H10N30/2042

ELECTRODE STRUCTURES FOR MICRO-VALVES FOR USE IN JETTING ASSEMBLIES

A micro-valve includes an orifice plate including an orifice. The micro-valve further includes an actuating beam having a first end and a second end. The actuating beam also includes a base layer and a layer of piezoelectric material disposed on the base layer, a bottom electrode layer, and a top electrode layer. At an electrical connection portion of the actuating beam, the layer of piezoelectric material includes a first via, and a portion of the top electrode layer disposed within the first via, and a portion of the bottom electrode disposed beneath the first via. The actuating beam includes a base portion extending from the electrical connection portion and a cantilevered portion extending from the base portion. The cantilevered portion is movable in response to application of a differential electrical signal between the bottom electrode layer and the top electrode layer to one of open or close the micro-valve.

GREEN ENERGY HARVESTING METHODS FOR NOVEL CLASS OF BATTERIES AND POWER SUPPLIES
20220223781 · 2022-07-14 ·

An energy harvesting device for powering electronic devices such as wireless sensors and IoT devices is described. The device relies on nature's fundamental forces to convert kinetic energy to electrical energy, acting as power source; while accounting for the Casimir force. Nanotechnology and MEMS are used to fabricate the device embedding a mechanical oscillator, electronic circuitry, energy harvester, and transducer integrated in the same packaging. The device supports mechanism to excite and ignite the oscillatory behavior via RF signal from a remote signal source that synthesizes the RF signal on a fix or mobile platform. Additionally, solar and RF signals may be added constructively to boost the output power of the device. The device scales from micron size to blades and racks formed from arrays of the connected devices to increase the output power of the aggregate system to any desired level for powering home appliances or computer networks.

Multi-layer piezoelectric ceramic component and piezoelectric device

A multi-layer piezoelectric ceramic component includes: a piezoelectric ceramic body having a cuboid shape, having upper and lower surfaces facing in a thickness direction, first and second end surfaces facing in a length direction, and a pair of side surfaces facing in a width direction, and including first and second regions; first internal electrodes in the first region; second internal electrodes in the second region; third internal electrodes in the first and second regions; a first terminal electrode formed on the first end surface and electrically connected to the first internal electrodes; a second terminal electrode formed on the first end surface and electrically connected to the second internal electrodes; a third terminal electrode formed on the second end surface and electrically connected to the third internal electrodes; a first surface electrode formed on the upper surface; and a second surface electrode formed on the lower surface.

PIEZOELECTRIC DEVICE

In a piezoelectric device, a cantilever portion includes a fixed edge portion and a free edge portion. A plate-shaped portion includes a facing edge portion, a support edge portion, a first lateral support edge portion, and a second lateral support edge portion. The facing edge portion faces the free edge portion. The support edge portion is on an opposite side from the facing edge portion in an extension direction of the cantilever portion. The plate-shaped portion is connected to an inner surface at at least a portion of the support edge portion, at least a portion of the first lateral support edge portion, and at least a portion of the second lateral support edge portion.

PIEZOELECTRIC DEVICE

A piezoelectric device includes a beam portion with a fixed end portion and a free end portion opposite to the fixed end portion. The beam portion extends from the fixed end portion towards the free end portion. The beam portion includes a multilayer body including a piezoelectric layer and first and second electrode layers. A base is connected with the fixed end portion of the beam portion. As viewed from a layering direction of the multilayer body, the base surrounds the beam portion at an interval from the beam portion except for the fixed end portion. As viewed from the layering direction, an average of a dimension of a width of the beam portion in an orthogonal or substantially orthogonal direction to an extension direction of the beam portion is greater than a maximal dimension of a length thereof in the extension direction.

TECHNOLOGIES FOR MICROELECTROMECHANICAL SYSTEMS WITH COMPOSABLE PIEZOELECTRIC ACTUATORS
20220254982 · 2022-08-11 ·

In at least one illustrative embodiment, a microelectromechanical system (MEMS) includes a composable piezoelectric actuator electrically coupled to a terminal. In response to a voltage applied across electrodes of the actuator, a piezoelectric rod moves from an initial position to a displaced position. In an embodiment, the MEMS includes two terminals, a resistive element is coupled between the terminals, and when in the displaced position the rod contacts one of the terminals. In an embodiment, the MEMS includes three terminals, and when a threshold voltage is applied to one of the terminals, the rod moves to the displaced position and allows current to flow between the other two terminals. In an embodiment, the MEMS includes a primary set of actuators that are mechanically but not electrically connected to a secondary set of actuators. An output terminal is coupled to the second set of actuators. Other embodiments are described and claimed.

MOUNTING AND USE OF PIEZOELECTRIC COOLING SYSTEMS IN DEVICES

A cooling system including a heat spreader, an active cooling element, and a base is described. The heat spreader is in thermal communication with a heat-generating structure mounted on a substrate. The heat spreader over hangs the heat-generating structure. The active cooling element is in thermal communication with the heat spreader. The base supports the heat spreader and transfers a load from the heat spreader to the substrate such that a bending of the heat spreader does not exceed ten degrees.

Centrally anchored MEMS-based active cooling systems

A cooling system is described. The cooling system includes a cooling element having a central region and a perimeter. The cooling element is anchored at the central region. At least a portion of the perimeter is unpinned. The cooling element is in communication with a fluid. The cooling element is actuated to induce vibrational motion to drive the fluid toward a heat-generating structure.

Multi-layer piezoelectric ceramic component-mounted piezoelectric device

A multi-layer piezoelectric ceramic component includes: a piezoelectric ceramic body having a cuboid shape, having upper and lower surfaces facing in a thickness direction, first and second end surfaces facing in a length direction, and a pair of side surfaces facing in a width direction, and including first and second regions; first internal electrodes in the first region; second internal electrodes in the second region; third internal electrodes in the first and second regions; a first terminal electrode formed on the first end surface and electrically connected to the first internal electrodes; a second terminal electrode formed on the first end surface and electrically connected to the second internal electrodes; and a third terminal electrode formed on the second end surface and electrically connected to the third internal electrodes, the first, second, and third internal electrodes each having a width equal to a distance between the pair of side surfaces.

Microelectronic assemblies having substrate-integrated perovskite layers

Disclosed herein are microelectronic assemblies with integrated perovskite layers, and related devices and methods. For example, in some embodiments, a microelectronic assembly may include an organic package substrate portion having a surface with a conductive layer, and a perovskite conductive layer on the conductive layer. In some embodiments, a microelectronic assembly may include an organic package substrate portion having a surface with a conductive layer, a perovskite conductive layer having a first crystalline structure on the conductive layer, and a perovskite dielectric layer having a second crystalline structure on the perovskite conductive layer. In some embodiments, the first and second crystalline structures have a same orientation.