Patent classifications
H10K50/8423
Buffer Film
A buffer film and an organic light emitting device (OLED) including the same are disclosed herein. In some embodiments, a buffer film comprises a porous metal sheet having average reflectance of 50% or less for light in a wavelength range of 400 to 800 nm. The buffer film can exhibit heat dissipation properties, electromagnetic wave shielding properties and impact resistance (or impact mitigation properties) required for an OLED. The buffer film is capable of securing the characteristics required for an OLED without price increase, process complexity, and thickness increase of the OLED.
Display panel comprising heat dissipation member and display apparatus including the same
The disclosure relates to display panel and display apparatus including the same. The display panel includes a substrate including a display part displaying an image, an adhesive layer covering the display part, on the substrate, and a heat dissipation member on the adhesive layer. The heat dissipation member includes a first metal layer, a middle layer including an organic layer and a plurality of partition walls provided on the first metal layer, and a second metal layer provided on the middle layer.
Organic light emitting diode display device
Discussed is an organic light emitting diode display device, including a display panel including an array substrate configured to display an image, a face sealing metal layer under the array substrate, and a protecting substrate under the face sealing metal layer, wherein the array substrate generates heat, and the generated heat is transferred from the array substrate to the protecting substrate via the face sealing metal layer to be radiated by the protecting substrate; and a printed circuit board under the protecting substrate, wherein an end portion of the array substrate, an end portion of the face sealing metal layer and an end portion of the protecting substrate form a stepped structure.
Flexible display screen assembly and flexible display device
A flexible display screen assembly is disclosed. The flexible display screen assembly includes: a frame; and a flexible display screen adapted to the frame. The flexible display screen includes at least one first fixing member, and the frame includes at least one second fixing member that cooperates with the at least one first fixing member. The flexible display screen includes a functional film, and the at least one first fixing member is disposed on the functional film.
PACKAGING COVER PLATE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL, AND DISPLAY DEVICE
A packaging cover plate and a manufacturing method thereof, a display panel, and a display device are provided. The packaging cover plate includes: a packaging sheet (00) including a first surface and a second surface opposite to each other. The first surface of the packaging sheet (00) is provided with at least one first channel (001), the second surface of the packaging sheet (00) is provided with at least one second channel (002), and an extension direction of the first channel (001) is parallel to an extension direction of the second channel (002). An orthographic projection of the at least one first channel (001) on the packaging sheet (00) and an orthographic projection of the at least one second channel (002) on the packaging sheet (00) are arranged alternately, and an sum of a depth (h1) of the first channel (001) and a depth (h2) of the second channel (002) is not less than a thickness (H) of the packaging sheet (00).
Display panel, method for manufacturing the same and display apparatus having discontinuous thin film package layers over display devices
A display panel, a method for manufacturing the same and a display device are provided. The display panel includes: a substrate; a plurality of display devices on a side of the substrate; and a plurality of thin film package layers on a side of the display devices distal to the substrate and cover the plurality of display devices. Orthographic projections of the plurality of thin film package layers on the substrate are discontinuous. At least one of the plurality of thin film package layers covers at least one of the plurality of display devices.
Sealing structure and sealing method, electronic device and sealing layer recycling method
A sealing structure, a sealing method, an electronic device and a sealing layer recycling method are provided. The sealing structure is configured for sealing a functional device and includes a sealing layer and a stripping adhesive layer. The sealing layer covers the functional device; the stripping adhesive layer is bonded between the sealing layer and the functional device, and the stripping adhesive layer has a changeable stickiness to assist stripping off of the sealing layer.
Encapsulation film and method for encapsulating organic electronic device using same
Provided are an encapsulation film, a product for encapsulating an organic electronic device (OED) using the same, and a method of encapsulating an OED. The encapsulation film may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability due to increases in a lifespan and durability of the OED, and minimize align errors in a process of attaching the film to a substrate.
Organic light-emitting display device having an adhesive layer between a lower substrate and an upper substrate
An organic light-emitting display device capable to improving the reliability is provided. The organic light-emitting display device may include an adhesive layer between a lower substrate and an upper substrate. Corner regions of the adhesive layer relatively disposed close to an edge of the lower substrate may include cutting portion, respectively. An align key may be disposed on the lower substrate exposed by the cutting portion of the corner region.
DISPLAY PANEL AND METHOD FOR FABRICATING SAME
A display panel and a method for fabricating the same are provided, comprising: a substrate; at least two light-emitting units of different types disposed over the substrate; and an encapsulation layer. The encapsulation layer comprises a first moisture-blocking layer disposed over the substrate, covering the light-emitting units; a buffer layer disposed over the first moisture-blocking layer, wherein the buffer layer having different thicknesses corresponding to the light-emitting units of different types; and a second moisture-blocking layer disposed over the substrate, covering the buffer layer and the first moisture-blocking layer. The thickness of the buffer layer corresponding to light-emitting units of different types is adjusted to adjust the optical microcavity length of different light-emitting units of different types, thereby improving the device performance of the display panel.