An organic light emitting diode display includes an integrated circuit, a first electrode, a spacer, an organic material stack layer, and a second electrode. The first electrode is electrically connected to the integrated circuit and has a top surface, a bottom surface, and an inclined surface connecting the top and bottom surfaces. An angle between the inclined surface and the bottom surface is in a range from about 45 degrees to about 80 degrees. The spacer is disposed to cover the inclined surface of the first electrode. The organic material stack layer is disposed on the first electrode. The second electrode is disposed on the organic material stack layer and the spacers.

A display apparatus capable of performing image capturing with high sensitivity is provided. The display apparatus includes a light-emitting element including a light-emitting layer, and a light-receiving element including a photoelectric conversion layer. A transflective electrode is provided over the light-emitting layer, and a transparent electrode is provided over the photoelectric conversion layer. With a structure where the transflective electrode does not overlap the photoelectric conversion layer, a reduction in light-receiving sensitivity of the light-receiving element can be prevented while a microcavity structure is used for the light-emitting element. Thus, the display apparatus can emit light with high color purity and perform image capturing with high sensitivity.

Methods and apparatus for forming organic light emitting diode (OLED) structures disposed on a substrate are provided. In one embodiment, a method for forming an organic light emitting diode (OLED) substrate is provided that includes forming a first conductive layer on a substrate in a first direction, forming a dielectric layer on a portion of the first conductive layer, wherein the dielectric layer includes a well having a portion of the first conductive layer exposed, depositing an organic material into the well and on the dielectric layer continuously in the second direction and between the two bus bars, and forming a second conductive layer on the organic material continuously in a second direction orthogonal to the first direction and between two bus bars, wherein the second conductive layer is in direct contact with the bus bars on opposing sides thereof; and depositing an encapsulating layer on the second conductive layer continuously in the second direction and fully cover the second conductive layer.

A light-emitting device includes, on a substrate, a red pixel electrode and a green pixel electrode, a common electrode, and a blue pixel electrode, in order from the substrate side, and includes a transparent region adjacent to a light-emitting region including a position overlapping the red light-emitting layer, the green light-emitting layer, and the blue light-emitting layer in a plan view. At least a part of the blue light-emitting layer overlaps the red light-emitting layer and the green light-emitting layer adjacent to the red light-emitting layer in the plan view.

A fluorinated polymer suitable for deposition and capable of favorable metal patterning, is provided. A resin film containing such a fluorinated polymer as a material is provided. Further, a photoelectronic element having such a resin film in its structure is provided.

A fluorinated polymer which satisfies the following requirements (1) to (3): (1) the melting point is less than 200° C., or no melting point is observed, (2) the thermogravimetric loss rate when the temperature is increased at a temperature-increasing rate of 2° C./min under a pressure of 1×10.sup.−3 Pa, substantially reaches 100% at 400° C. or lower, (3) when the temperature is increased at a temperature-increasing rate of 2° C./min under a pressure of 1×10.sup.−3 Pa, the temperature width from a temperature at which the thermogravimetric loss rate is 10% to a temperature at which it is 90%, is within 200° C.

A conductor includes a plurality of metal nanostructures and an organic material, where a portion of the organic material surrounding each of the metal nanostructures is selectively removed, and the conductor has a haze of less than or equal to about 1.1, a light transmittance of greater than or equal to about 85% at about 550 nm, and a sheet resistance of less than or equal to about 100 Ω/sq. An electronic device includes the conductor, and a method of manufacturing a conductor includes preparing a conductive film including a metal nanostructure and an organic material, and selectively removing the organic material from the conductive film using a cluster ion beam sputtering.

The invention relates to novel organic semiconducting compounds containing a polycyclic unit, to methods for their preparation and educts or intermediates used therein, to compositions, polymer blends and formulations containing them, to the use of the compounds, compositions and polymer blends as organic semiconductors in, or for the preparation of, organic electronic (OE) devices, especially organic photovoltaic (OPV) devices, perovskite-based solar cell (PSC) devices, organic photodetectors (OPD), organic field effect transistors (OFET) and organic light emitting diodes (OLED), and to OE, OPV, PSC, OPD, OFET and OLED devices comprising these compounds, compositions or polymer blends.

An display device includes a cover window including a display area and an attaching area, at least one display panel in the display area of the cover window, a first black matrix in an edge area of the display area and the attaching area, a second black matrix in the attaching area over the first black matrix, and an adhesive on the second black matrix, wherein a first difference of coefficient of thermal expansion between the second black matrix and the adhesive is small than a second difference of coefficient of thermal expansion between the first black matrix and the adhesive.

A display substrate and a manufacturing method therefor, and a display device. The display substrate comprises: a substrate, the substrate comprising a blind hole area; a buffer layer covering one side of the substrate; an organic film layer provided on the surface of the buffer layer away from the substrate and having a first opening in the blind hole area; a passivation layer provided on the side of the organic film layer away from the substrate and having a second opening in the blind hole area; and a transparent electrode layer covering the passivation layer and the buffer layer in the second opening.

A light-emitting structure includes a substrate, a sub-pixel stack over a surface of the substrate, and a bank including a first bank portion and a second bank portion. The sub-pixel stack has an emissive stack including an emissive layer between a first transport layer and a second transport layer, a first electrode layer coupled to the first transport layer, and a second electrode layer coupled to the second transport layer. The second bank portion is between the first bank portion and the sub-pixel stack, and the bank surrounding at least the emissive stack and the first electrode layer forms an interior space above the sub-pixel stack.