Patent classifications
H10K50/814
Organic light emitting device and method for manufacturing the same
Disclosed is an organic light emitting device (OLED) that may include a first electrode including at least two conductive units, each of the at least two conductive units connected to a conductive connector of the first electrode; a second electrode facing the first electrode; a current carrying electrode electrically connected to the at least two conductive units, wherein the current carrying electrode includes a current carrying portion of the first electrode connected to the conductive connector of each of the at least two conductive units or an auxiliary electrode formed of a material different from that of the first electrode; and an organic layer between the first electrode and the second electrode; wherein the conductive connector includes an area in which a length of a direction, in which a current substantially flows, is at least ten times longer than a width of a direction vertical to the length of the direction, and wherein a resistance of the conductive connector is 400Ω or more and 300,000Ω or less.
Optical device
An optical device (10) includes a joining structure in which a first conductive film (110) and a second conductive film (130) are joined to each other. The first conductive film (110) that constitutes the joining structure is constituted by a conductive material. The second conductive film (130) that constitutes the joining structure is constituted by a metal material. A part of the second conductive film (130) comes into contact with the first conductive film (110). A plurality of concave portions are provided in a contact surface of the second conductive film (130) which comes into contact with the first conductive film (110). The contact surface has a surface roughness greater than a surface roughness of a non-contact surface of the second conductive film (130) which does not come into contact with the first conductive film (110).
FLEXIBLE PANEL
In a display device including a flexible display panel, the risk of disconnection of a wiring due to bending is reduced. A display panel includes a display function layer including display elements and a wiring on one major surface of a base material having flexibility. The display panel includes, on the one major surface of the base material, an organic-film-covered wiring area where the surface of the wiring is covered with an organic planarization film that is an organic insulating film in direct contact with the wiring. The display panel includes, in the plane thereof, a display area where the display elements are arranged and a component mounting area that is a peripheral area located outside the display area. As the organic-film-covered wiring area, a curved area is provided in the peripheral area.
FLEXIBLE PANEL
In a display device including a flexible display panel, the risk of disconnection of a wiring due to bending is reduced. A display panel includes a display function layer including display elements and a wiring on one major surface of a base material having flexibility. The display panel includes, on the one major surface of the base material, an organic-film-covered wiring area where the surface of the wiring is covered with an organic planarization film that is an organic insulating film in direct contact with the wiring. The display panel includes, in the plane thereof, a display area where the display elements are arranged and a component mounting area that is a peripheral area located outside the display area. As the organic-film-covered wiring area, a curved area is provided in the peripheral area.
FOLDABLE DISPLAY DEVICE
A display device including a flexible display module and provides a display surface on which an image is displayed. The flexible display module includes a display panel including a light-emitting device and a sensor unit disposed on the display panel. The sensor unit senses pressure applied to the flexible display module in a folded-in mode in which the flexible display module is folded such that a portion of the display surface faces another portion of the display surface.
ELECTRONIC DEVICE
The present disclosure provides an electronic device including a first metal layer, a first insulating layer, a second insulating layer, a second metal layer and a first transparent electrode. The first insulating layer is disposed on the first metal layer. The second insulating layer is disposed on the first insulating layer. The second metal layer is disposed between the first metal layer and the second insulating layer. A first via hole penetrates through the first insulating layer and the second insulating layer and exposes a portion of the first metal layer. A second via hole penetrates through the second insulating layer and exposes a portion of the second metal layer. The first transparent electrode is disposed on the second insulating layer and electrically connected to the first metal layer through the first via hole and electrically connected to the second metal layer through the second via hole.
OPTOELECTRONIC ASSEMBLY AND METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY
An optoelectronic assembly including an optically active region configured for emitting and/or absorbing light, and an optically inactive region configured for component-external contacting of the optically active region is provided. The optically inactive region includes a dielectric structure and a first electrode on or above a substrate, an organic functional layer structure on the first electrode in physical contact with the first electrode and the dielectric structure, and a second electrode in physical contact with the organic functional layer structure and above the dielectric structure, wherein the organic functional layer structure at least partly overlaps the dielectric structure in such a way that the part of the second electrode above the dielectric structure is free of a physical contact of the second electrode with the dielectric structure.
OPTOELECTRONIC DEVICE WITH A FUSE
An optoelectronic device with a first electrode is disclosed. The first electrode includes a plurality of electrode elements, which are arranged separately from one another, such that an intermediate space is located between them. The first electrode further includes a conductive structure, which is designed in such a way that it connects adjacent electrode elements to one another in an electrically conductive manner and in the process forms a fuse which acts between the connected adjacent electrode elements. The conductive structure includes a conductive structure layer, which adjoins the electrode elements and connects the adjacent electrode elements to one another in an electrically conductive manner and in the process acts as the fuse, and/or the conductive structure extends in the space between the electrode elements, and connects the adjacent electrode elements to one another in an electrically conductive manner via the intermediate space and thereby acts as the fuse.
Organic light emitting display device comprising auxiliary electrode having void therein and manufacturing method thereof
Provided are an organic light emitting display device and a manufacturing method thereof. In the organic light emitting display device, after an auxiliary electrode having a multilayer structure including different kinds of metals different in etching speed is formed, a void is formed within the auxiliary electrode upon formation of an anode. The resulting structure is created by a simplified process, with contact reliability between a cathode and the auxiliary electrode being enhanced, while resistance of the cathode is reduced.
Organic electroluminescent element having a sealing substrate, and method for producing organic electroluminescent element
Provided is an organic EL element comprising: a gas barrier layer disposed on a substrate; a light-emitting part; an inorganic sealing layer; lead-out wiring that extends outside of the inorganic sealing layer; and a sealing substrate that is bonded via a resin adhesive layer, wherein the organic EL element is configured such that above at least the lead-out wiring, the sealing substrate is folded to the substrate side and makes contact with the inorganic sealing layer, and improvement of connection reliability with external equipment is possible.