A packaging cover plate and a manufacturing method thereof, a display panel, and a display device are provided. The packaging cover plate includes: a packaging sheet including a first surface and a second surface opposite to each other. The first surface of the packaging sheet is provided with at least one first channel, the second surface of the packaging sheet is provided with at least one second channel, and an extension direction of the first channel is parallel to an extension direction of the second channel. An orthographic projection of the at least one first channel on the packaging sheet and an orthographic projection of the at least one second channel on the packaging sheet are arranged alternately, and a sum of a depth of the first channel and a depth of the second channel is not less than a thickness of the packaging sheet.

An organic light-emitting display device including an encapsulating layer covering a light-emitting element and an encapsulating substrate on the encapsulating layer is provided. The organic light-emitting display device may include metal particles which are dispersed on an outer surface of the encapsulating substrate having a high thermal conductivity, so that damage of the light-emitting element due to external impact may be prevented. And, the organic light-emitting display device may include a capping layer covering the metal particles, so that the surface roughness due to the metal particles may be reduced.

A display panel is provided, the display panel including a back plate, a cover plate, a first spacer, and a second spacer, wherein the back plate has a first surface, the cover plate is disposed opposite the back plate and has a second surface opposite the first surface, the first spacer protrudes from an edge of the first surface and has a closed structure, a first connecting end, and a first free end, the first connecting end connected to the back plate, and the first free end extending away from the back plate, the second spacer protrudes from an edge of the second surface and has a closed structure, a second connecting end, and a second free end, the second connecting end connected to the cover plate, and the second free end extending away from the cover plate, and the first free end presses against the second free end.

An optoelectronic assembly including an optically active region configured for emitting and/or absorbing light, and an optically inactive region configured for component-external contacting of the optically active region is provided. The optically inactive region includes a dielectric structure and a first electrode on or above a substrate, an organic functional layer structure on the first electrode in physical contact with the first electrode and the dielectric structure, and a second electrode in physical contact with the organic functional layer structure and above the dielectric structure, wherein the organic functional layer structure at least partly overlaps the dielectric structure in such a way that the part of the second electrode above the dielectric structure is free of a physical contact of the second electrode with the dielectric structure.

A detection device includes a substrate, a plurality of detection electrodes arranged in a detection area of the substrate, an organic semiconductor layer that covers the detection electrodes, and a counter electrode provided above the organic semiconductor layer. The organic semiconductor layer includes at least either of a first p-type semiconductor layer and a first n-type semiconductor layer, and an active layer. The active layer is provided in each overlapping area overlapping a corresponding one of the detection electrodes, and has a structure in which a p-type semiconductor area and an n-type semiconductor area are mixed and coexist. The first p-type semiconductor layer or the first n-type semiconductor layer is provided in a non-overlapping area not overlapping the detection electrode, and is provided between the adjacent active layers.

A display device includes a first substrate including at least one first opening part defined, a pixel disposed on the first substrate, at least one first heat dissipation layer disposed in the at least one first opening part, an insulation layer disposed under the first substrate and including at least one second opening part overlapping the at least one first opening part, and a second heat dissipation layer disposed in the at least one second opening part.

To realize a high-performance liquid crystal display device or light-emitting element using a plastic film. A CPU is formed over a first glass substrate and then, separated from the first substrate. A pixel portion having a light-emitting element is formed over a second glass substrate, and then, separated from the second substrate. The both are bonded to each other. Therefore, high integration can be achieved. Further, in this case, the separated layer including the CPU serves also as a sealing layer of the light-emitting element.

A display substrate and a method for manufacturing the same are provided. The display substrate includes a base substrate and a display element provided on the base substrate. The method includes steps of forming a first protection layer at at least one of outer peripheral sides of the base substrate, and removing the first protection layer before attaching a cover plate to the base substrate on which the display element is provided.

The disclosure relates to display panel and display apparatus including the same. The display panel includes a substrate including a display part displaying an image, an adhesive layer covering the display part, on the substrate, and a heat dissipation member on the adhesive layer. The heat dissipation member includes a first metal layer, a middle layer including an organic layer and a plurality of partition walls provided on the first metal layer, and a second metal layer provided on the middle layer.

An organic light emitting diode display is disclosed. The organic light emitting diode display includes: a substrate, an organic light emitting diode positioned on the substrate, a metal layer positioned on the substrate with the organic light emitting diode interposed therebetween, and a resin layer positioned on the metal layer and configured to reinforce a strength of the metal layer.