Aspects of the embodiments are directed to systems and devices that include a piezo-electric element comprising a top-side electrode and a bottom-side electrode; a metal contact pad electrically connected to the bottom-side electrode; an electrode electrically connected to the top-side electrode; and an encasement encasing the piezo-electric element. The piezo-electric element can be prepared to include steps and metallization for use in one or more types of packaging.

A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The piezoelectric-material film includes a size larger than the upper electrode film, a riser end-surface and step-surface formed on a top-surface of the upper electrode film side. The riser end-surface connects smoothly with a peripheral end-surface of the upper electrode film and vertically intersects with the top-surface. The step-surface intersects vertically with the riser end-surface. The lower piezoelectric-material protective-film, and the upper piezoelectric-material protective-film are formed with alloy material including Fe as main ingredient and having Co and Mo, by Ion beam deposition.

An acoustic wave device includes a piezoelectric layer and first and second electrodes facing each other in a direction crossing a thickness direction of the piezoelectric layer. The acoustic wave device utilizes a bulk wave of a thickness slip first-order mode. The acoustic wave device includes first and second resonators. Each of the first and second resonators includes the first and second electrodes, and a setting portion including a setup region where the first and second electrodes are provided in the piezoelectric layer. The thickness of each of the first and second resonators excludes the thickness of the first and second electrodes included in the resonator. The thickness of the first resonator is different from the thickness of the second resonator.

An acoustic wave device includes a piezoelectric layer and first and second electrodes facing each other in a direction crossing a thickness direction of the piezoelectric layer. The acoustic wave device utilizes a bulk wave of a thickness slip first-order mode. The acoustic wave device includes first and second resonators. Each of the first and second resonators includes the first and second electrodes, and a setting portion including a setup region where the first and second electrodes are provided in the piezoelectric layer. The thickness of each of the first and second resonators excludes the thickness of the first and second electrodes included in the resonator. The thickness of the first resonator is different from the thickness of the second resonator.

The purpose of the present invention is to form a semiconductor device in which an active area laminated on a PZT (lead zirconate titanate (PbZrTiO.sub.3) sensor having a piezoelectric effect. The main structure of the present invention is as follows. A semiconductor device having a PZT (lead zirconate titanate (PbZrTiO.sub.3)) sensor including: the PZT sensor including a lower electrode formed on a glass substrate, a PZT, an upper electrode, a first inorganic insulating film covering the upper electrode, and an upper wiring formed on the first inorganic insulating film and connected to the upper electrode through a first through-hole formed in the first inorganic insulating film; in which a polyimide film is formed over the PZT sensor; a plurality of TFTs are formed on the polyimide film, and a thickness of the polyimide film is 5 μm or more.

Provided is a piezoelectric film capable of realizing an electroacoustic conversion film or the like in which the durability is high and a sufficient sound pressure with respect to an input operating voltage is obtained. The piezoelectric film is a piezoelectric film including a polymer-based piezoelectric composite material which contains piezoelectric particles in a matrix containing a polymer material, and electrode layers which are provided on both surfaces of the polymer-based piezoelectric composite material, in which in a case where a cross section of the piezoelectric film in a thickness direction is observed with a scanning electron microscope, the polymer-based piezoelectric composite material is divided into two equal regions in the thickness direction, and void volumes of the two regions are measured, a ratio of the void volume obtained by dividing the void volume of the region with a larger void volume by the void volume of the region with a smaller void volume is 1.2 or greater.

There is provided piezoelectric actuator including: vibration plate; first and second piezoelectric layers; a plurality of individual electrodes arranged on actuator surface, of the second piezoelectric layer, on first side in first direction of the second piezoelectric layer; first and second common electrodes; first surface electrode arranged on the actuator surface at an end portion in second direction orthogonal to the first direction; second surface electrode arranged on the actuator surface; and non-conductive electrodes arranged at end portions in the second direction of at least two of the actuator surface, and the first and second boundary surfaces, and which are not in conduction with any of the individual electrodes, and the first and second common electrodes. The non-conductive electrodes are arranged at least in an area of an end portion in the second direction of a stack of the vibration plate, and the first and second piezoelectric layers.

An audio device includes a vibration member, and a first piezoelectric vibrator and a second piezoelectric vibrator that are provided on the vibration member. A natural frequency of the first piezoelectric vibrator is larger than a natural frequency of the second piezoelectric vibrator.

The present invention provides for a modified virus, such as a recombinant M13 phage, which in an array, such as a film, is capable of producing piezoelectricity. The modified virus comprises a coat protein can displays a negatively charged amino acid sequence. The present invention provides for a device comprising a piezoelectric element comprising a suitable virus, such as the modified virus, a first surface and a second surface, wherein the first surface is in contact with a first electrode and the second surface is in contact with a second electrode, wherein when pressure is applied to the film, the film is capable of generating an electric current. The present invention provides for a method of making the device, and a method for generating electricity using the device.

An aerosol delivery device includes a power source and an aerosol production component that is powerable to produce an aerosol from an aerosol precursor composition. The aerosol delivery device also includes processing circuitry configured to switchably connect the power source to a load that includes the aerosol production component and thereby power the aerosol production component. A piezo sensor is operatively coupled with the power source and the processing circuitry. The piezo sensor is configured to generate an electrical response to a deformation of the power source, and the electrical response is indicative of a characteristic of the deformation. The processing circuitry is configured to control the aerosol delivery device based at least in part on the characteristic of the deformation indicated by the electrical response.