A method of fabricating resistors in igniter is provided. The method includes punching an alloy material to obtain a plurality of alloy components. The alloy components are disposed on a substrate, and electrodes are disposed on the substrate. Resistors in igniter are obtained by disposing electrodes on the substrate such that two electrically connecting regions of each alloy component are physically contacting and electrically connecting to the electrodes, respectively. The resulting resistors in igniter have uniform size and stable shape hence showing great ignition performance.

A chip resistor component, includes: a substrate having one surface, and one side surface and the other side surface facing each other in one direction; an terminal including an internal electrode disposed on the one surface, and an external electrode disposed on the one side surface to be connected to the internal electrode; a resistive layer disposed on the one surface, and including an outermost pattern connected to the internal electrode; and a protective layer disposed on the one surface to cover the resistive layer. The outermost pattern of the resistive layer has a first region in contact with the internal electrode and a second region extending, in the one direction, from the first region towards the other side surface. A ratio of a length of the second region in the one direction to a length of the chip resistor component in the one direction is 0.02 or more.

A conductive paste comprising a conductive powder, a glass frit substantially free of lead, and an organic vehicle, wherein the glass frit contains 25 to 50 mol % B in terms of B.sub.2O.sub.3, 25 to 50 mol % Si in terms of SiO.sub.2, 7 to 23 mol % Al in terms of Al.sub.2O.sub.3, 2 to 15 mol % Mg in terms of MgO, 2 to 5 mol % Ba in terms of BaO, one or two selected from the group consisting of 3 to 18 mol % Zn in terms of ZnO, and 3 to 8 mol % Ti in terms of TiO.sub.2, based on the total number of moles in terms of the above oxides. According to the present invention, it is possible to provide a lead-free conductive paste having excellent resistance to dissolution in solder and acid resistance as well as being capable of forming fired films having excellent adherence and adhesion to a substrate.

An NTC compound, a thermistor and a method for producing a thermistor are disclosed. In an embodiment an NTC compound includes a ceramic material of a Mn—Ni—O system as a main constituent, wherein the Mn—Ni—O system has a general composition Ni.sub.xMn.sub.2O.sub.4-δ, wherein y corresponds to a molar fraction of Ni of a total metal content of the ceramic material of the Mn—Ni—O system, which is defined as c(Ni):(c(Ni)+c(Mn)), and wherein the following applies: 0.500<x<0.610 and 0.197<y<0.240.

A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250° C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. Blending the dielectric material with the carbon-based ink causes the modified carbon-based ink to have a resistivity that is at least double a resistivity of the carbon-based ink.

A conductive nanocomposite which contains a mixed polymer matrix which contains a rubber and a polyether, carbon nanoparticles, and transition metal nanoparticles. The conductive nanocomposite has a nonlinear relationship between resistivity and temperature characterized by an exponential increase reaching a peak resistivity followed by an exponential decrease as temperature increases. Also disclosed is a method of forming the conductive nanocomposite involving mixing the components, aging, and pressing. The conductive nanocomposite forms a component of a heater that is self-regulating as a result of the nonlinear relationship between resistivity and temperature of the conductive nanocomposite. The nanocomposite also forms a component of a thermistor.

A PPTC device is provided. The PPTC device may include a first electrode and a second electrode, disposed opposite the first electrode. The PPTC device may include a PPTC layer, disposed between the first electrode and the second electrode, the PPTC layer comprising a polymer matrix formed from a thermoplastic polyurethane (TPU) material.

A ceramic member comprising a compound oxide of La, E and Mn, wherein AE is (i) Ca, or (ii) contains Ca and at least one of Sr and Ba with a total amount of Sr and Ba to a total of Ca, Sr and Ba of not more than 5 mol %, and a crystal system in a surface of the ceramic member is a monoclinic system.

A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250 C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. Blending the dielectric material with the carbon-based ink causes the modified carbon-based ink to have a resistivity that is at least double a resistivity of the carbon-based ink.

A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250 C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. An amount of the dielectric material blended with the carbon-based ink does not exceed about 15% by weight of the modified carbon-based ink. The modified carbon-based ink has a resistivity that is at least double a resistivity of the carbon-based ink. The thick film resistor may be configured to handle up to about 200 mA of current without fusing and/or handle up to about 1.0 W of power without fusing.