A solid state power switch assembly of an aircraft solid state power controller includes a circuit board, at least one solid state power switch, and a busbar. The at least one solid state power switch has a first side and an opposing second side. A power switch electric contact surface is formed on the first side and the at least one solid state power switch is arranged on the circuit board with the second side facing the circuit board and the first side facing away from the circuit board. The busbar comprises at least one busbar contact portion configured for electrically contacting the power switch electric contact surface and at least one busbar mounting portion, which is configured for be mounted to the circuit board, so that the at least one solid state power switch is sandwiched between the at least one busbar contact portion and the circuit board.

A printed-wiring board has a land group with which a terminal group of a semiconductor package has been joined, a first conductor pattern arranged in a mounting area where the semiconductor package is mounted and joined with a heat radiation plate of the semiconductor package, a second conductor pattern, at least a part of which is arranged on the outside of the mounting area, and a third conductor pattern which connects the first and second conductor patterns. The land group includes a first land adjacent to the third conductor pattern and a second land which is not adjacent to the third conductor pattern, and the first land is formed in a shape different from that of the second land so as to be away from the third conductor pattern.

The invention relates to an assembly, on which a plurality of light-emitting diodes are arranged and spaced apart by intermediate Spaces. According to the invention, the assembly is developed further by the fact that the intermediate Spaces between the light-emitting diodes comprise a heat-resistant or fire-resistant or non-combustible material and/or that a front panel comprising a heat-resistant or fire-resistant or non-combustible material is provided. The invention also relates to a video board.

A light source module includes a light source for emitting light, and a heat sink for absorbing heat from the light source and dissipating the heat to the outside. The heat sink includes a mounting part for attaching the light source, and a heat dissipation fin for absorbing heat generated by the light source and dissipating the heat to the outside. An electrical insulating layer is provided on at least one surface of the heat sink, and an electrically conductive layer is provided in the insulating layer. The electrically conductive layer provides a path through which electric current is applied to the light source. A lens cover is provided over the light source.

Technologies are described herein for implementing a space-efficient internal energy storage apparatus in a data storage device or other electronic device have a metallic or otherwise electrically-conductive housing or case structure. A first carbon layer is applied to an inner surface of the metallic housing, and a dielectric spacer is applied upon the first carbon layer. Next, a conductive layer having a second carbon layer is applied over the dielectric spacer, and the metallic housing and the conductive layer is electrically connected to a circuitry of the electronic device.

A surface-mounted integrated circuit (IC) package is disclosed that has unwanted flux removed from surface-mounted IC. A bottom termination component (BTC) includes lands and a thermal pad. The lands provide an electrical connection from the BTC and the thermal pad provides heat transfer from the BTC. The thermal pad includes vias that are configured to remove flux generated from solder applied to the surface-mounted IC as the surface-mounted IC is assembled. A printed circuit board (PCB) is mounted to the BTC and is electrically connected to the BTC via the lands and receives heat transfer from the BTC via the thermal pad and includes a reservoir. The reservoir is configured to pull flux positioned between the lands into the reservoir as the flux is generated from the solder applied to the surface-mounted IC as the BTC is mounted to the PCB and as the surface-mounted IC is assembled.

The invention relates to an assembly, on which a plurality of light-emitting diodes are arranged and spaced apart by intermediate Spaces. According to the invention, the assembly is developed further by the fact that the intermediate Spaces between the light-emitting diodes comprise a heat-resistant or fire-resistant or non-combustible material and/or that a front panel comprising a heat-resistant or fire-resistant or non-combustible material is provided. The invention also relates to a video board.

A circuit board having a circuit pattern on a base plate and an additional metal layer laid and bonded on the circuit pattern, wherein the additional metal layer comprises an attachment plane portion configured to fix a semiconductor chip using solder, and an engagement uneven portion provided adjacent to the attachment plane portion, wherein the attachment plane portion is a face having unevenness smaller than the engagement uneven portion.

A semiconductor package according to an embodiment includes a first insulating layer; and a first through electrode part passing through the first insulating layer and having a shape elongated in a first direction; wherein the first through electrode part includes a plurality of first through electrodes spaced apart from each other in a second direction perpendicular to the first direction and a thickness direction; wherein at least one of the plurality of first through electrodes includes a first sub through electrode and a second sub through electrode spaced apart from each other in the first direction; and wherein at least one of the first sub through electrode and the second sub through electrode has a width in the first direction greater than a width in the second direction.

A method for manufacturing a circuit board includes: preparing a first substrate and a second substrate, wherein: the first substrate comprises a convex post member formed at a top surface of the first substrate, and the second substrate including a first surface and a second surface opposite to the first surface, and comprising: a first metal layer formed on at least the first surface, and an opening through which a top surface of the post member is uncovered in a plan view; bonding at least a portion of a top surface of the first substrate excluding the post member and the second surface of the second substrate so that the top surface of the post member is uncovered through the opening; and forming a circuit pattern by removing a first portion of the first metal layer.