminal, which are arranged in a first direction; a first wire extending from the input terminal on the first surface along a second direction, which intersects the first direction; and a second wire including a first extended portion, which extends along the first surface, a second extended portion, which extends along the second surface, and a first via, which penetrates the film substrate and connects the first extended portion and the second extended portion, wherein the first extended portion extends from the test terminal in the second direction and is connected to the first via, and the second extended portion extends from the first via to an edge of the second surface.

Display device

A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.