H05K2201/10962

POWER CONTROL MODULES
20200135622 · 2020-04-30 ·

A power control module includes a power device having a first side and a second side opposite from the first. The power control module includes a printed wiring board (PWB) spaced apart from the first side of the power device. The PWB is electrically connected to the power device. A heat sink plate is soldered to a second side of the transistor for heat dissipation from the transistor. The PWB and/or the heat sink plate includes an access hole defined therein to allow for access to the transistor during assembly. A method of assembling a power control module includes soldering at least one lead of a power device to a printed wiring board (PWB), pushing the power device toward a heat sink plate, and soldering the power device to the heat sink plate.

ELECTRONIC COMPONENT
20200135402 · 2020-04-30 ·

An electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, having first to sixth surfaces, and including one ends of the first and second internal electrodes exposed through the third and fourth surfaces, respectively; first and second external electrodes respectively including first and second head portions, and first and second band portions; a first connection terminal having conductive portions disposed on both ends thereof and connected to the first and second band portions, respectively; and a second connection terminal having conductive portions on both ends thereof and connected to the first and second band portions, respectively. The second connection terminal is spaced apart from the first connection terminal in a direction connecting the fifth and sixth surfaces.

Laminated electronic component and mounting structure thereof
10629372 · 2020-04-21 · ·

A laminated electronic component includes a laminate including internal electrodes and dielectric layers laminated alternately and a first main surface, an external electrode that continuously covers at least one end surface of the laminate in a longitudinal direction and a portion of the first main surface adjacent to the one end surface, and a conductive elastic structure connected to the external electrode at at least corner portions of the first main surface in a portion where the external electrode covers the first main surface. The elastic structure includes a base portion connected to the external electrode to extend along the first main surface, and a branch portion branched from the base portion and extending at a position spaced from the first main surface to connect to another electrode, and having elasticity.

Connecting structure for circuit board and output terminal of power supply
10617022 · 2020-04-07 ·

The utility model discloses a the connecting structure for the circuit board and the output terminal of the power supply, comprises a casing, a tail cover, and the circuit board with a control circuit, wherein one end of the casing has an opening, at least part of the circuit board is installed in a cavity of the casing, the output terminal is arranged on the tail cover, and the output terminal at least comprises a conductive pin. The connecting structure further comprises a conductive insertion component, wherein the insertion component is fixed to an output end of the circuit board, and when the tail cover and the open end of the casing are closed, the end of the conductive pin is inserted into the insertion component to allow the circuit board and the output terminal to be electrically connected, which has the advantage of rapid assembly.

TERMINAL AND METHOD FOR RETAINING A COMPONENT TO A SURFACE, AND MANUFACTURING METHOD AND APPARATUS

A clip terminal for fixedly retaining a casing is provided. The terminal may have a connector part, at least one upstanding retention clip having a first height relative to a surface of the connector part, and a shielding part. The shielding part is located on an edge of the connector part and projects upwards relative to a surface of the connector part, and has a second height relative to the surface of the connector part which is greater than the first height. Alternatively, a clip terminal comprises a connector part, at least one upstanding retention clip, and a shielding part wherein the shielding part includes an extension portion at a top end that forms a surface for interaction with a suction instrument. A method of retaining a casing relative to a circuit board is also provided. Forming a clip terminal is provided along with a corresponding apparatus.

ADJUSTABLE ANCHOR FOR PRINTED CIRCUIT BOARD ENVIRONMENTAL SENSOR

In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.

Image pickup unit, wiring board with cable, and manufacturing method of wiring board with cable
10582839 · 2020-03-10 · ·

An image pickup unit includes: an image pickup device on which an image pickup section is formed; a circuit board having a main surface on which a connection terminal electrically connected with the image pickup section is disposed; an intermediate wiring board including a substrate, an adhesive layer and a wiring pattern, in which a first electrode of the wiring pattern is electrically connected with the connection terminal; a cable having a core wire; and a holding substrate configured to hold the core wire with a second electrode and fixed to the intermediate wiring board by the adhesive layer in a state that the core wire and the second electrode are electrically connected by being in close contact.

Power semiconductor module and power semiconductor device
10561021 · 2020-02-11 · ·

The area projections or a spacer occupies on the upper surface of a resin casing increases as the size of a power semiconductor module decreases, and therefore another means for defining a clearance between a control board and the resin casing is desired. A power semiconductor module is provided, including: a housing which houses a power semiconductor chip; and at least one control pin or guide pin which protrudes outward from an upper surface of the housing, wherein the at least one control pin or guide pin has at least one step in a height direction from the upper surface of the housing toward a tip farthest from the housing.

Electronic Module and Method for Producing an Electronic Module
20200045839 · 2020-02-06 ·

An electronic module includes a printed circuit board (PCB) element, a base with a first electrically conductive contact element, and an electronic component with a second electrically conductive contact element. The base is fastened on and electrically connected to the PCB element. The electronic component is electrically connected to the base by an electric contact region between the first and second contact elements. A first portion of the first contact element protrudes from the base on a first side of the base facing away from the PCB element. The first portion of the first contact element and/or a second portion of the second contact element has a resilient configuration such that the electronic component is mechanically fastened to the base by a spring force between the first and second contact elements. The electronic module in one embodiment is configured for a transmission controller or an electric vehicle

DIRECT CONNECTION OF HIGH SPEED SIGNALS ON PCB CHIP
20200037448 · 2020-01-30 ·

To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated from particular integrated circuits housed on a printed circuit board, to other locations within a system. More specifically, a signal escape strategy directly connects a high-speed cable to a point on the circuit board which is very close to the integrated circuit itself. A back-side connection methodology is utilized so that electrical signals pass directly from the integrated circuit through a via, to a connection point on the backside of the circuit board. To accommodate this connection, a specially designed interposer and related paddle cards are utilized so the high-speed communication cable can be easily attached.