An organic light-emitting display apparatus including a substrate having a display area and a peripheral area; a TFT in the display area; an organic insulating layer on the TFT; an OLED that includes a pixel electrode electrically connected to the TFT, an emission layer on the pixel electrode, and a counter electrode facing the pixel electrode with the emission layer therebetween; a pixel-defining layer on the organic insulating layer and having an opening overlying the pixel electrode; a first dam in the peripheral area; a second dam in the peripheral area to surround an outer periphery of the first dam; a metal-containing layer covering the first dam and including a same material as the pixel electrode; and a thin-film encapsulator on the substrate to cover the OLED and including a first and second inorganic films, and an organic film between the first and second inorganic films.

The present invention provides an organic light-emitting diode (OLED) display panel including a substrate, a thin-film transistor, an insulating layer, an auxiliary electrode, an organic light-emitting layer, a shielding stage, and a common electrode. The common electrode is electrically connected to the auxiliary electrode. The shielding stage includes at least one organic material layer. An angle between the shielding stage and the substrate is a threshold value.

A foldable display apparatus, a method of manufacturing the same, and a controlling method of the same are disclosed. The foldable display apparatus includes a substrate including a metal thin film and an insulating layer provided on the metal thin film, an organic light-emitting unit formed on the substrate and emitting light in an direction away from the substrate, and a thin film encapsulating layer for encapsulating the organic light-emitting unit. The foldable display apparatus may be folded in a direction such that the metal thin film is exposed.

A flexible device with fewer defects caused by a crack is provided. A flexible device with high productivity is also provided. Furthermore, a flexible device with less display failure even in a high temperature and high humidity environment is provided. A light-emitting device includes a first flexible substrate, a second flexible substrate, a buffer layer, a first crack inhibiting layer, and a light-emitting element. A first surface of the first flexible substrate faces a second surface of the second flexible substrate. The buffer layer and the first crack inhibiting layer are provided over the first surface of the first flexible substrate. The buffer layer overlaps with the first crack inhibiting layer. The light-emitting element is provided over the second surface of the second flexible substrate.

A display apparatus can include at least one light-emitting device on a device substrate, an encapsulating element on the device substrate and covering the light-emitting device, an encapsulation substrate on the encapsulating element and including a metal, and a surface particle layer surrounding at least a portion of the encapsulation substrate. The surface particle layer can include metal particles dispersed at a surface of the encapsulation substrate. The surface particle layer can have a thermal conductivity that is higher than a thermal conductivity of the encapsulation substrate.

Disclosed aspects relate to a display device. By forming a back cover, which is the support structure constituting the display device, in a bent structure and forming a molding part made of an elastic material to enclose the vertical extension portion, a border gap, which is a clearance between the side surfaces of the display panel and the side surface support structure, can be minimized to maintain an excellent external appearance of the display device, and to prevent infiltration of foreign matter and damage of the display panel, which may be caused by the gap between the display panel and the support structure. By disposing a metal inner plate on the inner surface of the horizontal portion of the back cover, the rigidity of the back cover can be increased, the thickness of the back cover can be decreased, and heat generated from the display panel and the like can be smoothly dissipated.

A method for producing an optoelectronic component may include forming an optoelectronic layer structure having a first adhesion layer, which comprises a first metallic material, above a carrier, providing a covering body with a second adhesion layer, which comprises a second metallic material, applying a first alloy to one of the two adhesion layers, the melting point of the first alloy being so low that the first alloy is liquid, coupling the covering body to the optoelectronic layer structure in such a way that both adhesion layers are in direct contact with the liquid first alloy, and reacting at least part of the liquid first alloy chemically with the metallic materials, as a result of which at least one second alloy is formed, which has a higher melting point than the first alloy, wherein the second alloy solidifies and fixedly connects the covering body to the optoelectronic layer structure.

A method is disclosed for forming multi-layered structures on polymeric or other materials that provide optical functions or protect underlying layers from exposure to oxygen and water vapor. Novel devices are also disclosed that may include both multi-layered protective structures and AMOLED display, OLED lighting or photovoltaic devices. The protective multi-layer structure itself may be made by depositing successively on a substrate at least three very thin layers of material with different density or composition. In some methods for deposition of such film, the layers are deposited by varying the energy of ion bombardment per unit thickness of the film. Any layer of the structure may include one or more of the materials: silicon nitride, silicon oxide, silicon oxynitride, or metallic nitride or oxide. Specific commercial applications that benefit from this include manufacturing of photovoltaic devices or organic light emitting diode devices (OLED) including lighting and displays.

There is provided a metal encapsulation structure and a production method thereof, an encapsulation method for a display panel, and a display device. This production method comprises steps of: providing a metal film having a first surface and a second surface opposite to the first surface; forming a silane film on the first surface of the metal film, wherein a surface of the silane film away from the metal film has an active group; and attaching the first surface formed with the silane film to an adhesive layer, so as to react and bond the active group and the adhesive layer.

An optoelectronic assembly including an optically active region configured for emitting and/or absorbing light, and an optically inactive region configured for component-external contacting of the optically active region is provided. The optically inactive region includes a dielectric structure and a first electrode on or above a substrate, an organic functional layer structure on the first electrode in physical contact with the first electrode and the dielectric structure, and a second electrode in physical contact with the organic functional layer structure and above the dielectric structure, wherein the organic functional layer structure at least partly overlaps the dielectric structure in such a way that the part of the second electrode above the dielectric structure is free of a physical contact of the second electrode with the dielectric structure.