An electronic control device includes a board including a heat sink on which a heat generation element is mounted, and a housing that is in contact with the board and dissipates heat of the heat generation element to the outside. A potential of the housing is a ground, and a potential of the heat sink is a non-ground. The board includes a first layer including a first non-ground wiring that is in direct contact with the heat sink, and a second layer including a second ground wiring that is in electrical and thermal contact with the housing. The first non-ground wiring and the second ground wiring overlap each other in plan view from a thickness direction of the board.

A wiring board includes a heat dissipation plate, a heat-conductive adhesive layer, an insulating layer, a thermal via, a heat dissipation metal terminal, and electrodes. The heat-conductive adhesive layer is disposed on the heat dissipation plate. The insulating layer is disposed on the heat-conductive adhesive layer. The insulating layer is formed with an opening portion. The thermal via is disposed in the opening portion of the insulating layer. The heat dissipation metal terminal is disposed on the thermal via and electrically connected to the heat dissipation plate. The electrodes are disposed on the insulating layer. The electrodes are to be connected to an electronic component.

A connection arrangement includes a printed circuit board, a semiconductor component arranged on a first surface, a first side, of the printed circuit board, a connection means arranged on a second surface, a second side, of the printed circuit board, a contact element contactable with the connection means and an electrical line, wherein the connection means is arranged opposite the semiconductor component.

In some examples, a corner shield is provided for protecting a surface-mount device (SMD) on a printed circuit board (PCB). An example corner shield comprises a rigid structure configured to conform to a corner area of the SMD, and one or more mounting surfaces configured to mount the rigid structure to one or more soldering pads on the PCB adjacent to the SMD.

Provided are: a circuit device which has improved connection reliability in a solder joint portion by suppressing the occurrence of sink of solder; and a method for manufacturing the circuit device. In a method for manufacturing a circuit device of the present invention, a plurality of solders (19), which are apart from each other, are firstly formed on the upper surface of a pad (18A), and a chip component (14B) and a transistor (14C) are affixed at the same time. After that, a solder paste (31) is supplied to the upper surface of the pad (18A) using a syringe (30), a heatsink (14D) is mounted on top of the solder paste (31), and melting is caused by a reflow process. There is little risk of sinking of the solders (19) in the present invention since the solders (19) are discretely arranged on the upper surface of the pad (18A).

A printed circuit board (PCB) structure with a heat dissipation function is provided, including: a package substrate; a landing pad formed over a portion of the package substrate from a first surface thereof, wherein the landing pad has a rectangular configuration and has a plurality of corners; a plurality of ground traces formed over various portions of the package substrate, physically connecting to the bond pad from at least two of the corners thereof, respectively; a first through hole formed through the landing pad and the package substrate from substantially a center portion of the bonding pad; and a plurality of second through holes formed through the landing pad and the package substrate from substantially one of the corners of the bonding pad, wherein the second through holes are adjacent to the ground traces, respectively.

An object of the present invention is to provide an electronic control device capable of improving the connection life and reliability of solder connecting a printed circuit board and a QFN type semiconductor package. For this purpose, a printed circuit board 106 includes a first land 109 connected to a first metal terminal 104 via a solder 107, a second land 110 connected to a second metal terminal 105 via a solder 108, a third land 112 disposed on the outer peripheral side of a semiconductor package 101 with respect to the first land 109, and a resist 113 formed on the third land 112 so as to be in contact with the lower surface of a molding resin 103.

A printed circuit board assembly includes a printed circuit board with an upper face, a lower face, multiple metal layers, and multiple electrically insulating layers. The printed circuit board assembly additionally includes a metal heat sink on which the lower face of the printed circuit board lies at least in some regions, wherein the metal heat sink has a heat sink potential. The bottom metal layer of the printed circuit board is set to the heat sink potential while the other metal layers of the printed circuit board have an electric potential which deviates therefrom.

A circuit board includes an insulating portion and a pattern portion on the insulating portion. The insulating portion includes a first insulating region and a second insulating region outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween. The pattern portion includes a first pattern portion for signal transmission and a second pattern portion including a dummy pattern separated from the first pattern portion. The first pattern portion includes a first terminal portion on the first insulating region, a second terminal portion on the second insulating region, and a connection portion on the separation region and connecting between the first terminal portion and the second terminal portion. The second pattern portion includes a second-first pattern portion on the first insulating region and a second-second pattern portion on the second insulating region and separated from the second-first pattern portion.