An ultrasound probe includes: an ultrasound transducer that includes a piezoelectric element configured to transmit and receive ultrasound waves to and from a subject; and an adjustment layer that is laminated on the piezoelectric element, the adjustment layer being provided with a cut surface that is cut by a blade configured to cut the piezoelectric element, the adjustment layer including an adjustment material configured to improve cutting performance of the blade.

An ultrasound probe includes: an ultrasound transducer that includes a piezoelectric element configured to transmit and receive ultrasound waves to and from a subject; and an adjustment layer that is laminated on the piezoelectric element, the adjustment layer being provided with a cut surface that is cut by a blade configured to cut the piezoelectric element, the adjustment layer including an adjustment material configured to improve cutting performance of the blade.

Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electrically coupled to the ground pad. In this way, the transducer can work robustly and may be automatically mounted to an imaging probe.

Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electrically coupled to the ground pad. In this way, the transducer can work robustly and may be automatically mounted to an imaging probe.

A method of manufacturing a power generation element includes a first step of disposing a support unit that supports a vibration unit in one end portion of the vibration unit in one direction, and disposing a weight unit in the other end portion of the vibration unit in the one direction in a substrate including the vibration unit capable of vibrating, a second step of disposing a piezoelectric unit that generates power due to vibration in a portion of the vibration unit on an opposite side from the support unit side in a thickness direction of the substrate after the support unit and the weight unit are disposed in the vibration unit, and a third step of extracting a power generation element from the substrate by cutting an outer edge of the vibration unit in the thickness direction of the substrate after the piezoelectric unit is disposed in the vibration unit.

A method of manufacturing a power generation element includes a first step of disposing a support unit that supports a vibration unit in one end portion of the vibration unit in one direction, and disposing a weight unit in the other end portion of the vibration unit in the one direction in a substrate including the vibration unit capable of vibrating, a second step of disposing a piezoelectric unit that generates power due to vibration in a portion of the vibration unit on an opposite side from the support unit side in a thickness direction of the substrate after the support unit and the weight unit are disposed in the vibration unit, and a third step of extracting a power generation element from the substrate by cutting an outer edge of the vibration unit in the thickness direction of the substrate after the piezoelectric unit is disposed in the vibration unit.

Disclosed are an ultrasonic probe and a method of manufacturing the same. The ultrasonic probe includes a piezoelectric layer including one or more kerfs such that piezoelectric elements are provided in a plurality of rows along an elevation direction, a first electrode formed on an upper side of the piezoelectric layer, a second electrode formed on a lower side of the piezoelectric layer, a matching layer disposed above the piezoelectric layer and including one or more grooves connected to the one or more kerfs, and a third electrode formed in inner surfaces of the one or more grooves and electrically connected to the first electrode.

Disclosed are an ultrasonic probe and a method of manufacturing the same. The ultrasonic probe includes a piezoelectric layer including one or more kerfs such that piezoelectric elements are provided in a plurality of rows along an elevation direction, a first electrode formed on an upper side of the piezoelectric layer, a second electrode formed on a lower side of the piezoelectric layer, a matching layer disposed above the piezoelectric layer and including one or more grooves connected to the one or more kerfs, and a third electrode formed in inner surfaces of the one or more grooves and electrically connected to the first electrode.

An oscillator frequency modulation method includes: providing a piezoelectric material having a surface and an interior; and performing a pattern process on the piezoelectric material by a laser. A patterned processing zone is formed on the surface and/or in the interior of the piezoelectric material. The pattern process may be a material removal and/or a material modification. Therefore, without changing the appearance of the piezoelectric material, the pattern process on the piezoelectric material through the laser can accurately adjust the frequency of the oscillator and block unnecessary mode at the same time. An oscillator piezoelectric structure with frequency modulation is also provided.

A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member, the mounting member having a space between the first circuit member and the second circuit member; a step of preparing a laminate sheet including a first thermal-conductive layer and a second thermal-conductive layer, the first thermal-conductive layer disposed at least on one outermost side; a disposing step of disposing the laminate sheet on the mounting member such that the first thermal-conductive layer faces the second circuit members; and a sealing step of pressing the laminate sheet against the first circuit member and heating the laminate sheet, to seal the second circuit members so as to maintain the space, and to cure the laminate sheet. The first thermal-conductive layer after curing has a coefficient of thermal conductivity in a thickness direction at room temperature being equal to or greater than that in a principal surface direction, and the second thermal-conductive layer after curing has a coefficient of thermal conductivity in a principal surface direction at room temperature being greater than that in a thickness direction.