Patent classifications
H10N10/8556
THERMOELECTRIC DEVICES, SYSTEMS AND METHODS
comprises forming a mask adjacent to a substrate. The mask can include three-dimensional structures phase-separated in a polymer matrix. The three-dimensional structures can be removed to provide a plurality of holes in the polymer matrix. The plurality of holes can expose portions of the substrate. A layer of a metallic material can be deposited adjacent to the mask and exposed portions of the substrate. The mask can then be removed. The metallic material is then exposed to an oxidizing agent and an etchant to form holes or wires in the substrate.
Anisotropically elongated thermoelectric material, process for preparing the same, and device comprising the material
An anisotropically elongated thermoelectric nanocomposite includes a thermoelectric material.
Half-Heusler Compounds for Use in Thermoelectric Generators
A thermoelectric generator includes a hot side heat exchanger, a cold side heat exchanger, a plurality of n-type semiconductor legs arranged between the hot side heat exchanger and the cold side heat exchanger, and a plurality of p-type semiconductor legs arranged between the hot side heat exchanger and the cold side heat exchanger and alternating electrically in series with the plurality of n-type semiconductor legs. At least one of the plurality of n-type semiconductor legs and the plurality of p-type semiconductor legs is formed of an alloy having a half-Heusler structure and comprising Si and Sn with molar fractions of x Sn and 1-x Si, and x is less than 1.
Mg—Si system thermoelectric conversion material, method for producing same, sintered body for thermoelectric conversion, thermoelectric conversion element, and thermoelectric conversion module
Provided are: an MgSi system thermoelectric conversion material which exhibits stably high thermoelectric conversion performance; a sintered body for thermoelectric conversion, which uses this MgSi system thermoelectric conversion material; a thermoelectric conversion element having excellent durability; and a thermoelectric conversion module. A method for producing an MgSi system thermoelectric conversion material according to the present invention comprises a step for heating and melting a starting material composition that contains Mg, Si, Sb and Zn. It is preferable that the contents of Sb and Zn in the starting material composition are respectively 0.1-3.0 at % in terms of atomic weight ratio.
High mobility transport layer structures for rhombohedral Si/Ge/SiGe devices
An electronic device includes a trigonal crystal substrate defining a (0001) C-plane. The substrate may comprise Sapphire or other suitable material. A plurality of rhombohedrally aligned SiGe (111)-oriented crystals are disposed on the (0001) C-plane of the crystal substrate. A first region of material is disposed on the rhombohedrally aligned SiGe layer. The first region comprises an intrinsic or doped Si, Ge, or SiGe layer. The first region can be layered between two secondary regions comprising n+doped SiGe or n+doped Ge, whereby the first region collects electrons from the two secondary regions.
HYBRID PROPULSION POWER SYSTEM FOR AERIAL VEHICLES
This disclosure generally relates to a hybrid solid-state propulsion system for aerial vehicles which includes a thermoelectric generator. The thermoelectric generator includes a first heat exchanger disposed within an exhaust duct of an unmanned aerial vehicle. The thermoelectric generator further includes a first ceramic layer disposed on the first heat exchanger and a first and second metal tab bonded to the first ceramic layer. The thermoelectric generator further includes a second metal tab bonded to a second ceramic layer. At least one N-type thermoelectric leg is disposed between the first metal tab bonded to the first ceramic layer and the metal tab bonded to the second ceramic layer. Further, at least one P-type thermoelectric leg is disposed between the second metal tab bonded to the first ceramic layer and the metal tab bonded to the second ceramic layer.
Thermoelectric devices having reduced thermal stress and contact resistance, and methods of forming and using the same
A method includes preparing a thermoelectric material including p-type or n-type material and first and second caps including transition metal(s). A powder precursor of the first cap can be loaded into a sintering die, punches assembled thereto, and a pre-load applied to form a first pre-pressed structure including a first flat surface. A punch can be removed, a powder precursor of the p-type or n-type material loaded onto that surface, the punch assembled to the die, and a second pre-load applied to form a second pre-pressed structure including a second substantially flat surface. The punch can be removed, a powder precursor of the second cap loaded onto that surface, the first punch assembled to the die, and a third pre-load applied to form a third pre-pressed structure. The third pre-pressed structure can be sintered to form the thermoelectric material; the first or second cap can be coupled to an electrical connector.
Silicide-based alloy material and device in which the silicide-based alloy material is used
A silicide-based alloy material and a device in which the silicide-based alloy material is used are disclosed. The silicide-based alloy material can reduce environmental impact and provide high thermoelectric FIGURE of merit at room temperature. Provided is a silicide-based alloy material comprising, as major components, silver, barium and silicon, wherein atomic ratios of elements that constitute the alloy material are as follows: 9 at %Ag/(Ag+Ba+Si)27 at %, 20 at %Ba/(Ag+Ba+Si)53 at %, and 37 at %Si/(Ag+Ba+Si)65 at %, where Ag represents a content of the silver, Ba represents a content of the barium and Si represents a content of the silicon, and the silicide-based alloy material has an average grain size of less than or equal to 20 m.
Thermoelectric element
A thermoelectric element according to an embodiment of the present invention comprises: a first substrate; a first insulating layer disposed on the first substrate; a second insulating layer disposed on the first insulating layer; a first electrode disposed on the second insulating layer; a semiconductor structure disposed on the first electrode; a second electrode disposed on the semiconductor structure; and a second substrate disposed on the second electrode, wherein the composition of the first insulating layer is different from the composition of the second insulating layer, the first insulating layer includes a first region disposed on the first substrate and a second region disposed between the first region and the second insulating layer, and a particle size (D50) of an inorganic filler included in the second region is greater than the particle size (D50) of an inorganic filler included in the first region.
THERMOELECTRIC GENERATOR
A thermoelectric generator includes: a substrate; a thermoelectric conversion film on the substrate; a thermally insulating film that covers the thermoelectric conversion film; a first heat transfer material that transfers a first heat above the thermally insulating film to a first portion of the thermoelectric conversion film; and a second heat transfer material that transfers a second heat below the substrate to a second portion of the thermoelectric conversion film, the second portion being separated from the first portion.