Patent classifications
H10K50/8445
ENCAPSULATION LAYER HAVING LOW REFRACTIVE INDEX LAYER AND DISPLAY DEVICE HAVING THE SAME
A display device includes a plurality of light emitting elements which provide source light, a plurality of light control parts which respectively correspond to the plurality of light emitting elements and have a refractive index, each of the plurality of light control parts receiving the source light and outputting a light having a color, and an encapsulation layer which is between the plurality of light emitting elements and the plurality of light control parts. The encapsulation layer includes in order from the plurality of light emitting elements to the plurality of light control parts, a first inorganic film and a low-refractive index organic film which contacts the first inorganic film and has a refractive index lower than the refractive index of the plurality of light control parts.
Electronic apparatus
An electronic apparatus includes: an electronic panel comprising a display unit comprising a plurality of pixels and a sensing unit comprising a plurality of sensing electrodes; and an electronic module overlapping with the electronic panel when viewed in a plan view, the sensing unit comprising: a base substrate comprising a hole area overlapping with the electronic module, an active area overlapping with the sensing electrodes, and a peripheral area adjacent to the active area; a connection line in the hole area and connected to a portion of the sensing electrodes; and a conductive light blocking pattern in the hole area and spaced apart from the connection line and the sensing electrodes.
Display device including two inorganic layers and an outer barrier arranged on a substrate
An organic light emitting diode device can have an enhanced thin film encapsulation layer for preventing moisture from permeating from the outside. The thin film encapsulation layer can have a multilayered structure in which one or more inorganic layers and one or more organic layers are alternately laminated. A barrier can be formed outside of a portion of the substrate on which the organic light emitting diode is formed. The organic layers of the thin film encapsulation layer can be formed inside an area defined by the barrier.
OLED display motherboard and method for manufacturing the same, method for manufacturing OLED display panel and OLED display device thereof
The present disclosure provides an OLED display motherboard and a method for manufacturing the same, a method for manufacturing the OLED display panel, and an OLED display device thereof. The OLED display motherboard includes a base substrate having a display region and a non-display region surrounding the display region, a TFT and an OLED device located within the display region of the base substrate, at least two crack stop slits located within the non-display region of the base substrate, an extending direction of the crack stop slit being the same as an extending direction of an edge of the display region of the base substrate, and adjacent crack stop slits being separated by a crack stop slit step, and an encapsulation layer covering the crack stop slit and the OLED device. A portion of the encapsulation layer has a non-uniform thickness.
DISPLAY APPARATUS AND LIGHT ABSORBER INCLUDED IN DISPLAY APPARATUS
A display apparatus according to an embodiment includes light-emitting devices and an encapsulation member, wherein the encapsulation member includes a light absorber including a hexagonal heterocycle containing two or more nitrogen atoms as ring-forming atoms, and first to third substituents substituted at the hexagonal heterocycle, the first to third substituents being different from one another, and thus can effectively block external light, thereby exhibiting improved reliability.
Display device
Provided is a display device capable of preventing or reducing short-circuiting in an alternating high and low temperature environment. The display device is configured to display an image in a display region and includes: an insulating substrate; conductive lines provided on the insulating substrate and extending from the display region to a frame region exterior to the display region; a driver provided in the frame region and connected to the conductive lines; an organic protective film overlapping the conductive lines and extending from the display region to a region between the display region and the driver; an anisotropic conductive film provided under the driver and covering an end of the organic protective film between the display region and the driver; and a moisture-proof resin film overlapping the anisotropic conductive film and covering the end of the organic protective film between the display region and the driver.
DISPLAY DEVICE
A display device includes a substrate; a first electrode disposed on the substrate; a bank layer disposed on the substrate and including an opening exposing the first electrode; an emissive layer disposed on the first electrode exposed by the bank layer; a second electrode disposed on the bank layer and the emissive layer; an encapsulation layer disposed on the second electrode; and a touch layer disposed on the encapsulation layer, in which the encapsulation layer includes at least one inorganic film and at least one organic film, and in which the organic film contains organic molecules having an oval shape.
OLED encapsulation structure, protective film therefor, and manufacturing method of the protective film
The present invention discloses an organic light-emitting diode (OLED) encapsulation structure, a protective film therefor, and a manufacturing method of the protective film, the protective film includes a base film and an auxiliary film disposed on at least two opposite sides of the base film, and connected to the base film, wherein the auxiliary film is softer than the base film, and when the protective film covers the OLED encapsulation structure, the base film covers a top portion of the OLED encapsulation structure, and the auxiliary film covers at least two opposite sides of the OLED encapsulation structure.
ENCAPSULATION STRUCTURE, ENCAPSULATION METHOD, ELECTROLUMINESCENT DEVICE, AND DISPLAY DEVICE
An encapsulation structure, an encapsulation method, an electroluminescent device, and display equipment, which relate to the technical field of displays. The encapsulation structure comprises: a first inorganic dielectric layer (1), wherein the first inorganic dielectric layer (1) has a surface attached to a surface of a cathode layer (4) of an electroluminescent device; a chromatic dispersion relationship between the first inorganic dielectric layer (1), the cathode layer (4) and an electron injection layer (5) of the electroluminescent device meets a preset condition; the preset condition is used for defining an optical parameter of a first interface, the optical parameter is related to chromatic dispersion, and the optical parameter is used for coupling surface plasmon polaritons on interfaces on both sides of the cathode layer (4); and the first interface is an interface between the first inorganic dielectric layer (1) and the cathode layer (4).
Display device including inorganic insulting layer in bending area
A display device includes (i) a substrate having a first area, a second area, and a bending area located between the first area and the second area, where the substrate is bent along a bending axis in the bending area, the substrate includes a thin portion at an edge portion of the bending area, and the thin portion extends from the second area to the first area and has a thickness less than a thickness of the substrate at a center of the bending area; and (ii) an inorganic insulating layer over the substrate, where the inorganic insulating layer exposes the thin portion in the bending area.