A fuse housing assembly and a fuse kit are provided. The fuse housing assembly and the fuse kit are configured to allow for fuses having terminals of different sizes to be mounted onto a circuit board. The fuse housing assembly and the fuse kit include a spacer configured to protect the exposed portions of the fuse terminals from the environment and prevent the proximal ends of the fuse terminals from breaking the fuse elements. Further, the spacer retains the fuse body of the respective fuses and the fuse terminals in a fixed position relative to each other so as to prevent the fuse terminals from being bent.

A novel temperature-triggered fuse device is configured to be activated at a designer-specified ambient temperature by utilizing wetting force among a pair of wetting material bays and a solder bridge or a solder ball. The solder bridge or the solder ball is typically positioned on top of the pair of wetting material bays separated by an electrically-insulated gap. Preferably, the wetting material bays are at least partly made of gold, nickel, or other elements suitable for generating an increased wetting force to the solder bridge or the solder ball upon increases in ambient temperature. The novel temperature-triggered fuse device can be integrated into various types of integrated circuits (IC's), or can function as a discrete fuse connected to one or more electronic components for robust protection from power surges and/or thermal runaway-related device malfunctions, meltdowns, or explosions. Various methods of producing the temperature-triggered fuse device are also disclosed herein.

Provided is a chip fuse and a method for producing the same, which is improved to facilitate balanced release of impact and vapor generated upon fusion. The chip fuse includes a fuse body having a pair of facing upper and lower ceramic substrates, a fuse wire support having a vertical through hole in its center and held between the ceramic substrates, and a fuse wire mounted between the two ends of the fuse wire support across the through hole, and a pair of metal caps fitted on the two ends of the fuse body, wherein the upper ceramic substrate and the fuse wire support, and the lower ceramic substrate and the fuse wire support, are respectively adhered together on their mutually facing surfaces to hermetically close the through hole, partially leaving a non-adhered region on the adhered surfaces.

Provided is a fuse device used for high rating and high current applications excellent in impact resistance at the time of current interruption, and capable of preventing falling off of the case. The fuse device includes: a base member; a cover member fitted to the base member and covering a surface of the base member; and a fuse element mounted on the surface of the base member; wherein one of the base member and the cover member is provided with a side wall intersecting with the plane of the surface of the base member and including an opening formed therein, and the other of the base member and the cover member is provided with a fitting projection projecting outward from a plane intersecting with the plane of the surface of the base member and fitted into the opening of the side wall.

A safety device comprises a first heat dissipation part, a second heat dissipation part and a connecting part. The connecting part is arranged between the first heat dissipation part and the second heat dissipation part, and at least one heat locking hole disposed thereon. The heat locking hole of the connecting part can reduce a diffusion speed of heat of the connecting part, so that the heat is concentrated between the first heat locking hole and the second heat locking hole, and thus the connecting part can be fused in time at a high temperature.

A sealed fuse in accordance with the present disclosure may include a tubular fuse body, a trench formed in an exterior of the fuse body, and an electrically conductive endcap that fits over an end of the fuse body and is fastened to the fuse body by an electrically conductive material having a lip portion that extends into the trench to provide a barrier that extends between the fuse body and the endcap. In an embodiment, the trench may be formed in an end face of the fuse body and may extend entirely around an opening in the end of the fuse body. In another embodiment, the trench may be formed in an outwardly-facing surface of a sidewall of the fuse body and may extend entirely around the fuse body.

A chip fuse includes a first terminal disposed on a first end of a fuse element array and a second terminal disposed on a second end of the fuse element array opposite the first end. The fuse element array includes multiple layers disposed in a stacked arrangement, each layer including a first terminal portion disposed within the first terminal, a second terminal portion disposed within the second terminal, a first fuse element portion orthogonal to and extending between the first terminal portion and the second terminal portion, and a second fuse element portion orthogonal to and extending between the first terminal portion and the second terminal portion. The first fuse element portion is adjacent the second fuse element portion.

A novel temperature-triggered fuse device is configured to be activated at a designer-specified ambient temperature by utilizing wetting force among a pair of wetting material bays and a solder bridge or a solder ball. The solder bridge or the solder ball is typically positioned on top of the pair of wetting material bays separated by an electrically-insulated gap. Preferably, the wetting material bays are at least partly made of gold, nickel, or other elements suitable for generating an increased wetting force to the solder bridge or the solder ball upon increases in ambient temperature. The novel temperature-triggered fuse device can be integrated into various types of integrated circuits (IC's), or can function as a discrete fuse connected to one or more electronic components for robust protection from power surges and/or thermal runaway-related device malfunctions, meltdowns, or explosions. Various methods of producing the temperature-triggered fuse device are also disclosed herein.

A protection element (10) of the present invention has a substrate (11), a first fuse element (12) and a second fuse element (13) connected in series on the substrate (11), a heater (14) connected between the first fuse element (12) and the second fuse element (13), a third upper electrode part (17) connected between the first fuse element (12) and the second fuse element (13) and connected to the heater (14) in series, a first conduction part (18) connected to the third upper electrode part (17) and having a lower resistance value than the heater (14), and a third lower electrode part (19) connected to the first conduction part (18) and configured to be connectable to an external protection circuit.

A novel temperature-triggered fuse device is configured to be activated at a designer-specified ambient temperature by utilizing wetting force among a pair of wetting material bays and a solder bridge or a solder ball. The solder bridge or the solder ball is typically positioned on top of the pair of wetting material bays separated by an electrically-insulated gap. Preferably, the wetting material bays are at least partly made of gold, nickel, or other elements suitable for generating an increased wetting force to the solder bridge or the solder ball upon increases in ambient temperature. The novel temperature-triggered fuse device can be integrated into various types of integrated circuits (IC's), or can function as a discrete fuse connected to one or more electronic components for robust protection from power surges and/or thermal runaway-related device malfunctions, meltdowns, or explosions. Various methods of producing the temperature-triggered fuse device are also disclosed herein.