A wiring substrate includes a core substrate including a glass substrate and a through-hole conductor, a resin insulating layer having an opening extending through the resin insulating layer, a conductor layer including a seed layer and an electrolytic plating layer on the seed layer, and a via conductor formed in the opening such that the via conductor electrically connects to the through-hole conductor in the core substrate and includes the seed layer and electrolytic plating layer extending from the conductor layer. The resin insulating layer includes resin and inorganic particles including first and second particles such that the first particles are partially embedded in the resin and that the second particles are embedded in the resin, the first particles have first portions protruding from the resin and second portions embedded in the resin respectively, the surface includes the resin and exposed surfaces of the first portions exposed from the resin.

The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer on the smooth surface of a build-up layer and a second conductive layer selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls of at least one opening which are formed after depositing the first conductive layer.

An object of the present invention is to provide a unit capable of improving redispersibility in a concentrated liquid of a polishing composition containing alumina as abrasive grains. There is provided a concentrated liquid of a polishing composition which includes: particulate alumina; colloidal alumina having an aspect ratio of more than 5 and 800 or less; at least one phosphorus-containing acid selected from the group consisting of phosphoric acid, phosphoric acid condensates, organic phosphoric acids, phosphonic acids, and organic phosphonic acids; and water, where a pH of the concentrated liquid of the polishing composition is 2 or more and 4.5 or less.

A wiring board includes a first insulating layer coating a first wiring layer. A first through hole is opened in a surface of the first insulating layer and exposes a surface of the first wiring layer. A first via arranged in the first through hole includes an end surface exposed to the surface of the first insulating layer. A gap is formed between the first insulating layer and the first via in the first through hole. A second wiring layer is stacked on the surface of the first insulating layer and the end surface of the first via. The second wiring layer includes a pad filling the gap. The pad is greater in planar shape than the first through hole.

Provided is a glass cloth treatment liquid in which 0.05-2.0 mass % of a methacrylamide group-containing organosilicon compound represented by formula (1) is dissolved in water, wherein the content of a dimethacrylamide group-containing organosilicon compound represented by formula (2) is less than 1 mass part per 100 mass parts of the methacrylamide group-containing organosilicon compound represented by formula (1).

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(In the formulae, R.sup.1 each independently represents a C1-C10 alkyl group or a C6-C10 aryl group, Me represents a methyl group, m1 and m2 represent an integer of 1-3, and n1 and n2 represent an integer of 1-12.)

A glass substrate having a first surface and a second surface, including one through hole, a side surface of the through hole being such that: a side surface angle is in a range of 4 to 7 inclusive at a distance in a range from 0% or more to less than 10% from the first surface, and a difference between an inclination angle of the left side surface and an inclination angle of the right side surface is 1.0 or less; and a side surface angle is in a range of 7 to 15 inclusive at a distance in a range from 10% to 100% inclusive from the first surface, and a difference between an inclination angle of the left side surface and an inclination angle of the right side surface is 1.0 or less.

A glass substrate having a first surface and a second surface, the glass substrate including at least one through hole penetrating from the first surface to the second surface, where a cut surface of the through hole in a thickness direction of the glass substrate has a shape of a side surface, the shape having a dispersion roughness of 1,000 nm or less and an unevenness width of 1,500 nm or less.

The invention relates to a method for cleaning a nonconductive surface of a nonconductive layer, wherein the nonconductive layer is basing on a composite of an organic polymer and the glass filler and comprising a blind micro via (BMV), for manufacturing an article with an integrated circuit, wherein the nonconductive surface comprises a nonconductive wall surface of the BMV, wherein the nonconductive layer is attached to a copper layer and wherein the copper layer forms the bottom of the BMV, wherein the method comprises the steps in the following order: (i) providing the non-conductive surface of the nonconductive layer; (ii) treating the provided surface with a desmear process comprising the following steps in this order: (t1) treatment with a sweller solution comprising water and an organic solvent, (t2) treatment with an aqueous etching solution comprising an oxidation agent, and (t3) treatment with an aqueous reduction solution comprising a reduction agent; (iii) treating the surface treated in step (ii) with an aqueous alkaline cleaner solution in order to remove the glass filler, wherein the aqueous alkaline cleaner solution; and (iv) drying the surface treated in step (iii) in order to get a dry surface, preferably water-free surface; and a use of the method.

A method is described for method for patterning a metal layer interfaced with a transparent conductive film, in which the method comprises contacting a structure through a patterned mask with an etching solution comprising Fe.sup.+3 ions, wherein the structure comprises the metal layer comprising copper, nickel, aluminum or alloys thereof covering at least partially a transparent conductive film with conductive elements comprising silver, to expose a portion of the transparent conductive film. Etching solutions and the etched structures are also described.

A hybrid mold that is used for forming a wiring structure including wiring and vias connecting pieces of the wiring in different layers to each other, the hybrid mold includes a body made of an optically transparent material, a masking pattern made of an opaque material and disposed on a first surface of the body and a pillar structure including a plurality of pillars made of the optically transparent material and protruding from a second surface of the body, the second surface being opposite to the first surface. The masking pattern has shape and placement corresponding to shape and placement of the wiring when viewed from a direction orthogonal to the first surface, and the plurality of pillars each has shape and placement corresponding to shape and placement of the vias when viewed from the direction orthogonal to the first surface.