This invention provides a substrate for a superconducting wire used for manufacturing a superconducting wire with excellent superconductivity and a method for manufacturing the same. Such substrate for a superconducting wire has crystal orientation of metals on the outermost layer, such as a c-axis orientation rate of 99% or higher and a of 6 degrees or less, and a percentage of an area in which the crystal orientation is deviated by 6 degrees or more from the (001) [100] per unit area is 6% or less.

A superconducting wire rod according to an aspect of the present disclosure is a superconducting wire rod having a flat cross-sectional shape which is characterized in that a voltage is generated with a lower current density or a higher voltage is generated with the same current density in a region on at least one end side in a wire rod width direction as compared with a region other than the region on the at least one end side.

It is an object to provide a method for producing a substrate for epitaxial growth having a higher degree of biaxial crystal orientation without forming an irregular part a3. The method for producing a substrate for epitaxial growth comprising a step of laminating a metal base material and a copper layer having an fcc rolling texture by surface-activated bonding, a step of applying mechanical polishing to the copper layer, and a step of carrying out orientation heat treatment of the copper layer, wherein the copper layer is laminated in such a way that, when ratios of the (200) plane of the copper layer before laminated and of the copper layer after laminated when measured by XRD are I0.sub.Cu and I0.sub.CLAD, respectively and ratios of the (220) plane of the copper layer before laminated and of the copper layer after laminated are I2.sub.Cu and I2.sub.CLAD, respectively, I0.sub.Cu<20%, I2.sub.Cu=70 to 90%, and I0.sub.CLAD<20%, I2.sub.CLAD=70 to 90% and I0.sub.CLAD?I0.sub.Cu<13%.

A superconductive wire conductor is produced by: embedding a plurality of deposition substrates formed to have a predetermined size in parallel with each other to a connection base material to connect and integrate therewith; depositing an intermediate layer, a superconductive layer and a protective layer on a deposition surface side of the deposition substrate; and winding a single or multiple integrated superconductive conductors around a desired core material, separating each single superconductive wire from the integrated superconductive conductor and winding each superconductive wire around the core material or winding the integrated or separated wire alternately, whereby a superconductive conductor having a good superconductive characteristic without a problem regarding a shape thereof such as local protrusions.

An objective of the present invention is to provide a copper substrate for epitaxial growth, which has higher biaxial crystal orientation, and a method for manufacturing the same. The substrate for epitaxial growth of the present invention contains a biaxially crystal-oriented copper layer, wherein the full width at half maximum of a peak based on the pole figure of the copper layer is within 5 and the tail width of the peak based on the pole figure is within 15 Such a substrate for epitaxial growth is manufactured by a 1.sup.st step of performing heat treatment of a copper layer so that is within 6 and the tail width is within 25, and after the 1.sup.st step, a 2.sup.nd step of performing heat treatment of the copper layer at a temperature higher than the temperature for heat treatment in the 1.sup.st step, so that is within 5 and the tail width is within 15.

Reinforced materials for high temperature superconducting tape. More specifically reinforcement materials for significantly reducing the amount of required reinforcement and attaining much higher stress tolerances at practical conductor dimensions are described herein.

A method for preparing element diffusion-type composite substrate and it belongs to the field of high-temperature coated superconductor substrate preparation. The rolled composite nickel-tungsten alloy substrate is heated and thermally insulated, meanwhile, both ends of the rolled substrate are applied with a low voltage and high current density pulse current. High-performance nickel-tungsten alloy composite substrate is obtained with the method in the present invention and the sandwich-like composite substrate has low ferromagnetism and high strength due to higher solute diffusion from inner layer to outer layer, yet which does not affect the formation of sharp cubic texture on the surface of the composite substrate. On the one hand, the adoption of electric pulse technology accelerates the interdiffusion effect of inter-layer elements, on the other hand, it promotes the recrystallization nucleation and reduces the recrystallization annealing temperature of the composite substrate, thus energy saving effect is achieved and the negative effects of annealing thermal erosion grooves among crystal boundary to subsequent coating are effectively reduced. Alloy composite substrate prepared in this invention has the characteristics of high cubic texture content, low magnetism, high strength, and can be applied to large-scale industrial production.

A superconducting thin film having excellent critical current characteristics is provided. A substrate for a superconducting thin film includes a substrate body (10A) having a main surface (10B) in which the root mean square slope Rq of a roughness curve is 0.4 or less.

A method for manufacturing a superconducting wire includes the following steps. A laminate metal having a first metal layer and a Ni layer formed on the first metal layer is prepared. An intermediate layer (20) is formed on the Ni layer of the laminate metal. A superconducting layer (30) is formed on the intermediate layer (20). By subjecting the laminate metal to a heat treatment after at least either of the step of forming a intermediate layer (20) and the step of forming a superconducting layer (30), a nonmagnetic Ni alloy layer (12) is formed from the laminate metal.

A method of rolling NiW alloy tapes for coated conductors belongs to the technical field of metal materials rolling. According to the method, a cylindrical NiW alloy ingot with a diameter not less than 10 mm is used to be rolled back and forth along the axial direction as a rolling direction, wherein the content of W is 57 at. %, and the axis of this ingot is perpendicular to the plane where the axes of working rollers are located. During rolling process, the cross sectional area reduction of the ingot is retained at 5% per pass. When the total cross sectional area reduction of the ingot is larger than 98% and the thickness of the tape is down to 60100 m, the rolling is stopped, and thus the NiW alloy tape is obtained. The method has the advantages that the negative influence generated when the NiW alloy tape is produced from a cuboid initial NiW alloy ingot can be reduced as much as possible, the yield of the NiW alloy tapes is increased, as well as relatively ideal effects can be obtained in terms of the surface biaxial texture, the length and the axial quality.