The present disclosure provides an integrated circuit comprising a main body and pins. The main body has a top and a bottom. The pins comprise upper pins placed on the top of the main body, and lower pins placed on the bottom of the main body.

A circuit board for an image forming apparatuses to which a first integrated circuit or a second integrated circuit is provided, comprising an electric part provided to a first surface of the circuit board, a first attachment part provided to the first surface, to which at least one terminal of the first integrated circuit is attachable, a first conductor pattern formed on the first surface and configured to constitute at least a portion of a first wiring which connects the first attachment part and the electric part, a second attachment part provided to a second surface opposite to the first surface of the circuit board, to which at least one terminal of the second integrated circuit is attachable.

Loss reduction methods are described. A first transmission loss associated with signal transmission through a trace in a first circuit board design is determined. The trace is routed from an integrated circuit disposed on a circuit board to a circuit element disposed on the circuit board. It is determined that the first transmission loss is greater than a threshold transmission loss. The first circuit board design is altered to obtain a second circuit board design. In the second circuit board design, the trace is routed from the integrated circuit to a connector disposed on the circuit board, and the connector is electrically coupled to the circuit element by a cable. A second transmission loss associated with signal transmission between the integrated circuit and the circuit element in the second circuit board design is less than the threshold transmission loss.

A semiconductor device includes a substrate comprising an antenna and a conductive feature; an integrated circuit (IC) die attached to the substrate and comprising a radio frequency (RF) circuit; and a flexible circuit integrated with the substrate, where the flexible circuit is electrically coupled to the IC die and the substrate, a first portion of the flexible circuit being disposed between opposing sidewalls of the substrate, a second portion of the flexible circuit extending beyond the opposing sidewalls of the substrate, the second portion of the flexible circuit comprising an electrical connector at a distal end.

A circuit system includes a circuit board. An integrated circuit is mounted on the circuit board, the integrated circuit including a plurality of pins. A trace-to-cable connector is mounted on the circuit board, the trace-to-cable connector configured to couple to a first cable of a first cable-type. A cable-to-cable connector is mounted on the circuit board, the cable-to-cable connector configured to couple the first cable to a second cable of a second cable-type. A first plurality of metal traces couple a first subset of the plurality of pins to the trace-to-cable connector.

A printed circuit board includes a power input terminal, a positive trunk line, a negative trunk line, a first switching circuit, a second switching circuit, a first positive wire, a second positive wire, a first capacitor, a second capacitor, and a bypass circuit. The first positive wire connecting the positive trunk line with the first switching circuit without passing through the second switching circuit. The second positive wire connecting the positive trunk line with the second switching circuit without passing through the first switching circuit. The first capacitor provided between the first positive wire and the negative trunk line. The second capacitor provided between the second positive wire and the negative trunk line. The bypass circuit connecting the first positive wire with the second positive wire.

Devices, systems, and methods for making and using circuit assemblies having a pattern of deformable conductive material formed therein are disclosed herein. In various aspects, a circuit assembly can include a substrate layer; a first pattern of deformable conductive material formed on a surface of the substrate layer using a removable stencil; and a first stacked layer configured to cover at least a portion of the first pattern of deformable conductive material.

The present embodiments are directed generally to techniques for providing an interactive environment that gives visual feedback and indicators to identify and/or encourage effective sharing of partially used drill sites, all inside a typical etch-edit environment. Such an interactive environment allows designers to effectively leverage and exploit new PCB manufacturing techniques that allow for multi-net use of a single drill hole.

Embodiments described herein provide an electronic device having an integrated circuit disposed in a surface mount package. The surface mount integrated circuit package comprises a first pin and a second pin of the integrated circuit configured to couple the integrated circuit to a first terminal and a second terminal disposed on a circuit board. The first pin and second pin define a first connector and a second connector of a differential connector pair in the surface mount integrated circuit package for transferring differential signals from the integrated circuit to the circuit board. The surface mount integrated circuit package comprises an isolation stud disposed between the first pin and the second pin. The isolation stud is disconnected from the integrated circuit and configured to enlarge a gap between the first pin and the second pin relative to respective gaps of other pins coupling the electronic device to the circuit board.

A circuit board device includes: a printed wiring board; an IC chip provided on an obverse surface of the board and having at least one ground terminal; and a wiring pattern, disposed on the board, for providing a ground potential to the ground terminal of the IC chip. The wiring pattern is disposed on a reverse surface of the printed wiring board. The circuit board device has at least one via that is connected to the wiring pattern and passes through the printed wiring board at a position within a region where the IC chip is mounted on the obverse surface of the printed wiring board.