A piezoelectric element body has a first principal surface and a second principal surface. A pair of first electrodes is disposed on the first principal surface. The vibrating body includes a metal plate, an insulating layer, and a pair of second electrodes. The metal plate has a third principal surface and a fourth principal surface. The insulating layer is disposed on the third principal surface. The pair of second electrodes is disposed on the insulating layer. The piezoelectric element and the vibrating body are disposed in such a manner that the first principal surface and the third principal surface oppose each other via the insulating layer. The pair of second electrodes physically contacts the respective first electrodes. The second electrodes are exposed from the piezoelectric element and are separated from all of edges of the insulating layer, when viewed from a direction orthogonal to the third principal surface.

An ultrasonic module and a manufacturing method for ultrasonic module are provided. The ultrasonic module includes a substrate, a composite layer, and a covering layer. The substrate has an upper surface. The composite layer has a top surface, a bottom surface, and a recessed surface recessed toward the bottom surface. The bottom surface is on the upper surface of the substrate. One or more space is formed between the recessed surface and the upper surface. The composite layer has one or more first groove extending from the top surface toward the recessed surface. The first groove separates the composite layer into a circuit structure and an ultrasonic structure connected to the circuit structure. The covering layer is assembled on the top surface of the composite layer.

Various embodiments of the present disclosure are directed towards a method for forming a piezoelectric device including a piezoelectric membrane and a plurality of conductive layers. The method includes forming the plurality of conductive layers in the piezoelectric membrane, the plurality of conductive layers are vertically offset one another. A masking layer is formed over the piezoelectric membrane. An etch process is performed according to the masking layer to concurrently expose an upper surface of each conductive layer in the plurality of conductive layers. A plurality of conductive vias are formed over the upper surface of the plurality of conductive layers.

A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The piezoelectric-material film includes a size larger than the upper electrode film, a riser end-surface and step-surface formed on a top-surface of the upper electrode film side. The riser end-surface connects smoothly with a peripheral end-surface of the upper electrode film and vertically intersects with the top-surface. The step-surface intersects vertically with the riser end-surface. The lower piezoelectric-material protective-film, and the upper piezoelectric-material protective-film are formed with alloy material including Fe as main ingredient and having Co and Mo, by Ion beam deposition.

Aspects of the embodiments are directed to systems and devices that include a piezo-electric element comprising a top-side electrode and a bottom-side electrode; a metal contact pad electrically connected to the bottom-side electrode; an electrode electrically connected to the top-side electrode; and an encasement encasing the piezo-electric element. The piezo-electric element can be prepared to include steps and metallization for use in one or more types of packaging.

A piezoelectric element includes a piezoelectric body, an electrode layer, and a reinforcing layer. The piezoelectric body has a first main surface, a second main surface, and a side surface. The first main surface and the second main surface oppose each other. The side surface extends in an opposing direction in which the first main surface and the second main surface oppose each other in such a way as to connect the first main surface and the second main surface. The electrode layer is provided in the piezoelectric body. The reinforcing layer is provided on the first main surface. The electrode layer is provided opposing the first main surface and apart from the side surface. When viewed from the opposing direction, the electrode layer has a corner. When viewed from the opposing direction, the reinforcing layer overlaps the corner.

Provided is a piezoelectric film capable of realizing an electroacoustic conversion film or the like in which the durability is high and a sufficient sound pressure with respect to an input operating voltage is obtained. The piezoelectric film is a piezoelectric film including a polymer-based piezoelectric composite material which contains piezoelectric particles in a matrix containing a polymer material, and electrode layers which are provided on both surfaces of the polymer-based piezoelectric composite material, in which in a case where a cross section of the piezoelectric film in a thickness direction is observed with a scanning electron microscope, the polymer-based piezoelectric composite material is divided into two equal regions in the thickness direction, and void volumes of the two regions are measured, a ratio of the void volume obtained by dividing the void volume of the region with a larger void volume by the void volume of the region with a smaller void volume is 1.2 or greater.

An aerosol delivery device includes a power source and an aerosol production component that is powerable to produce an aerosol from an aerosol precursor composition. The aerosol delivery device also includes processing circuitry configured to switchably connect the power source to a load that includes the aerosol production component and thereby power the aerosol production component. A piezo sensor is operatively coupled with the power source and the processing circuitry. The piezo sensor is configured to generate an electrical response to a deformation of the power source, and the electrical response is indicative of a characteristic of the deformation. The processing circuitry is configured to control the aerosol delivery device based at least in part on the characteristic of the deformation indicated by the electrical response.

A dielectric transducer for use in a sensor, actuator or generator comprising a plurality of layers of transducer foils, wherein an electrically contactable and conductive layer forming an electrode layer is applied to at least one side of each transducer foil. Expediently, at least two contact elements are provided, each of which is arranged at least partially in a recess or in a through-channel and extends over at least one layer of transducer foils, adjacent electrode layers being electrically conductively connected to different contact elements. Since adjacent electrode layers are connected to different contact elements, intended use is possible, and bringing together several contact lines is advantageously not necessary. Furthermore, the invention relates to a method for producing a multilayer dielectric transducer for use in a sensor, an actuator or a generator, as well as an actuator, a sensor or a generator.

Fingerprint identification modules, methods for forming the fingerprint identification modules and electronic devices are provided. The method may include providing a substrate, containing a signal process circuit formed therein; providing a carrier substrate; forming one or more piezoelectric transducers on the carrier substrate, wherein a piezoelectric transducer of the one or more piezoelectric transducers includes a first electrode, a piezoelectric layer on the first electrode and a second electrode on the piezoelectric layer; forming a permanent bonding layer, containing one or more cavities, on one of the carrier substrate and the substrate; bonding the carrier substrate with the substrate using the permanent bonding layer, wherein the permanent bonding layer is between the one or more piezoelectric transducers and the substrate, and each piezoelectric transducer covers one cavity; and removing the carrier substrate.