A wiring module is to be attached to a battery cell stacked body in which a plurality of battery cells having an electrode terminal and being elongated in a front-rear direction are arranged in a horizontal direction, and is electrically connected to the battery cells, the wiring module including: a bus bar that is connected to the electrode lead; an FPC that is connected to the bus bar and extends in the front-rear direction; and a protector that holds the bus bar and the FPC, wherein the FPC includes: a plurality of extension parts that extend in the front-rear direction; an intersection part that extends in the horizontal direction; and a bending part, the extension parts are respectively coupled to two end portions of the intersection part in the horizontal direction, one of the extension parts includes the bending part in the vicinity of the intersection part.

A connection structure includes a first substrate having first and second principal surfaces opposed to each other and includes a first thermoplastic resin; a first substrate electrode on the first principal surface; a second substrate which has a third principal surface and a fourth principal surface opposed to the third principal surface and facing the first principal surface and includes a second thermoplastic resin; a second substrate electrode on the fourth principal surface; a conductive bonding material which bonds the first and second substrate electrodes together; and an insulating adhesive which adheres the first principal surface other than a portion where the first substrate electrode is and the fourth principal surface other than a portion where the second substrate electrode is together. A bonding temperature of the bonding material is lower than a respective melting point or a respective glass transition temperature of the first and second thermoplastic resins.

A camera module according to an embodiment includes a printed circuit board; an infrared filter disposed on an upper surface of the printed circuit board; and an image sensor disposed under a lower surface of the printed circuit board, wherein the printed circuit board includes: an insulating layer including a cavity overlapping at least a part of the infrared filter and at least a part of the image sensor in an optical axis direction; and a circuit pattern buried in the insulating layer and connected to a terminal of the image sensor; and wherein a shape of the cavity is different from a shape of the image sensor.

An electronic device that is capable of keeping the impedance (ground impedance) between a printed circuit board and a shield case low. The electronic device includes a printed circuit board that has ground layer(s) which is conductive and is provided at a location in the thickness direction of the printed circuit board, and the shield case which is disposed on one side of the printed circuit board and consists of a hollow body that has conductivity. A through hole(s) passing through the ground layer is formed in the printed circuit board. A projecting portion(s), which is inserted into the through hole(s), is formed in a projecting manner in the shield case. In a state of being inserted in the through hole(s), the projecting portion(s) is electrically connected to the ground layer via solder.

A method and device are provided. The device includes a system component that has a circuit board that includes a cable connection portion. The cable connection portion is disposed on and extends along a mounting surface, and includes board pads disposed on the mounting surface within the cable connection portion. The board pads define corresponding board contact surfaces for electrical coupling with connector pads, and include a board adhesive material disposed on the corresponding board contact surfaces.

Embodiments of this application disclose an electronic component and an electronic device. The electronic component is disposed on a printed circuit board (PCB). The electronic component includes an electronic component body. The electronic component body is soldered to the PCB by using a connecting component. The connecting component is provided with at least one cushioning structure.

A radio frequency front-end module, a manufacturing method thereof and a communication device are provided. The radio frequency front-end module includes a first base substrate and a metal bonding structure; a second functional substrate, including a second base substrate, a groove in the second base substrate, and a bonding metal layer; and a first radio frequency front-end component, at least partially located in the groove, the first base substrate and the second base substrate are oppositely arranged, and a surface of the second base substrate close to the first base substrate includes a groove surface inside the groove and a substrate surface outside the groove, and the bonding metal layer includes a first metal portion located on the groove surface and a second metal portion located on the substrate surface, the first radio frequency front-end component is at least partially surrounded by the first metal portion.

The technology of this application relates to a board-level structure that includes an upper-layer substrate, a lower-layer substrate, and a plurality of support members that can be supported between the upper-layer substrate and the lower-layer substrate. In an example embodiment, a gap exists between the upper-layer substrate and the lower-layer substrate, the gap includes at least one first gap region and at least one second gap region, the first gap region and the second gap region are spaced, a spaced region between the first gap region and the second gap region does not include the first gap region or the second gap region, and a maximum vertical distance between the upper-layer substrate and the lower-layer substrate in the first gap region is less than a minimum vertical distance between the upper-layer substrate and the lower-layer substrate in the second gap region.

A connection element for electrically connecting a circuit carrier to another circuit carrier includes at least one solder connection for soldering onto the surface of the circuit carrier and a connection pin, which is electrically connected to the solder connection, for inserting into the other circuit carrier. The connection element has a holding body and a contact element which is connected to the holding body and which is designed to be elastic. The contact element has an end section, the solder connection being formed on the end section. The connection element has a locking element which is connected to the connection element in a movable manner back and forth between a locking position and a release position. The locking element is designed to limit the displacement of the contact element in the locking position and release an elastic movement of the contact element in the release position.

The technology of this disclosure relates to a connection assembly, a board-level architecture, and a computing device. The connection assembly is configured to connect a semiconductor wafer and a lower layer substrate that are disposed opposite to each other, and includes an insulator structure and a plurality of connection terminals that are disposed at spacings. A first end and a second end of any one of the plurality of connection terminals each are provided with a welding structure. The first end is welded to the semiconductor wafer, and the second end is welded to the lower layer substrate. The insulator structure includes a plurality of empty slots provided at spacings. Positions of the plurality of empty slots are in a one-to-one correspondence with positions of the plurality of connection terminals. Any one of the plurality of connection terminals is disposed in any empty slot, to fasten a position of the connection terminal.