A method for manufacturing printed circuit boards for electrical and electronic circuits, comprising an electrically nonconductive substrate (4) and electrically conductive tracks of homogenous thickness applied thereon, wherein the electrically conductive tracks are made of a material with a melting temperature higher than the melting temperature of soldering tin so that they will withstand the soldering of electronic components thereon by soldering tin without melting, characterized in that a print medium (3) comprising the material of the electrically conductive tracks is provided as a two-dimensional layer above the electrically nonconductive substrate (4) and is imprinted on the electrically nonconductive substrate (4) according to the desired conductor track layout, under the influence of heat selectively applied by a print head (2) onto the printing medium (3), whereby the printing medium (3) is transferred onto the substrate (4) by selectively melting or sintering the material for the electrically conductive tracks, wherein the print head (2) does not come into direct contact with the printing medium (3), since at least a foil-shaped carrier material carrying the two-dimensional layer of the printing medium (3) is situated between the print head (2) and the two-dimensional layer of the printing medium (3).

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

A printed wiring board includes a base insulating layer, a conductor layer formed on the base insulating layer and having a conductor pad, a solder resist layer formed on the base insulating layer such that the solder resist layer is covering the conductor layer and has an opening exposing the conductor pad in the conductor layer, and a bump formed on the conductor pad of the conductor layer and including a base plating layer formed in the opening of the solder resist layer, an intermediate layer formed on the base plating layer, and a top plating layer formed on the intermediate layer such that that the base plating layer has a side surface exposed from the solder resist layer and that the intermediate layer has a side surface protruding from the side surface of the base plating layer.

A network communication device has a circuit board, a network communication chip, an antenna, and a metal cover. The circuit board has a first surface and a second surface opposite to each other. An interior of the circuit board has a ground layer. An edge of the first surface has a ground ring. The ground ring surrounds the first surface and is electrically connected to the ground layer. The network communication chip is disposed on the first surface. The antenna is electrically connected to the circuit board. The metal cover has an annular support rib. The circuit board is disposed on the annular support rib with the first surface facing the metal cover. The ground ring is in physical contact with and electrically connected to the annular support rib.

An assembling method of an electronic module is disclosed and includes steps of: (a) providing a first circuit board including a first side and a second side; (b) providing a second circuit board including a third side and a fourth side, and a connection component connected to the third side; (c) providing a solder ball, and stacking the first circuit board, the second circuit board and the solder ball; and (d) performing a reflow soldering process to a stacked structure of the first circuit board, the second circuit board and the solder ball.

Examples of printed circuit boards (PCBs) with board configuration blocks and board edge projections are described. In one example, a PCB includes a core material and a metal layer comprising a plurality of metal traces on the core material. The plurality of metal traces can include component interconnect traces and a board configuration block. The board configuration block can include a plan diagram for the PCB, an operational diagram for the PCB, or a combination of plan and operational diagrams. In other examples, a PCB can include a core material having a peripheral edge. The peripheral edge can include one or more board edge scheme projections positioned within projection edge regions of the peripheral edge. The scheme projections have a projection shape based on operational characteristics for the PCB. In some cases, the board configuration blocks can be located on the board edge scheme projections.

A radio frequency module includes a power amplification element, a transmission filter, and a transmission matching element, which are transmission-only components for processing only a transmission signal, a low noise amplification element, a reception filter, and a reception matching element, which are reception-only components for processing only a reception signal, an antenna switch, which is a transmission-reception dual-use component for processing both a transmission signal and a reception signal, and a first module board and a second module board, which are arranged to face each other. The transmission-only components are mounted on a main surface of the first module board, and the reception-only components and the transmission-reception dual-use component are mounted on respective main surfaces of the second module board.

An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.

The present disclosure relates to a laminated-type chip component, and more particularly, to a laminated-type chip component which can be more stably bonded by forming a groove filled with solder in a region in which an external electrode terminal of the laminated-type chip is soldered and thereby increasing the area of soldering.

To achieve heat dissipation of a wiring pattern inexpensively with a simple configuration, a printed circuit board includes an insulating substrate having a plurality of wiring patterns on a main surface thereof, and an electronic component mounted on the main surface and connected to the wiring patterns. Further, the printed circuit board includes a heat-dissipating surface mount component that is a surface mount component. The heat-dissipating surface mount component is joined via a solder to each of the wiring patterns on the main surface to dissipate heat of the wiring pattern.