The present invention is to provide a plurality of unit coil portions formed by winding one conductive wire about a winding axis is placed side by side in the winding axis direction, each of the unit coil portions is formed by unit wound portions having different inner circumferential lengths from each other, the unit coil portion is multi-layered in at least a part thereof by pushing at least a part of the unit wound portion having a small inner circumferential length inside the unit wound portion having a large inner circumferential length, and the unit wound portion is wound along a loop shape winding route having a plurality of arc shape corner parts. In unit wound portions forming the unit coil portion, corner parts formed at the same phase angle with respect to the winding axis are formed in an arc shape having curvature center at the same position.

An apparatus for manufacturing an electronic component includes a grip unit configured to grip an electronic member having a plurality of projections arranged thereon, a connected coil assembly forming unit configured to form a connected coil assembly in which a plurality of single coils are connected to one another, and a coil mounting unit configured to sequentially mount the plurality of single coils of the connected coil assembly on the plurality of projections.

An apparatus for manufacturing an electronic component includes a grip unit configured to grip an electronic member having a plurality of projections arranged thereon, a connected coil assembly forming unit configured to form a connected coil assembly in which a plurality of single coils are connected to one another, and a coil mounting unit configured to sequentially mount the plurality of single coils of the connected coil assembly on the plurality of projections.

One object of the present invention is to provide a coil element having a reduced thickness but is less prone to be broken. The coil element according to an embodiment of the present invention has a rectangular parallelepiped shape and has a principal surface including long sides and short sides. The coil element includes a drum core, a winding wound around the drum core, a first external electrode electrically connected to one end of the winding, and a second external electrode electrically connected to the other end of the winding. The drum core in the embodiment includes a first flange, a second flange, and a winding core connecting between the first flange and the second flange. The winding core extends along the short sides of the principal surface.

One object of the present invention is to provide a coil element having a reduced thickness but is less prone to be broken. The coil element according to an embodiment of the present invention has a rectangular parallelepiped shape and has a principal surface including long sides and short sides. The coil element includes a drum core, a winding wound around the drum core, a first external electrode electrically connected to one end of the winding, and a second external electrode electrically connected to the other end of the winding. The drum core in the embodiment includes a first flange, a second flange, and a winding core connecting between the first flange and the second flange. The winding core extends along the short sides of the principal surface.

A method of producing inductive sensors, including LVDTs and inductive encoders, manufactured by plotting fine wire onto a planar substrate. A sensor is constructed using a computer-controlled machine to place wire onto a planar adhesive substrate. This substrate forms a predictable and uniform surface to deposit each turn of wire, and so the placement accuracy is considerably better than conventional coil winding. This planar substrate can then be manipulated into a desired three-dimensional shape (e.g., by folding, rolling, corrugating, winding, etc.), carrying the wire along with it. In particular, the same CNC machine used to place the wire can be used to cut, crease, score, or otherwise pattern the substrate to facilitate the three-dimensional arrangement.

A method of producing inductive sensors, including LVDTs and inductive encoders, manufactured by plotting fine wire onto a planar substrate. A sensor is constructed using a computer-controlled machine to place wire onto a planar adhesive substrate. This substrate forms a predictable and uniform surface to deposit each turn of wire, and so the placement accuracy is considerably better than conventional coil winding. This planar substrate can then be manipulated into a desired three-dimensional shape (e.g., by folding, rolling, corrugating, winding, etc.), carrying the wire along with it. In particular, the same CNC machine used to place the wire can be used to cut, crease, score, or otherwise pattern the substrate to facilitate the three-dimensional arrangement.

A conductor assembly and method for constructing an assembly of the type which, when conducting current, generates a magnetic field or which, in the presence of a changing magnetic field, induces a voltage. In one embodiment the method provides a first insulative layer tubular in shape and including a surface along which a conductor segment may be positioned. A channel formed in the surface of the insulative layer defines a first conductor path and includes a surface of first contour in cross section along a first plane transverse to the conductor path. A segment of conductor having a surface of second contour in cross section is positioned at least partly in the channel and extends along the conductor path. Along the first plane, contact between the conductor surface of second contour and the channel surface of first contour includes at least two separate regions of contact.

A conductor assembly and method for constructing an assembly of the type which, when conducting current, generates a magnetic field or which, in the presence of a changing magnetic field, induces a voltage. In one embodiment the method provides a first insulative layer tubular in shape and including a surface along which a conductor segment may be positioned. A channel formed in the surface of the insulative layer defines a first conductor path and includes a surface of first contour in cross section along a first plane transverse to the conductor path. A segment of conductor having a surface of second contour in cross section is positioned at least partly in the channel and extends along the conductor path. Along the first plane, contact between the conductor surface of second contour and the channel surface of first contour includes at least two separate regions of contact.

An apparatus for manufacturing an electronic component includes a grip unit configured to grip an electronic member having a plurality of projections arranged thereon, a connected coil assembly forming unit configured to form a connected coil assembly in which a plurality of single coils are connected to one another, and a coil mounting unit configured to sequentially mount the plurality of single coils of the connected coil assembly on the plurality of projections.