The present specification is drawn to an organic light emitting device and a method of manufacturing the same. The organic light emitting device includes a short circuit preventing layer provided on a substrate; a first electrode provided on the short circuit preventing layer, and including two or more conductive units provided to be separated from each other; a second electrode provided opposite to the first electrode; one or more organic material layers provided between the first electrode and the second electrode; and an auxiliary electrode. The short circuit preventing layer electrically connects the auxiliary electrode and the first electrode to control the quantity of leakage current even when a short-circuit defect occurs in the conductive unit.

The embodiments of the invention provide a wiring structure, an array substrate and manufacturing method thereof, and a display panel, relate to the field of display technology, and can reduce the resistance of the wiring structure while reducing the wire width of the wiring structure. The wiring structure includes a first metal wire and a second metal wire disposed in a stack; wherein the first metal wire and the second metal wire are in direct contact.

A lighting apparatus using an organic light-emitting diode and a method of fabricating the same are characterized in that an organic emissive material and a conductive film used as a cathode are deposited on the entire surface of a substrate, and then an organic emissive layer in a lighting area and contact areas becomes separated (disconnected or cut) by laser ablation, simultaneously with the formation of a contact hole for contact with an anode. Next, cathode contact and encapsulation processes are performed using an adhesive containing conductive particles and a metal film. This simplifies the fabrication process of the lighting apparatus without using an open mask (metal mask), which is a complicated tool, thus making it useful especially in roll-to-roll manufacturing.

The present specification relates to an organic light emitting device.

Disclosed is an organic light emitting device (OLED) that may include a first electrode on a substrate, the first electrode having a pattern of a plurality of cells, with each cell defined with an emitting area and a non-emitting area; a second electrode facing the first electrode; an organic layer between the first electrode and the second electrode; a short-circuit preventing layer contacting at least a portion of the first electrode; and an auxiliary electrode on the short-circuit preventing layer in the non-emitting area of each cell, wherein an aperture ratio of the short-circuit preventing layer and the auxiliary electrode in each cell is 30% or more.

An opto-electronic device includes: (1) a substrate including a first region and a second region; and (2) a conductive coating covering the second region of the substrate. The first region of the substrate is exposed from the conductive coating, and an edge the conductive coating adjacent to the first region of the substrate has a contact angle that is greater than about 20 degrees.

The method is for producing a flexible display device, the flexible display device including a first flexible base material and a second flexible base material which are attached to each other by a first adhesive layer, the method including the following steps (1) to (4) in the order given: (1) forming a conductive line and terminals; (2) forming a removal layer to directly cover the terminals; (3) sequentially arranging multiple layers including the first adhesive layer and the second flexible base material, with higher interfacial adhesions present between the removal layer and the second flexible base material than the interfacial adhesion between the removal layer and the terminals; and (4) exposing the terminals.

A display panel and a display device are provided. The display panel includes a base substrate and a conductive member, wherein the conductive member is located on the base substrate and includes a first conductive sub-layer, a second conductive sub-layer and a third conductive sub-layer stacked in sequence; the first conductive sub-layer is closer to the base substrate than the third conductive sub-layer; a conductivity of the first conductive sub-layer is smaller than that of the second conductive sub-layer, and a melting point of the third conductive sub-layer is larger than that of the second conductive sub-layer; the second conductive sub-layer includes a first surface close to the first conductive sub-layer and a second surface close to the third conductive sub-layer, the first surface and the second surface are oppositely arranged; the third conductive sub-layer protrudes from the second surface along a width direction of the conductive member.

A first device that may include a short tolerant structure, and methods for fabricating embodiments of the first device, are provided. A first device may include a substrate and a plurality of OLED circuit elements disposed on the substrate. Each OLED circuit element may include a fuse that is adapted to open an electrical connection in response to an electrical short in the pixel. Each OLED circuit element may comprise a pixel that may include a first electrode, a second electrode, and an organic electroluminescent (EL) material disposed between the first and the second electrodes. Each of the OLED circuit elements may not be electrically connected in series with any other of the OLED circuit elements.

A light-emitting device having the quality of an image high in homogeneity is provided. A printed wiring board (second substrate) (107) is provided facing a substrate (first substrate) (101) that has a luminous element (102) formed thereon. A PWB side wiring (second group of wirings) (110) on the printed wiring board (107) is electrically connected to element side wirings (first group of wirings) (103, 104) by anisotropic conductive films (105a, 105b). At this point, because a low resistant copper foil is used to form the PWB side wiring (110), a voltage drop of the element side wirings (103, 104) and a delay of a signal can be reduced. Accordingly, the homogeneity of the quality of an image is improved, and the operating speed of a driver circuit portion is enhanced.