Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises, a package substrate, an interposer on the package substrate, a first die cube and a second die cube on the interposer, wherein the interposer includes conductive traces for electrically coupling the first die cube to the second die cube, a die on the package substrate, and an embedded multi-die interconnect bridge (EMIB) in the package substrate, wherein the EMIB electrically couples the interposer to the die.

A module includes a substrate having a first surface, components as one or more components mounted on the first surface, a resin film covering the one or more components along a shape of the one or more components and covering part of the first surface, a first shield film formed to overlap the resin film, and a first sealing resin as a sealing resin disposed to cover the first surface, the one or more components, and the first shield film. A stack including the resin film and the first shield film has a first opening. A first columnar conductor is disposed to be electrically connected to the first surface through the first sealing resin and the first opening. The first shield film is electrically connected to the first columnar conductor in the first opening.

A module includes: a substrate having a first surface; a first component mounted on the first surface; a resin film that covers the first component along a shape of the first component, and also covers a part of the first surface; a conductor film that covers at least a part of the resin film along the shape of the first component, and covers at least a part of a portion in which the resin film covers the part of the first surface; and a conductor structure disposed to extend over a part of the resin film. The conductor structure includes a first end portion, a second end portion, and an intermediate portion. The first end portion and the second end portion are connected to the first surface. The intermediate portion is in contact with the conductor film.

Embodiments include interposers for use in high speed applications. In an embodiment, the interposer comprises an interposer substrate, and an array of pads on a first surface of the interposer substrate. In an embodiment, a plurality of vias pass through the interposer substrate, where each via is electrically coupled to one of the pads in the array of pads. In an embodiment a plurality of heating elements are embedded in the interposer substrate. In an embodiment a first cable is over the first surface interposer substrate. In an embodiment, the first cable comprises an array of conductive lines along the first cable, where conductive lines proximate to a first end of the cable are electrically coupled to pads in the array of pads.

A top side frame stiffener structure for a printed circuit board (PCB) stack. The structure is placed between a cooling component and a backing plate, in an area surrounding a substrate package. The structure does not cause the overall height of the PCB stack to increase.

Semiconductor device assemblies are provided with a package substrate including one or more layers of thermally conductive material configured to conduct heat generated by one or more of semiconductor dies of the assemblies laterally outward towards an outer edge of the assembly. The layer of thermally conductive material can comprise one or more allotropes of carbon, such as diamond, graphene, graphite, carbon nanotubes, or a combination thereof. The layer of thermally conductive material can be provided via deposition (e.g., sputtering, PVD, CVD, or ALD), via adhering a film comprising the layer of thermally conductive material to an outer surface of the package substrate, or via embedding a film comprising the layer of thermally conductive material to within the package substrate.

A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.

A flux resin composition includes an epoxy resin, an imidazole compound, a thixo agent, and an activator. The epoxy resin includes at least one resin selected from the group consisting of naphthalene epoxy resins, biphenyl aralkyl epoxy resins, trisphenol methane epoxy resins, biphenyl epoxy resins, and dicyclopentadiene epoxy resins. The content of the at least one resin is equal to or greater than 20% by weight with respect to a total weight of the epoxy resin.

The present disclosure is related to a power module power structure and an assembling method thereof. The power module structure includes a first printed-circuit-board (PCB) assembly, a second PCB assembly, and a conductive connection component. The first PCB assembly includes a first circuit board, a power switch and a magnetic component. The first circuit board includes a first side, a second side and a through hole. The power switch is disposed on the first circuit board. The magnetic component includes a first magnetic core and a second magnetic core fastened on the first circuit board through the through hole. The second PCB assembly includes a second circuit board having a third side, a fourth side and at least one opening. The second magnetic core is exposed through the opening. The conductive connection component is disposed and electrically connected between the first PCB assembly and the second PCB assembly.

An electrical device that includes a ball grid array (BGA) component, comprising signal processing circuitry, a component mounting surface, and a BGA, which has solder balls that are spaced apart from each other on the component mounting surface. The electrical device also includes a plurality of electrical wires, each electrically coupled directly to a corresponding one of the solder balls of the BGA component. The electrical device further includes a wire fixation element, through which the plurality of electrical wires at least partially pass through. The wire fixation element is coupled to the plurality of electrical wires and configured to fix the electrical wires relative to each other so that the electrical wires do not move relative to each other.