Trace transfer techniques can be used to couple touch electrodes to touch sensing circuitry with a reduced border region around a touch sensor panel. Touch electrodes on a first side of the substrate can be routed to a bond pad region on the second side of the substrate via a trace transfer technique to enable single-sided bonding of a double-sided touch sensor panel. Trace transfer techniques can also be used to couple conductive traces on a first side of the substrate to a flex circuit oriented perpendicular to or otherwise not parallel to the first side of the substrate. Orienting the flex circuit in this way can allow the flex circuit to connect to touch circuitry with reduced bending as compared with the amount of bending of the flex circuit when oriented substantially parallel to the substrate.

An electrical contact assembly includes an electrically nonconductive base, a first electrical contact supported by the base and a second electrical contact supported by the base such that the first contact and the second contact are separated by a space. The first electrical contact is configured to engage a first external conductive circuit element and the a second electrical contact is configured to engage a second external conductive circuit element. The first contact and the second contact are configured such that a portion of the first contact and a portion of the second contact converge as the base moves in a first direction relative to the first and second external conductive circuit elements and diverge as the base moves in a second direction relative to the first and second external conductive circuit elements.

This invention provides a method for mounting an electroacoustic component on a PCB and an electroacoustic component structure, so as to improve the problem that the traditional electroacoustic component affects the electrical characteristics due to the high temperature baking action in a reflow oven. The method comprises a step of separating and constructing a housing of the electroacoustic component. The housing comprises a shell seat and a base seat, the shell seat is provided with a plurality of sound producing components, and the base seat is provided with at least two conducting terminals for adhering the base seat to the PCB. The conducting terminals on the base seat and the at least two contacts on the PCB are adhered to each other and electrically connected in the reflow oven, and then the shell seat and the base seat are combined to make the shell seat and the base seat with the PCB combined outside the reflow oven into a single body to form an electroacoustic component that is mounted on the PCB.

A power control module includes a power device having a first side and a second side opposite from the first. The power control module includes a printed wiring board (PWB) spaced apart from the first side of the power device. The PWB is electrically connected to the power device. A heat sink plate is soldered to a second side of the transistor for heat dissipation from the transistor. The PWB and/or the heat sink plate includes an access hole defined therein to allow for access to the transistor during assembly. A method of assembling a power control module includes soldering at least one lead of a power device to a printed wiring board (PWB), pushing the power device toward a heat sink plate, and soldering the power device to the heat sink plate.

Disclosed are an integrated packaged light engine and signal emitting and receiving method thereof. The light engine includes molded interconnection device in which ceramic substrate is embedded, laser chip, photodiode chip, optical driving chip, transimpedance amplifier chip, array lens module and optical fiber interface provided on the ceramic substrate; the signal transmitting method includes: S1, powering optical drive chip by external power supply; S2, transmitting external signal to optical drive chip, so that laser chip emits optical signal; S3, totally reflecting and then transmitting optical signal by array lens module. The signal receiving method includes: S1, optical signal entering optical fiber interface; S2, optical signal entering array lens module; S3, transmitting optical signal to photodiode chip by array lens module; S4, converting and then transmitting optical signal into electrical signal to transimpedance amplifier chip by photodiode chip; S5, transmitting electrical signal to external circuit by transimpedance amplifier chip.

A stem has a stem body that has a first surface to be placed on a flexible substrate, a second surface opposite to the first surface, and a through hole passing through the first surface and the second surface, a cylindrical body that is fitted into the through hole of the stem body, and a lead that is inserted into the cylindrical body and fixed to the cylindrical body with a fixing member and that has an end portion protruding from the first surface of the stem body. The cylindrical body has a protrusion that protrudes toward the flexible substrate from the first surface of the stem body and surrounds an outer circumferential surface of the end portion of the lead.

A circuit board assembly includes a circuit board, an electronic surface mount device (SMD), and a spacer that attaches the SMD to the circuit board. A coefficient of thermal expansion (CTE) of the spacer is closer to a CTE of the SMD than a CTE of the circuit board. The circuit board assembly also includes a flexible electrical lead that extends between and that is electrically connected to the SMD and the electrical node of the circuit board. Methods of manufacturing the circuit board assembly include selectively heating joining material at a predetermined heating rate and selectively cooling the joining material at a predetermined cooling rate to attach the flexible electrical leads to the SMD and the circuit board.

An electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, having first to sixth surfaces, and including one ends of the first and second internal electrodes exposed through the third and fourth surfaces, respectively; first and second external electrodes respectively including first and second head portions, and first and second band portions; a first connection terminal having conductive portions disposed on both ends thereof and connected to the first and second band portions, respectively; and a second connection terminal having conductive portions on both ends thereof and connected to the first and second band portions, respectively. The second connection terminal is spaced apart from the first connection terminal in a direction connecting the fifth and sixth surfaces.

A package device is provided. The package device includes a substrate, a plurality of upper lands disposed on one surface of the substrate, a plurality of upper solder balls disposed on the plurality of upper lands, a die connected to the plurality of upper solder balls, a plurality of lower lands disposed on the other surface of the substrate, a plurality of lower solder balls disposed on some of the plurality of lower lands, and a capacitor connected to the lower lands on which the plurality of lower solder balls are not disposed among the plurality of lower lands, provided on an opposite side of the die, and including a height greater than the height of the plurality of lower solder balls.

A clip terminal for fixedly retaining a casing is provided. The terminal may have a connector part, at least one upstanding retention clip having a first height relative to a surface of the connector part, and a shielding part. The shielding part is located on an edge of the connector part and projects upwards relative to a surface of the connector part, and has a second height relative to the surface of the connector part which is greater than the first height. Alternatively, a clip terminal comprises a connector part, at least one upstanding retention clip, and a shielding part wherein the shielding part includes an extension portion at a top end that forms a surface for interaction with a suction instrument. A method of retaining a casing relative to a circuit board is also provided. Forming a clip terminal is provided along with a corresponding apparatus.