Patent classifications
H10K10/484
Method for making carbon nanotubes
A method of making carbon nanotubes is provided, the method includes depositing a catalyst layer on a substrate, placing the substrate having the catalyst layer in a reaction furnace, heating the reaction furnace to a predetermined temperature, introducing a carbon source gas and a protective gas into the reaction furnace to grow a first carbon nanotube segment structure comprising a plurality of metallic carbon nanotube segments, and applying a pulsed electric field to grow a second carbon nanotube segment structure from the plurality of metallic carbon nanotube segments, where the pulsed electric field is a periodic electric field including a plurality of positive electric field pulses and a plurality of negative electric field pulses alternately arranged, and the second carbon nanotube segment structure includes a plurality of semiconducting carbon nanotube segments.
Methods and apparatus for measuring analytes using polymerase in large scale molecular electronics sensor arrays
In various embodiments of the present disclosure, a molecular electronics sensor array chip comprises: (a) an integrated circuit semiconductor chip; and (b) a plurality of molecular electronic sensor devices disposed thereon, each of said sensor devices comprising: (i) a pair of nanoscale source and drain electrodes separated by a nanogap; (ii) a gate electrode; and (iii) a bridge and/or probe molecule spanning the nanogap and connecting the source and drain electrodes, wherein the molecular electronic sensor devices are organized into an electronically addressable, controllable, and readable array of sensor pixels.
Materials and devices that provide total transmission of electrons without ballistic propagation and methods of devising same
Quantum dragon materials and devices have unit (total) transmission of electrons for a wide range of electron energies, even though the electrons do not undergo ballistic propagation, when connected optimally to at least two external leads. Quantum dragon materials and devices, as well as those that are nearly quantum dragons, enable embodiments as quantum dragon electronic or optoelectronic devices, including field effect transistors (FETs), sensors, injectors for spin-polarized currents, wires having integral multiples of the conductance quantum, and wires with zero electrical resistance. Methods of devising such quantum dragon materials and devices are also disclosed.
THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME, DISPLAY DEVICE
A thin film transistor, a method for manufacturing the same and a display device are disclosed, the thin film transistor includes: a first electrode, a second electrode, an active layer and a flexible conductive layer located on a substrate, one of the first electrode and the second electrode is a source, and the other thereof is a drain; the active layer is electrically coupled with the first electrode, and an orthographic projection of the active layer on the substrate is within an orthographic projection of the first electrode on the substrate; the flexible conductive layer is located on a side of the active layer away from the first electrode, and electrically couples the active layer with the second electrode.
METHOD FOR DEPOSITING NANOSTRUCTURES ON SUBSTRATE AND NANOSTRUCTURE ARRAYS
A method for depositing nanostructures on a substrate comprises: forming a patterned alignment layer on a surface of the substrate, wherein the patterned alignment layer has one or more cavities each having a main region for accommodating at least one template nanostructure therein and a plurality of extension regions extending from the main region and in fluid communication with the main region, and wherein the plurality of extension regions are sized and shaped to not accommodate the at least one template nanostructure; and diffusing template nanostructures into the one or more cavities of the patterned alignment layer.
Gate all around semiconductor structure with diffusion break
The current disclosure describes techniques for forming semiconductor structures having multiple semiconductor strips configured as channel portions. In the semiconductor structures, diffusion break structures are formed after the gate structures are formed so that the structural integrity of the semiconductor strips adjacent to the diffusion break structures will not be compromised by a subsequent gate formation process. The diffusion break extends downward from an upper surface until all the semiconductor strips of the adjacent channel portions are truncated by the diffusion break.
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE MOLECULAR ELECTRONICS SENSOR ARRAYS
In various embodiments of the present disclosure, a molecular electronics sensor array chip comprises: (a) an integrated circuit semiconductor chip; and (b) a plurality of molecular electronic sensor devices disposed thereon, each of said sensor devices comprising: (i) a pair of nanoscale source and drain electrodes separated by a nanogap; (ii) a gate electrode; and (iii) a bridge and/or probe molecule spanning the nanogap and connecting the source and drain electrodes, wherein the molecular electronic sensor devices are organized into an electronically addressable, controllable, and readable array of sensor pixels.
A Transducing Apparatus and Method for Providing Such Apparatus
An apparatus and method, the apparatus including a charge carrier wherein the charge carrier includes a continuous three dimensional framework including a plurality of cavities throughout the framework; sensor material provided throughout the charge carrier; wherein the sensor material is configured to transduce a detected input and change conductivity of the charge carrier in dependence of the detected input.
OFETS HAVING MULTILAYER ORGANIC SEMICONDUCTOR WITH HIGH ON/OFF RATIO
An organic field effect transistor includes a channel structure having a photoalignment layer and an organic semiconductor layer disposed directly over the photoalignment layer, where a charge carrier mobility varies along a thickness direction of the channel structure. The channel structure may define an active area between a source and a drain of the transistor and may include alternating layers of at least two photoalignment layers and at least two organic semiconductor layers. Each photoalignment layer is configured to influence an orientation of molecules within an overlying organic semiconductor layer and hence impact the mobility of charge carriers within the device active area while also advantageously decreasing the OFF current of the device.
EFFECT OF SOURCE-DRAIN ELECTRIC FIELD ON CHARGE TRANSPORT MECHANISM IN POLYMER-BASED THIN-FILM TRANSISTORS
Provided are a polymer thin-film transistor and a method of fabricating the same. Donor-acceptor copolymer-based field-effect transistors (FETs) have attracted considerable attention from technological and academic perspectives due to their low band gap, high mobility, low cost, easy solution processability, flexibility, and stretchability. Large-area films can be formed through meniscus-guided coating among various solution-processing techniques. 29-Diketopyrrolopyrrole-selenophene vinylene selenophene (29-DPP-SVS) donor-acceptor copolymer-based FETs have already shown excellent performance due to their short π-π stacking distance and strong π-π interaction. Charge carrier mobility of these types of semiconductor materials significantly depends on an applied electric field. Accordingly, detailed analysis of the electric-field dependency of charge carrier mobility is necessary to understand the transport mechanism within the material. Therefore, 29-DPP-S VS-based FETs are fabricated by varying the blade coating (BC) speed of a semiconductor layer. The effect of the BC speed on the electrical characteristics of the FETs is studied through the analysis of electric-field-dependent mobility. The results show that the charge carrier mobility of different FETs depends on the applied electric field and that the type of dependency is Poole-Frenkel. At an optimized BC speed (2 mm s.sup.−1), the device shows maximum zero-field mobility (3.39 cm.sup.2V.sup.−1s.sup.−1) due to the low trap density within the conductive channel.