A metal strip and a coil coating process for multilayer coating of an endless metal strip are disclosed in which a curable polymer primer is applied to a flat side of the metal strip with the aid of a roller application in order to form an electrically insulating primer layer, a curable polymer varnish is applied to this primer layer with the aid of a roller application and cured in order to form an electrically insulating: varnish layer, and at least one electric conductor layer is printed at least in some areas between the primer layer and the varnish layer. In order to enable a stable and inexpensive electrical functionalization of a metal strip, it is proposed that an electrically polarizable layer be applied to at least some regions of the electric conductor layer and that the electric conductor layer and electrically polarizable layer be applied by means of a wet-in-wet process.

Systems, devices, and methods for wirelessly delivering haptic effects are provided. The devices may include haptic actuators secured to various substrates, including the body and clothing of a user. The haptic actuators may be secured via adhesive and/or may be applied as a curable liquid. The haptic actuators may include an actuator element and a power element. The power element may include an antenna for receiving wireless power and control signals that may be transferred to the haptic actuator to cause a haptic effect.

An actuator assembly includes a primary electrode, a secondary electrode overlapping at least a portion of the primary electrode, and an electroactive polymer layer disposed between the primary electrode and the secondary electrode, where the electroactive polymer layer includes a non-vertical (e.g., sloped) sidewall with respect to a major surface of at least one of the electrodes. The electroactive polymer layer may be characterized by a non-axisymmetric shape with respect to an axis that is oriented orthogonal to an electrode major surface.

An actuator assembly includes a primary electrode, a secondary electrode overlapping at least a portion of the primary electrode, and an electroactive polymer layer disposed between the primary electrode and the secondary electrode, where the electroactive polymer layer includes a non-vertical (e.g., sloped) sidewall with respect to a major surface of at least one of the electrodes. The electroactive polymer layer may be characterized by a non-axisymmetric shape with respect to an axis that is oriented orthogonal to an electrode major surface.

An electroactive device may include (1) an electroactive polymer element having a first surface and a second surface opposite the first surface, the electroactive polymer element comprising a nanovoided polymer material, (2) a primary electrode abutting the first surface of the electroactive polymer element, and (3) a secondary electrode abutting the second surface of the electroactive polymer element. The electroactive polymer element may be deformable from an initial state to a deformed state by application of an electrostatic field produced by a potential difference between the primary electrode and the secondary electrode. Various other devices, systems, and methods are also disclosed.

A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. A first patterned electrode is deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the first electrode and a planarized support layer is deposited over the sacrificial layer, which is then bonded to a substrate wafer. The crystalline substrate is removed and a second patterned electrode is deposited over a second surface of the film. The sacrificial layer is etched to release the air reflection cavity. Also, a cavity can instead be etched into the support layer prior to bonding with the substrate wafer. Alternatively, a reflector structure can be deposited on the first electrode, replacing the cavity.

An ultrasonic sensor includes a vibration plate that includes a vibration portion and is formed of a resin; a wall portion that is provided on the vibration plate, surrounds the vibration portion and is formed of a resin; and a piezoelectric element that is provided in the vibration portion of the vibration plate. Accordingly, the wall portion surrounding the vibration portion can suppress a frequency variation of an ultrasonic wave output from the ultrasonic sensor and can deform the ultrasonic sensor into a shape corresponding to a surface of an object having various shapes.

A method for manufacturing a piezoelectric element for generating electricity upon flexing of the element including the steps spin-coating a first substrate layer onto a support substrate; depositing a first electrode film onto the first substrate layer; spin coating polyvinylidene fluoride (PVDF) containing solution on the first electrode film to result in a PVDF film; annealing the PVDF film; depositing a second electrode film onto the PVDF film; spin-coating a second substrate layer on top of the second electrode film; forming a hole through the first and second substrate layers; filling the hole with silver paste to contact to the first and second electrode layers; peeling a resulting substrate/electrode/PVDF/electrode/substrate device from the support substrate; and placing a drop of silver paste in the hole formed in the first substrate layer.

A method for manufacturing a piezoelectric element for generating electricity upon flexing of the element including the steps spin-coating a first substrate layer onto a support substrate; depositing a first electrode film onto the first substrate layer; spin coating polyvinylidene fluoride (PVDF) containing solution on the first electrode film to result in a PVDF film; annealing the PVDF film; depositing a second electrode film onto the PVDF film; spin-coating a second substrate layer on top of the second electrode film; forming a hole through the first and second substrate layers; filling the hole with silver paste to contact to the first and second electrode layers; peeling a resulting substrate/electrode/PVDF/electrode/substrate device from the support substrate; and placing a drop of silver paste in the hole formed in the first substrate layer.

A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. A first patterned electrode is deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the first electrode and a planarized support layer is deposited over the sacrificial layer, which is then bonded to a substrate wafer. The crystalline substrate is removed and a second patterned electrode is deposited over a second surface of the film. The sacrificial layer is etched to release the air reflection cavity. Also, a cavity can instead be etched into the support layer prior to bonding with the substrate wafer. Alternatively, a reflector structure can be deposited on the first electrode, replacing the cavity.