Devices and methods for determining resistive states of resistive change elements in resistive change element arrays are disclosed. According to some aspects of the present disclosure the devices and methods for determining resistive states of resistive change elements can determine resistive states of resistive change elements by sensing current flow. According to some aspects of the present disclosure the devices and methods for determining resistive states of resistive change elements can determine resistive states of resistive change elements without the need for in situ selection devices or other current controlling devices. According to some aspects of the present disclosure the devices and methods for determining resistive states of resistive change elements can reduce the impact of sneak current when determining resistive states of resistive change elements.

PDI derivatives useful as opto-electronically active materials or for the synthesis of such materials. Certain compounds herein function as efficient electron acceptors and are useful as electron active components of electronic devices.

Devices and methods for determining resistive states of resistive change elements in resistive change element arrays are disclosed. According to some aspects of the present disclosure the devices and methods for determining resistive states of resistive change elements can determine resistive states of resistive change elements by sensing current flow. According to some aspects of the present disclosure the devices and methods for determining resistive states of resistive change elements can determine resistive states of resistive change elements without the need for in situ selection devices or other current controlling devices. According to some aspects of the present disclosure the devices and methods for determining resistive states of resistive change elements can reduce the impact of sneak current when determining resistive states of resistive change elements.

Devices and methods for determining resistive states of resistive change elements in resistive change element arrays are disclosed. According to some aspects of the present disclosure the devices and methods for determining resistive states of resistive change elements can determine resistive states of resistive change elements by sensing current flow. According to some aspects of the present disclosure the devices and methods for determining resistive states of resistive change elements can determine resistive states of resistive change elements without the need for in situ selection devices or other current controlling devices. According to some aspects of the present disclosure the devices and methods for determining resistive states of resistive change elements can reduce the impact of sneak current when determining resistive states of resistive change elements.

The present invention relates to semiconductor materials that include a silicon-based quantum dot; and a conjugated organic ligand connected to the silicon-based quantum dot to obtain a functionalized quantum dot. An additional aspect of the present invention is to provide methods that include providing a silicon-based quantum dot; and connecting a conjugated organic ligand connected to the silicon-based quantum dot to obtain a functionalized quantum dot.

An object of the present invention is to provide a composition for forming an organic semiconductor film that is excellent in printing properties and makes is possible to prepare an organic thin film transistor excellent in mobility and insulation reliability. Another object of the present invention is to provide an organic thin film transistor, electronic paper, and a display device. The composition for forming an organic semiconductor film of the present invention contains an organic semiconductor material, a phenolic reductant, a polymer compound having a weight-average molecular weight of equal to or greater than 500,000, a surfactant, and an organic solvent having a standard boiling point of equal to or higher than 150° C., in which a ratio of a content of the organic semiconductor material to a content of the polymer compound is 0.02 to 10 based on mass, and a ratio of a content of the phenolic reductant to the content of the polymer compound is 0.1 to 5 based on mass.

A polymer includes a first repeating unit and a second repeating unit forming a main chain, the first repeating unit including at least one first conjugated system, and the second repeating unit including at least one second conjugated system and a multiple hydrogen bonding moiety represented by Chemical Formula 1.

Various embodiments provide a method of forming an organic inverter including a first transistor and a second transistor. The method may include providing a substrate with a dielectric layer formed on top of the substrate; depositing a first semiconductor polymer layer on a first region of the dielectric layer; forming a first electrode and a second electrode on the first semiconductor polymer layer, thereby forming the first transistor located at the first region of the dielectric layer; forming a plurality of grooves on a surface of a second region of the dielectric layer; depositing a second semiconductor polymer layer on the second region of the dielectric layer; and forming a first electrode and a second electrode on the second semiconductor polymer layer, thereby forming the second transistor located at the second region of the dielectric layer.

A method and structure for providing uniform, large-area graphene by way of a transfer-free, direct-growth process. In some embodiments, a SAM is used as a carbon source for direct graphene synthesis on a substrate. For example, a SAM is formed on an insulating surface, and a metal layer is formed over the SAM. The metal layer may serve as a catalytic metal, whereby the SAM is converted to graphene following an annealing process. The SAM is deposited using a VPD process (e.g., an ALD process and/or an MLD process). In some embodiments, a CNT having a controlled diameter may be formed on the surface of a nanorod by appropriately tuning the geometry of the nanorod. Additionally, in some embodiments, a curved graphene transistor may be formed over a curved oxide surface, thereby providing a band gap in a channel region of the graphene transistor.

A method for forming a PN junction in graphene includes: forming a graphene layer, and forming a DNA molecule layer on a partial region of the graphene layer, the DNA molecule layer having a nucleotide sequence structure designed to provide the graphene layer with a predetermined doping property upon adsorption on the graphene layer. The DNA molecule has a nucleotide sequence structure designed for doping of graphene so that doped graphene has a specific semiconductor property. The DNA molecule is coated on the surface of the graphene layer of which the partial region is exposed by micro patterning, and thereby, PN junctions of various structures may be formed by a region coated with the DNA molecule and a non-coated region in the graphene layer.