A current sensor system includes a current sensor integrated circuit (IC) and a printed circuit board (PCB) having a ground plane with a feature configured to reduce an eddy current. The current sensor IC includes a lead frame comprising a die attach pad and at least one lead, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface, at least one magnetic field sensing element supported by the semiconductor die and configured to sense a current in a proximate primary conductor, and a non-conductive mold material enclosing the semiconductor die and a portion of the at least one lead. The PCB ground plane feature can take various forms such as a hole of a dimension larger than the current sensor IC, elongated cuts, or x-shaped cuts.

A connecting board according to an embodiment includes a core layer having a cavity in a thickness direction to pass through an inner center region of the core layer based on a plane perpendicular to the thickness direction, a via passing through the core layer, and connection pads that are coupled to both ends of the via. The core layer includes coupling ribs which protrude from an inner surface of the core layer facing the cavity toward the cavity.

A wiring board of an electronic device includes: a board terminal connected to a semiconductor device (semiconductor component); a wire formed in a first wiring layer and electrically connected to the board terminal; a conductor pattern formed in a second wiring layer and electrically connected to the wire via a via wire; and another conductor pattern formed in a third wiring layer and supplied with a first fixed potential. The conductor pattern and the another conductor pattern face each other with an insulating layer interposed therebetween, and an area of a region where the conductor pattern and the another conductor pattern face each other is larger than an area of the wire.

A circuit board device includes: a printed wiring board; an IC chip provided on an obverse surface of the board and having at least one ground terminal; and a wiring pattern, disposed on the board, for providing a ground potential to the ground terminal of the IC chip. The wiring pattern is disposed on a reverse surface of the printed wiring board. The circuit board device has at least one via that is connected to the wiring pattern and passes through the printed wiring board at a position within a region where the IC chip is mounted on the obverse surface of the printed wiring board.

A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.

A computing device, computer-readable medium, and method are provided to dynamically configure an FPGA of a computing device at runtime without rebooting the computing device. At least one upgradable capability of the FPGA is displayed to a user. The user selects an upgradable capability of the FPGA and accepts a license to enable the selected upgradable capability. An update to a reconfigurable FPGA image associated with the FPGA is obtained in response to issuance of the license. The update to the reconfigurable FPGA image is installed on the FPGA to enable the selected upgradable capability of the FPGA. An operating system of the computing device is notified of the update to the reconfigurable FPGA image at runtime, and the operating system exposes the selected upgradable capability of the FPGA to at least one component of a software stack managed by the operating system.

A circuit board device of the embodiment includes: a mount board having an electronic component and a printed circuit board having at least one surface where the electronic component is mounted; a heat path arranged to a position facing the mount surface of the mount board, a sheet arranged on the mount surface, and a resin portion arranged between the sheet and the heat path. A cavity surrounded by the sheet and the mount surface is formed in a step portion between the electronic component and the printed circuit board.

A flexible printed circuit board (PCB), a method for manufacturing the flexible PCB, and a PCB structure having the flexible PCB are disclosed. A flexible printed circuit board includes a first conductive pattern layer, a second conductive pattern layer, a plurality of first conductive pillars, and a plurality of second conductive pillars. Each of the plurality of first conductive pillars electrically connects to the first conductive pattern layer and is spaced from the second conductive pattern layer, and a plurality of second conductive pillars electrically connects to the second conductive pattern layer and is spaced from the first conductive pattern layer. The plurality of first conductive pillars and the plurality of second conductive pillars are exposed from one surface of the flexible printed circuit board to form a plurality of electrical contact pads.

A component carrier includes a base structure and an electrically conductive wiring structure on the base structure. The wiring structure has a nonrectangular cross-sectional shape configured so that an adhesion promoting constriction is formed by at least one of the group consisting of the wiring structure and a transition between the base structure and the wiring structure.

An electronic device package includes a molded case and a plurality of leads. The molded case includes integrally formed side walls, end walls, and a top wall, the side walls, end walls and top wall defining an interior for receiving one or more electronic components. Each side wall includes a top portion, an intermediate portion, and a bottom portion. The top portion includes plate-like structure having first and second surfaces extending downward from the top wall. The intermediate portion includes a shelf structure having a shelf surface that extends from the first surface in a direction away from the interior, and a third surface extending downward from the shelf surface. The bottom portion extends downward from the intermediate portion. The leads are molded at least in part of the intermediate portion. Each lead has a first end portion exposed in the interior, and a second end portion extending along a bottom edge of the bottom portion.