A bonding structure includes a first layer of first alloy component disposed on a substrate and a first layer of a second alloy component disposed on the first alloy component. The second alloy component has a lower melting temperature than the first alloy component. A second layer of the first alloy component is disposed on the first layer of the second alloy component and a second layer of the second alloy component is disposed on the second layer of the first alloy component.

At least one embodiment of the present disclosure relates to a substrate, a display panel and a fabrication method thereof, and a spliced screen. The substrate includes a base having a display region and a non-display region, and the non-display region includes a bonding region arranged at an end-side of the base.

A bonding element includes a first transient liquid phase (TLP) bonding element including a first material and a second material, the first material having a higher melting point than the second material, a ratio of a quantity of the first material and the second material in the first TLP bonding element having a first value and a second TLP bonding element including the first material and the second material, a ratio of a quantity of the first material and the second material in the second TLP bonding element having a second value different from the first value.

A printed circuit board (PCB) includes an insulating layer, a first solder resist layer disposed on an upper surface of the insulating layer, a first conductive pattern disposed on the insulating layer and providing a conductive post protruding from an upper surface of the first solder resist layer, and a second conductive pattern buried in the insulating layer and having an upper surface positioned to be lower than the upper surface of the insulating layer.

A circuit module comprises a substrate module, an electronic component, and a first conductive joining member. The substrate module includes a circuit substrate having an upper main surface and a lower main surface, an insulating member covering the upper main surface of the circuit substrate, an insulating member covering the upper main surface of the circuit substrate, and a first metal pin that passes through the insulating member parallel to a vertical axis and is electrically connected to the circuit substrate. The first metal pin has a first exposed portion. The first exposed portion is exposed from the insulating member to face a right direction. A first outer electrode has a left projecting portion projecting in a left direction from the left surface. A first conductive joining member joins the first exposed portion and the left projecting portion to each other.

A power module includes a power circuit and a magnetic assembly. The power circuit includes at least one switch element. The magnetic assembly includes at least one first electrical conductor and a magnetic core module comprising at least one hole, wherein the at least one first electrical conductor passes through the at least one hole, and a terminal of the at least one first electrical conductor is electrically connected to the at least one switch element. The power circuit and the magnetic assembly are arranged in sequence along a same direction.

A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load.

A circuit board assembly (1), comprising a first circuit board (10) and a second circuit board (20) which are electrically connected with each other, and a monolithic substrate (30) configured for supporting a power component and comprising a first contact surface (31) that is fixedly connected to and forms a thermal contact with the second circuit board (20), the circuit board assembly being characterized in that, the substrate (30) further comprises a second contact surface (32) that is fixedly connected to the first circuit board (10) and forms a thermal contact with the first circuit board (10) so that the substrate functions as an extension of the first circuit board to support the second circuit board. A radio unit comprising a circuit board assembly (1) is also disclosed.

An electronic device includes a back board, a circuit board, a first attaching member and a second attaching member. The circuit board is arranged on the back board. The first attaching member is arranged between the back board and the circuit board. The second attaching member is arranged between the back board and the circuit board. The circuit board is fixed on the back board through the first attaching member and the second attaching member, and a material of the first attaching member is different from that of the second attaching member.

An object is to provide a circuit board that includes a built-in semiconductor device and has a configuration that prevents cracking and has excellent reliability in operation over a wide temperature range. As a solution, a circuit board (10A) has a configuration in which a first insulating substrate (1) is laminated on a second insulating substrate (2) while interposing a first adhesive layer (7a), and a semiconductor device (9) is embedded in an embedment portion (1c) formed in the first insulating substrate (1).